WO2009041578A1 - ウェハ支持治具、ウェハ支持治具の温度測定方法、及びウェハ支持治具の温度測定システム - Google Patents

ウェハ支持治具、ウェハ支持治具の温度測定方法、及びウェハ支持治具の温度測定システム Download PDF

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Publication number
WO2009041578A1
WO2009041578A1 PCT/JP2008/067423 JP2008067423W WO2009041578A1 WO 2009041578 A1 WO2009041578 A1 WO 2009041578A1 JP 2008067423 W JP2008067423 W JP 2008067423W WO 2009041578 A1 WO2009041578 A1 WO 2009041578A1
Authority
WO
WIPO (PCT)
Prior art keywords
supporting jig
wafer supporting
wafer
measuring temperature
jig
Prior art date
Application number
PCT/JP2008/067423
Other languages
English (en)
French (fr)
Inventor
Fumiya Kobayashi
Original Assignee
Bridgestone Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bridgestone Corporation filed Critical Bridgestone Corporation
Publication of WO2009041578A1 publication Critical patent/WO2009041578A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

　炭化ケイ素よりなり、ウェハを保持するウェハ保持部を備えるウェハ支持治具１１であって、このウェハ支持治具の離隔された少なくとも２箇所に、体積抵抗率測定用の配線接続部を備えることにより、炭化ケイ素よりなるウェハ支持治具について、既存設備の設定変更やコスト高を招くことなく、ウェハ支持治具の温度を容易にかつ正確に測定することができる。
PCT/JP2008/067423 2007-09-28 2008-09-26 ウェハ支持治具、ウェハ支持治具の温度測定方法、及びウェハ支持治具の温度測定システム WO2009041578A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007255295 2007-09-28
JP2007-255295 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041578A1 true WO2009041578A1 (ja) 2009-04-02

Family

ID=40511458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067423 WO2009041578A1 (ja) 2007-09-28 2008-09-26 ウェハ支持治具、ウェハ支持治具の温度測定方法、及びウェハ支持治具の温度測定システム

Country Status (1)

Country Link
WO (1) WO2009041578A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2006146C2 (en) * 2011-02-04 2012-08-07 Xycarb Ceramics B V A method of processing substrate holder material as well as a substrate holder processed by such a method.
WO2014196323A1 (ja) * 2013-06-06 2014-12-11 イビデン株式会社 ウエハキャリアおよびこれを用いたエピタキシャル成長装置
WO2016147824A1 (ja) * 2015-03-17 2016-09-22 住友電気工業株式会社 炭化珪素単結晶の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557849U (ja) * 1991-12-27 1993-07-30 株式会社島津製作所 基板ホルダ
JPH097964A (ja) * 1995-06-15 1997-01-10 Kokusai Electric Co Ltd 半導体製造装置の温度検出装置
JPH10116885A (ja) * 1996-10-08 1998-05-06 Anelva Corp 基板温度制御機構
JP2003007687A (ja) * 2001-06-26 2003-01-10 Shin Etsu Chem Co Ltd プラズマ処理中の温度測定方法及びそれに使用する温度測定用部材
JP2003258068A (ja) * 2002-03-05 2003-09-12 Sumitomo Electric Ind Ltd 半導体／液晶製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557849U (ja) * 1991-12-27 1993-07-30 株式会社島津製作所 基板ホルダ
JPH097964A (ja) * 1995-06-15 1997-01-10 Kokusai Electric Co Ltd 半導体製造装置の温度検出装置
JPH10116885A (ja) * 1996-10-08 1998-05-06 Anelva Corp 基板温度制御機構
JP2003007687A (ja) * 2001-06-26 2003-01-10 Shin Etsu Chem Co Ltd プラズマ処理中の温度測定方法及びそれに使用する温度測定用部材
JP2003258068A (ja) * 2002-03-05 2003-09-12 Sumitomo Electric Ind Ltd 半導体／液晶製造装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2006146C2 (en) * 2011-02-04 2012-08-07 Xycarb Ceramics B V A method of processing substrate holder material as well as a substrate holder processed by such a method.
EP2485252A1 (en) 2011-02-04 2012-08-08 Xycarb Ceramics B.V. A method of processing substrate holder material
JP2012178557A (ja) * 2011-02-04 2012-09-13 Xycarb Ceramics B V 基板ホルダー材料の加工方法とその方法で加工された基板ホルダー
US9362157B2 (en) 2011-02-04 2016-06-07 Xycarb Ceramics B.V. Method of processing substrate holder material as well as substrate holder processed by such method
KR101936957B1 (ko) 2011-02-04 2019-01-09 싸이카브 세라믹스 비.브이. 기판 홀더 재료의 처리방법 및 이러한 방법에 의해 처리된 기판 홀더
WO2014196323A1 (ja) * 2013-06-06 2014-12-11 イビデン株式会社 ウエハキャリアおよびこれを用いたエピタキシャル成長装置
JPWO2014196323A1 (ja) * 2013-06-06 2017-02-23 イビデン株式会社 ウエハキャリアおよびこれを用いたエピタキシャル成長装置
WO2016147824A1 (ja) * 2015-03-17 2016-09-22 住友電気工業株式会社 炭化珪素単結晶の製造方法

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