WO2009054164A1 - ボールボンディング用金合金線 - Google Patents

ボールボンディング用金合金線 Download PDF

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Publication number
WO2009054164A1
WO2009054164A1 PCT/JP2008/061424 JP2008061424W WO2009054164A1 WO 2009054164 A1 WO2009054164 A1 WO 2009054164A1 JP 2008061424 W JP2008061424 W JP 2008061424W WO 2009054164 A1 WO2009054164 A1 WO 2009054164A1
Authority
WO
WIPO (PCT)
Prior art keywords
gold alloy
alloy wire
mass
ball
ball bonding
Prior art date
Application number
PCT/JP2008/061424
Other languages
English (en)
French (fr)
Inventor
Mitsuo Takada
Satoshi Teshima
Takeshi Kuwahara
Original Assignee
Tanaka Denshi Kogyo K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo K.K. filed Critical Tanaka Denshi Kogyo K.K.
Priority to CN2008800001948A priority Critical patent/CN101601126B/zh
Priority to EP08790566.7A priority patent/EP2204846A4/en
Priority to US12/224,212 priority patent/US8147750B2/en
Priority to KR1020087025455A priority patent/KR101047827B1/ko
Publication of WO2009054164A1 publication Critical patent/WO2009054164A1/ja

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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  • Computer Hardware Design (AREA)
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  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

【課題】　溶融ボール形成性やステッチ接合性やワイヤ強度に優れている金合金線でありながら、更に圧着ボール形状の真円性に優れた、半導体装置の高密度配線に対応可能な金合金線を提供する。 【解決手段】　マグネシウム（Ｍｇ）を１０～５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５～２０質量ｐｐｍ、カルシウム（Ｃａ）を２～９質量ｐｐｍ、および残部が純度９９．９９５質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の質量であるボールボンディング用金合金線である。
PCT/JP2008/061424 2007-10-24 2008-06-23 ボールボンディング用金合金線 WO2009054164A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800001948A CN101601126B (zh) 2007-10-24 2008-06-23 用于球焊的金合金线
EP08790566.7A EP2204846A4 (en) 2007-10-24 2008-06-23 GOLD ALLOY WIRE FOR WELDING BY BALL CRUSHING
US12/224,212 US8147750B2 (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
KR1020087025455A KR101047827B1 (ko) 2007-10-24 2008-06-23 볼 본딩용 금합금선

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-276104 2007-10-24
JP2007276104A JP4134261B1 (ja) 2007-10-24 2007-10-24 ボールボンディング用金合金線

Publications (1)

Publication Number Publication Date
WO2009054164A1 true WO2009054164A1 (ja) 2009-04-30

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PCT/JP2008/061424 WO2009054164A1 (ja) 2007-10-24 2008-06-23 ボールボンディング用金合金線

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US (1) US8147750B2 (ja)
EP (1) EP2204846A4 (ja)
JP (1) JP4134261B1 (ja)
KR (1) KR101047827B1 (ja)
CN (1) CN101601126B (ja)
MY (1) MY155023A (ja)
TW (1) TWI371812B (ja)
WO (1) WO2009054164A1 (ja)

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Publication number Priority date Publication date Assignee Title
JP4898936B2 (ja) * 2010-03-31 2012-03-21 株式会社フジクラ 防水コネクタ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH104114A (ja) 1996-06-17 1998-01-06 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP3337049B2 (ja) * 1995-05-17 2002-10-21 田中電子工業株式会社 ボンディング用金線
JP3657087B2 (ja) 1996-07-31 2005-06-08 田中電子工業株式会社 ウエッジボンディング用金合金線
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ

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Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
JP3669811B2 (ja) * 1997-04-25 2005-07-13 田中電子工業株式会社 半導体素子ボンディング用金合金線
JP3382918B2 (ja) * 2000-05-31 2003-03-04 田中電子工業株式会社 半導体素子接続用金線
JP3592310B2 (ja) * 2001-06-05 2004-11-24 住友電工スチールワイヤー株式会社 マグネシウム基合金ワイヤおよびその製造方法
US20080050267A1 (en) * 2004-09-30 2008-02-28 Hiroshi Murai Au Alloy Bonding Wire
CN1801402A (zh) * 2006-01-10 2006-07-12 无锡市华美电缆有限公司 铜包超导铝合金线

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP3337049B2 (ja) * 1995-05-17 2002-10-21 田中電子工業株式会社 ボンディング用金線
JPH104114A (ja) 1996-06-17 1998-01-06 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP3657087B2 (ja) 1996-07-31 2005-06-08 田中電子工業株式会社 ウエッジボンディング用金合金線
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ

Non-Patent Citations (1)

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Title
See also references of EP2204846A4

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EP2204846A1 (en) 2010-07-07
MY155023A (en) 2015-08-28
KR20090090998A (ko) 2009-08-26
CN101601126B (zh) 2012-06-20
TW200933772A (en) 2009-08-01
TWI371812B (en) 2012-09-01
KR101047827B1 (ko) 2011-07-08
CN101601126A (zh) 2009-12-09
EP2204846A4 (en) 2014-01-15
JP4134261B1 (ja) 2008-08-20
US8147750B2 (en) 2012-04-03
JP2009105250A (ja) 2009-05-14
US20100226816A1 (en) 2010-09-09

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