WO2009057680A1 - Appareil de formation de film et procédé de formation de film - Google Patents

Appareil de formation de film et procédé de formation de film Download PDF

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Publication number
WO2009057680A1
WO2009057680A1 PCT/JP2008/069728 JP2008069728W WO2009057680A1 WO 2009057680 A1 WO2009057680 A1 WO 2009057680A1 JP 2008069728 W JP2008069728 W JP 2008069728W WO 2009057680 A1 WO2009057680 A1 WO 2009057680A1
Authority
WO
WIPO (PCT)
Prior art keywords
rotating
film forming
sub
center
shaft
Prior art date
Application number
PCT/JP2008/069728
Other languages
English (en)
Japanese (ja)
Inventor
Junichiro Yoshioka
Kuniaki Horie
Nobumasa Nambu
Original Assignee
Ebara-Udylite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara-Udylite Co., Ltd. filed Critical Ebara-Udylite Co., Ltd.
Publication of WO2009057680A1 publication Critical patent/WO2009057680A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Optical Elements (AREA)

Abstract

Une section rotative principale (15) qui tourne avec un arbre principal (13) au centre est équipée d'une pluralité de sous-sections rotatives (16), et chaque sous-section rotative (16) comporte une pluralité de porte-pièces (17). Une pièce (W) supportée par le porte-pièce (17) tourne sur son propre arbre rotatif (46), tout en tournant avec l'arbre principal (13) au centre et en tournant avec un sous-arbre (36) au centre par la rotation de la section rotative principale (15) et des sous-sections rotatives (16). Des films sont formés en faisant en sorte que les surfaces des pièces (W) fassent face à une cible (23) de façon séquentielle.
PCT/JP2008/069728 2007-10-31 2008-10-30 Appareil de formation de film et procédé de formation de film WO2009057680A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007283475A JP2009108384A (ja) 2007-10-31 2007-10-31 成膜装置
JP2007-283475 2007-10-31

Publications (1)

Publication Number Publication Date
WO2009057680A1 true WO2009057680A1 (fr) 2009-05-07

Family

ID=40591065

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069728 WO2009057680A1 (fr) 2007-10-31 2008-10-30 Appareil de formation de film et procédé de formation de film

Country Status (2)

Country Link
JP (1) JP2009108384A (fr)
WO (1) WO2009057680A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113316661A (zh) * 2019-02-14 2021-08-27 东和株式会社 工件保持部旋转单元及真空处理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5036501B2 (ja) * 2007-11-19 2012-09-26 小島プレス工業株式会社 基材の支持装置及びスパッタリング装置
JP6135519B2 (ja) * 2014-01-17 2017-05-31 株式会社デンソー 成膜装置
JP2022029738A (ja) * 2020-08-05 2022-02-18 芝浦機械株式会社 表面処理装置および表面処理方法
CN113463056B (zh) * 2021-07-01 2022-06-17 安徽工业大学 一种真空镀膜无遮挡样品翻转装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0310464U (fr) * 1989-06-20 1991-01-31
JP2006307318A (ja) * 2005-03-31 2006-11-09 Kobe Steel Ltd αアルミナ層形成部材の製法および表面処理法
JP2007039710A (ja) * 2005-08-01 2007-02-15 Optorun Co Ltd 成膜装置及び薄膜形成方法
JP2007100123A (ja) * 2005-09-30 2007-04-19 Kyocera Kinseki Corp 真空蒸着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0310464U (fr) * 1989-06-20 1991-01-31
JP2006307318A (ja) * 2005-03-31 2006-11-09 Kobe Steel Ltd αアルミナ層形成部材の製法および表面処理法
JP2007039710A (ja) * 2005-08-01 2007-02-15 Optorun Co Ltd 成膜装置及び薄膜形成方法
JP2007100123A (ja) * 2005-09-30 2007-04-19 Kyocera Kinseki Corp 真空蒸着装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113316661A (zh) * 2019-02-14 2021-08-27 东和株式会社 工件保持部旋转单元及真空处理装置

Also Published As

Publication number Publication date
JP2009108384A (ja) 2009-05-21

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