WO2009063255A1 - Dispositif à diodes électroluminescentes amélioré - Google Patents

Dispositif à diodes électroluminescentes amélioré Download PDF

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Publication number
WO2009063255A1
WO2009063255A1 PCT/GB2008/051078 GB2008051078W WO2009063255A1 WO 2009063255 A1 WO2009063255 A1 WO 2009063255A1 GB 2008051078 W GB2008051078 W GB 2008051078W WO 2009063255 A1 WO2009063255 A1 WO 2009063255A1
Authority
WO
WIPO (PCT)
Prior art keywords
led device
thermally conductive
conductive substrate
led
silver
Prior art date
Application number
PCT/GB2008/051078
Other languages
English (en)
Inventor
Hu Pengxiang
Original Assignee
Wittenberg, Uriel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wittenberg, Uriel filed Critical Wittenberg, Uriel
Publication of WO2009063255A1 publication Critical patent/WO2009063255A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)

Abstract

La présente invention concerne un dispositif à diodes électroluminescentes comportant au moins une puce de la diode électroluminescente (3) ; et un dissipateur thermique (7), la puce de la diode électroluminescente (3) étant en couplage thermique avec le dissipateur thermique (7) au moyen d'un substrat conducteur de chaleur à base d'argent (5).
PCT/GB2008/051078 2007-11-16 2008-11-17 Dispositif à diodes électroluminescentes amélioré WO2009063255A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0722539.4 2007-11-16
GB0722539A GB2455069B (en) 2007-11-16 2007-11-16 Improved led device

Publications (1)

Publication Number Publication Date
WO2009063255A1 true WO2009063255A1 (fr) 2009-05-22

Family

ID=38896451

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/051078 WO2009063255A1 (fr) 2007-11-16 2008-11-17 Dispositif à diodes électroluminescentes amélioré

Country Status (2)

Country Link
GB (2) GB2470802B (fr)
WO (1) WO2009063255A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882569A (zh) * 2010-06-08 2010-11-10 常州银河电器有限公司 一种去除二极管或三极管的引线及框架上的溢料的方法
EP2628196A4 (fr) * 2010-10-13 2016-08-24 Cree Inc Dispositifs et procédés d'émission de lumière
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11587799B2 (en) 2019-12-02 2023-02-21 Applied Materials, Inc. Methods and apparatus for processing a substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539095A2 (fr) * 1991-10-23 1993-04-28 Fujitsu Limited Dispositif semi-conducteur comprenant une structure de radiateur et procédé de fabrication associé
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
US20030234074A1 (en) * 2002-06-25 2003-12-25 Bhagwagar Dorab Edul Thermal interface materials and methods for their preparation and use
EP1526585A2 (fr) * 2003-10-24 2005-04-27 Seiko Epson Corporation Source de lumière sémiconductrice pour un projecteur
US20050237747A1 (en) * 2001-08-09 2005-10-27 Matsushita Electric Industrial Co., Ltd. Card-type LED illumination source
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

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Publication number Priority date Publication date Assignee Title
US4400214A (en) * 1981-06-05 1983-08-23 Matsushita Electric Industrial, Co., Ltd. Conductive paste
DE3230975A1 (de) * 1982-08-20 1984-02-23 Robert Bosch Gmbh, 7000 Stuttgart Kraftfahrzeugleuchte aus leuchtdioden oder leuchtdiodenchips
JPH03104768U (fr) * 1990-02-15 1991-10-30
US5500009A (en) * 1990-11-15 1996-03-19 Amron, Ltd. Method of treating herpes
WO1998021917A1 (fr) * 1996-11-12 1998-05-22 L.F.D. Limited Lampe
WO1999057945A1 (fr) * 1998-05-04 1999-11-11 Fiber Optic Designs, Inc. Lampe utilisant un dispositif monolithique a diodes luminescentes (del)
US7066628B2 (en) * 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US6634770B2 (en) * 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
WO2005043954A2 (fr) * 2003-10-31 2005-05-12 Phoseon Technology, Inc. Cablage en serie de sources lumineuses hautement fiables
TWI290777B (en) * 2006-02-27 2007-12-01 Guei-Fang Chen Lighting device with light emitting diode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539095A2 (fr) * 1991-10-23 1993-04-28 Fujitsu Limited Dispositif semi-conducteur comprenant une structure de radiateur et procédé de fabrication associé
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
US20050237747A1 (en) * 2001-08-09 2005-10-27 Matsushita Electric Industrial Co., Ltd. Card-type LED illumination source
US20030234074A1 (en) * 2002-06-25 2003-12-25 Bhagwagar Dorab Edul Thermal interface materials and methods for their preparation and use
EP1526585A2 (fr) * 2003-10-24 2005-04-27 Seiko Epson Corporation Source de lumière sémiconductrice pour un projecteur
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882569A (zh) * 2010-06-08 2010-11-10 常州银河电器有限公司 一种去除二极管或三极管的引线及框架上的溢料的方法
EP2628196A4 (fr) * 2010-10-13 2016-08-24 Cree Inc Dispositifs et procédés d'émission de lumière
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Also Published As

Publication number Publication date
GB0722539D0 (en) 2007-12-27
GB201004698D0 (en) 2010-05-05
GB2455069A (en) 2009-06-03
GB2470802B (en) 2011-10-05
GB2455069B (en) 2010-05-12
GB2470802A (en) 2010-12-08

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