WO2009078126A1 - Appareil de traitement de soudage sous vide - Google Patents

Appareil de traitement de soudage sous vide Download PDF

Info

Publication number
WO2009078126A1
WO2009078126A1 PCT/JP2008/003447 JP2008003447W WO2009078126A1 WO 2009078126 A1 WO2009078126 A1 WO 2009078126A1 JP 2008003447 W JP2008003447 W JP 2008003447W WO 2009078126 A1 WO2009078126 A1 WO 2009078126A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum chamber
welding
treatment apparatus
moving
vacuum
Prior art date
Application number
PCT/JP2008/003447
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhisa Momose
Original Assignee
Akim Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007322690A external-priority patent/JP4130218B1/ja
Priority claimed from JP2008130371A external-priority patent/JP5467257B2/ja
Application filed by Akim Corporation filed Critical Akim Corporation
Publication of WO2009078126A1 publication Critical patent/WO2009078126A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/06—Resistance welding; Severing by resistance heating using roller electrodes
    • B23K11/061—Resistance welding; Severing by resistance heating using roller electrodes for welding rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/0006—Resistance welding; Severing by resistance heating the welding zone being shielded against the influence of the surrounding atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B23K11/0033—Welding locally a thin plate to a large piece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/06—Resistance welding; Severing by resistance heating using roller electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/36—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un appareil de traitement de soudage sous vide (1) comprenant une chambre à vide (100), un support (400) disposé dans la chambre à vide (100) et capable de se déplacer dans une direction X tout en supportant une pièce, un dispositif d'entraînement de support disposé à l'extérieur de la chambre à vide (100), une tête de soudage (300) disposée dans la chambre à vide et capable de se déplacer dans une direction Y, un dispositif d'entraînement de tête de soudage (540) disposé à l'extérieur de la chambre à vide (100), un élément déplaçable dans une direction Z disposé dans la tête de soudage (300) et capable de se déplacer de manière relative dans une direction Z, un rouleau de soudure maintenu dans l'élément déplaçable dans la direction Z pour le soudage de la pièce, un premier arbre d'entraînement de rouleau (600) disposé dans la chambre à vide (100) parallèlement à la direction Y, un premier dispositif d'entraînement d'arbre d'entraînement de rouleau (620) disposé à l'extérieur de la chambre à vide (100), et un premier dispositif de conversion (360) disposé dans la tête de soudage (300) pour convertir l'énergie du premier arbre d'entraînement de rouleau (600) en énergie se déplaçant dans la direction Z de l'élément déplaçable dans la direction Z. Ainsi, l'appareil de traitement de soudage sous vide permet de réduire la taille de la chambre à vide par rapport à celle de l'art antérieur.
PCT/JP2008/003447 2007-12-14 2008-11-25 Appareil de traitement de soudage sous vide WO2009078126A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-322690 2007-12-14
JP2007322690A JP4130218B1 (ja) 2007-12-14 2007-12-14 真空内溶接処理装置
JP2008130371A JP5467257B2 (ja) 2008-05-19 2008-05-19 真空内溶接処理装置
JP2008-130371 2008-05-19

Publications (1)

Publication Number Publication Date
WO2009078126A1 true WO2009078126A1 (fr) 2009-06-25

Family

ID=40795250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003447 WO2009078126A1 (fr) 2007-12-14 2008-11-25 Appareil de traitement de soudage sous vide

Country Status (2)

Country Link
TW (1) TWI414392B (fr)
WO (1) WO2009078126A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013086162A (ja) * 2011-10-21 2013-05-13 Akim Kk 溶接方法および装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056474B (zh) * 2013-01-08 2014-11-26 浙江新劲空调设备有限公司 真空焊接装置以及真空焊接控制装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05245649A (ja) * 1992-03-10 1993-09-24 Kobe Steel Ltd 真空シーム溶接装置
JPH0919772A (ja) * 1995-07-04 1997-01-21 Origin Electric Co Ltd パラレルシーム接合装置およびパラレルシーム接合方法
JP2002359311A (ja) * 2001-06-01 2002-12-13 Origin Electric Co Ltd シーム接合方法及び装置
JP2003046011A (ja) * 2001-07-31 2003-02-14 Nippon Avionics Co Ltd シーム溶接装置
JP2003053550A (ja) * 2001-08-20 2003-02-26 Nippon Dempa Kogyo Co Ltd 水晶振動子のシーム溶接装置
JP2005005543A (ja) * 2003-06-13 2005-01-06 Nippon Avionics Co Ltd 真空チャンバ内の位置決め機構
JP2006114710A (ja) * 2004-10-15 2006-04-27 Nippon Avionics Co Ltd パッケージの封止方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631711A (en) * 2002-08-29 2006-09-16 Nippon Light Metal Co Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05245649A (ja) * 1992-03-10 1993-09-24 Kobe Steel Ltd 真空シーム溶接装置
JPH0919772A (ja) * 1995-07-04 1997-01-21 Origin Electric Co Ltd パラレルシーム接合装置およびパラレルシーム接合方法
JP2002359311A (ja) * 2001-06-01 2002-12-13 Origin Electric Co Ltd シーム接合方法及び装置
JP2003046011A (ja) * 2001-07-31 2003-02-14 Nippon Avionics Co Ltd シーム溶接装置
JP2003053550A (ja) * 2001-08-20 2003-02-26 Nippon Dempa Kogyo Co Ltd 水晶振動子のシーム溶接装置
JP2005005543A (ja) * 2003-06-13 2005-01-06 Nippon Avionics Co Ltd 真空チャンバ内の位置決め機構
JP2006114710A (ja) * 2004-10-15 2006-04-27 Nippon Avionics Co Ltd パッケージの封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013086162A (ja) * 2011-10-21 2013-05-13 Akim Kk 溶接方法および装置

Also Published As

Publication number Publication date
TW200932414A (en) 2009-08-01
TWI414392B (zh) 2013-11-11

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