WO2009041152A1 - 高速伝送用高密度コネクタ - Google Patents

高速伝送用高密度コネクタ Download PDF

Info

Publication number
WO2009041152A1
WO2009041152A1 PCT/JP2008/063306 JP2008063306W WO2009041152A1 WO 2009041152 A1 WO2009041152 A1 WO 2009041152A1 JP 2008063306 W JP2008063306 W JP 2008063306W WO 2009041152 A1 WO2009041152 A1 WO 2009041152A1
Authority
WO
WIPO (PCT)
Prior art keywords
contacts
rows
female
connector
staggered
Prior art date
Application number
PCT/JP2008/063306
Other languages
English (en)
French (fr)
Inventor
Toshiyasu Ito
Original Assignee
Yamaichi Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co., Ltd. filed Critical Yamaichi Electronics Co., Ltd.
Priority to US12/677,283 priority Critical patent/US8047874B2/en
Publication of WO2009041152A1 publication Critical patent/WO2009041152A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

信号線用コンタクトのさらなる高密度化に対応可能であるとともに、構造が簡単であり、接続が容易な電装部品間を接続する高速伝送用高密度コネクタを提供する。複数のコンタクト収容凹部が形成されたコネクタ本体と、該コンタクト収容凹部に圧入され、保持される複数の雌コンタクトとを有する雌コネクタと、複数のスリットが形成されたコネクタ本体と、該スリットに圧入され、保持される複数の雄コンタクトとを有する雄コネクタとを備え、雌コンタクトは、前後に隣接する雌コンタクトが斜め位置する千鳥状に配置されるように、複数列配列され、雌コンタクトに接触する雄コンタクトの接点部は、雌コンタクトの配列に対応して千鳥状に複数列配列され、千鳥状に配列された雌コンタクトのうち、前後に隣接する２列は、一対の信号線用コンタクト組の列であり、該一対の信号線用コンタクト組の列を前後に挟む１列はグランド用コンタクトの列である。
PCT/JP2008/063306 2007-09-28 2008-07-24 高速伝送用高密度コネクタ WO2009041152A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/677,283 US8047874B2 (en) 2007-09-28 2008-07-24 High-density connector for high-speed transmission

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-254698 2007-09-28
JP2007254698A JP4862796B2 (ja) 2007-09-28 2007-09-28 高速伝送用高密度コネクタ

Publications (1)

Publication Number Publication Date
WO2009041152A1 true WO2009041152A1 (ja) 2009-04-02

Family

ID=40511050

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063306 WO2009041152A1 (ja) 2007-09-28 2008-07-24 高速伝送用高密度コネクタ

Country Status (3)

Country Link
US (1) US8047874B2 (ja)
JP (1) JP4862796B2 (ja)
WO (1) WO2009041152A1 (ja)

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JP2017174701A (ja) * 2016-03-25 2017-09-28 日本圧着端子製造株式会社 圧接コンタクト及び圧接コネクタ

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US8535065B2 (en) * 2012-01-09 2013-09-17 Tyco Electronics Corporation Connector assembly for interconnecting electrical connectors having different orientations
JP5863041B2 (ja) * 2012-06-01 2016-02-16 アルプス電気株式会社 電子部品用ソケット
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US9172161B2 (en) * 2012-12-12 2015-10-27 Amphenol InterCon Systems, Inc. Impedance controlled LGA interposer assembly
CN203242847U (zh) * 2013-02-22 2013-10-16 番禺得意精密电子工业有限公司 电连接器
JP6605228B2 (ja) 2015-05-08 2019-11-13 富士通コンポーネント株式会社 コネクタ
JP6513480B2 (ja) * 2015-05-22 2019-05-15 日本航空電子工業株式会社 コネクタ
WO2018200904A1 (en) 2017-04-28 2018-11-01 Fci Usa Llc High frequency bga connector
EP3522306B1 (en) * 2018-01-31 2020-09-02 ODU GmbH & Co. KG Connector module and connector for transmitting hf signals
JP1618359S (ja) * 2018-04-23 2018-11-19
JP1618358S (ja) * 2018-04-23 2018-11-19
CN110829069B (zh) * 2018-11-01 2023-07-18 富士康(昆山)电脑接插件有限公司 连接器及其组合
CN109546471B (zh) * 2019-01-09 2023-11-03 四川华丰科技股份有限公司 带金属屏蔽板的母端信号传输模块
CN109546469B (zh) * 2019-01-09 2023-11-03 四川华丰科技股份有限公司 带金属屏蔽板的母端信号传输模块
CN109546462B (zh) * 2019-01-09 2023-11-03 四川华丰科技股份有限公司 带金属屏蔽板的母端信号传输模块
US11626678B2 (en) 2019-12-11 2023-04-11 Yamaichi Electronics Co., Ltd. Connector for high-speed transmission and method for fixing solder to fork portion of connector for high-speed transmission
CN112952418B (zh) * 2019-12-11 2023-04-11 山一电机株式会社 高速传输用连接器及焊锡对高速传输用连接器叉部的固定方法
CN113270756B (zh) * 2020-02-14 2023-05-23 山一电机株式会社 高速传输用连接器的壳体以及高速传输用连接器
USD949799S1 (en) * 2020-06-09 2022-04-26 Yamaichi Electronics Co., Ltd. Mezzanine connector housing
CN114465036A (zh) * 2020-11-06 2022-05-10 莫列斯有限公司 电连接装置
CN114361835A (zh) * 2021-12-15 2022-04-15 上海航天科工电器研究院有限公司 一种高传输速率连接器

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JP2017174701A (ja) * 2016-03-25 2017-09-28 日本圧着端子製造株式会社 圧接コンタクト及び圧接コネクタ

Also Published As

Publication number Publication date
JP4862796B2 (ja) 2012-01-25
JP2009087656A (ja) 2009-04-23
US20100330844A1 (en) 2010-12-30
US8047874B2 (en) 2011-11-01

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