WO2009044706A1 - 回路接続材料、回路端子の接続構造 - Google Patents

回路接続材料、回路端子の接続構造 Download PDF

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WO2009044706A1
WO2009044706A1 PCT/JP2008/067661 JP2008067661W WO2009044706A1 WO 2009044706 A1 WO2009044706 A1 WO 2009044706A1 JP 2008067661 W JP2008067661 W JP 2008067661W WO 2009044706 A1 WO2009044706 A1 WO 2009044706A1
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circuit
connecting material
weight
parts
radical
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PCT/JP2008/067661
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English (en)
French (fr)
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Motohiro Arifuku
Kouji Kobayashi
Kazuyoshi Kojima
Nichiomi Mochizuki
Sunao Kudou
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Hitachi Chemical Company, Ltd.
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Priority to EP08835704A priority Critical patent/EP2211596A4/en
Priority to JP2009536042A priority patent/JP4935907B2/ja
Priority to US12/681,456 priority patent/US20100277884A1/en
Publication of WO2009044706A1 publication Critical patent/WO2009044706A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3225—Polyamines
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
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    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
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    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
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    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/72—Polyisocyanates or polyisothiocyanates
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    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Abstract

　本発明の回路接続材料は、第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材とを、前記第一の回路電極及び前記第二の回路電極を対向配置させた状態で接続するための回路接続材料であって、 　フィルム形成材と、加熱により遊離ラジカルを発生する硬化剤と、ラジカル重合性物質と、イソシアネート基含有化合物と、下記一般式（Ｉ）で表されるケチミン基含有化合物と、を含有し、 　前記フィルム形成材と前記ラジカル重合性物質との合計１００重量部に対し、前記イソシアネート基含有化合物の配合量が０．１～５重量部であり、前記ケチミン基含有化合物の配合量が０．１～５重量部である回路接続材料。 （式中、Ｒは有機基を示し、Ｒ１及びＲ２はそれぞれ炭素原子数１～４の１価の脂肪族炭化水素基を示し、Ｒ１及びＲ２は互いに連結してシクロアルキル基を構成してもよい。）
PCT/JP2008/067661 2007-10-02 2008-09-29 回路接続材料、回路端子の接続構造 WO2009044706A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08835704A EP2211596A4 (en) 2007-10-02 2008-09-29 CIRCUIT CONNECTION MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
JP2009536042A JP4935907B2 (ja) 2007-10-02 2008-09-29 回路接続材料、回路端子の接続構造
US12/681,456 US20100277884A1 (en) 2007-10-02 2008-09-29 Circuit-connecting material and circuit terminal connection structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-258637 2007-10-02
JP2007258637 2007-10-02

Publications (1)

Publication Number Publication Date
WO2009044706A1 true WO2009044706A1 (ja) 2009-04-09

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US (1) US20100277884A1 (ja)
EP (1) EP2211596A4 (ja)
JP (1) JP4935907B2 (ja)
KR (1) KR20100009539A (ja)
CN (2) CN101627666A (ja)
TW (1) TW200932863A (ja)
WO (1) WO2009044706A1 (ja)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JPWO2017110591A1 (ja) * 2015-12-25 2018-10-11 昭和電工株式会社 新規ポリウレタン、硬化性組成物、オーバーコート膜ならびにフレキシブル配線板およびその製造方法

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JP6151742B2 (ja) * 2015-06-09 2017-06-21 タツタ電線株式会社 導電性ペースト
CN108139286B (zh) 2016-03-10 2021-06-25 积水化学工业株式会社 半导体安装用粘结剂以及半导体传感器
JP6945276B2 (ja) * 2016-03-31 2021-10-06 デクセリアルズ株式会社 異方性導電接続構造体
BR112019010711A2 (pt) 2016-11-25 2019-10-01 Dow Global Technologies Llc composições de acrilato de uretano endurecido
CN110914324B (zh) * 2017-05-31 2023-09-22 陶氏环球技术有限责任公司 溶剂基粘合剂组合物

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JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP2003160771A (ja) * 2001-11-28 2003-06-06 Hitachi Chem Co Ltd 支持体つき接着剤及びそれを用いた回路接続構造体
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JP2007177204A (ja) * 2005-12-01 2007-07-12 Hitachi Chem Co Ltd 接着剤組成物並びにこれを用いた接続体及び半導体装置

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JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP2003160771A (ja) * 2001-11-28 2003-06-06 Hitachi Chem Co Ltd 支持体つき接着剤及びそれを用いた回路接続構造体
JP2004027018A (ja) * 2002-06-25 2004-01-29 Nippon Carbide Ind Co Inc 粘着剤組成物及び粘着シート
JP2005347273A (ja) * 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP2007177204A (ja) * 2005-12-01 2007-07-12 Hitachi Chem Co Ltd 接着剤組成物並びにこれを用いた接続体及び半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JPWO2017110591A1 (ja) * 2015-12-25 2018-10-11 昭和電工株式会社 新規ポリウレタン、硬化性組成物、オーバーコート膜ならびにフレキシブル配線板およびその製造方法

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CN101627666A (zh) 2010-01-13
TW200932863A (en) 2009-08-01
KR20100009539A (ko) 2010-01-27
CN102206480A (zh) 2011-10-05
JP4935907B2 (ja) 2012-05-23
EP2211596A4 (en) 2011-08-10
JPWO2009044706A1 (ja) 2011-02-10

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