WO2009036478A3 - Leiterplattenelement und verfahren zu dessen herstellung - Google Patents

Leiterplattenelement und verfahren zu dessen herstellung Download PDF

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Publication number
WO2009036478A3
WO2009036478A3 PCT/AT2008/000321 AT2008000321W WO2009036478A3 WO 2009036478 A3 WO2009036478 A3 WO 2009036478A3 AT 2008000321 W AT2008000321 W AT 2008000321W WO 2009036478 A3 WO2009036478 A3 WO 2009036478A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
light
production
board element
Prior art date
Application number
PCT/AT2008/000321
Other languages
English (en)
French (fr)
Other versions
WO2009036478A2 (de
Inventor
Gregor Langer
Johannes Stahr
Original Assignee
Austria Tech & System Tech
Gregor Langer
Johannes Stahr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech, Gregor Langer, Johannes Stahr filed Critical Austria Tech & System Tech
Priority to JP2010525158A priority Critical patent/JP5283703B2/ja
Priority to US12/675,884 priority patent/US8705905B2/en
Priority to CN2008801172262A priority patent/CN101868747B/zh
Priority to EP08782849.7A priority patent/EP2195693B1/de
Publication of WO2009036478A2 publication Critical patent/WO2009036478A2/de
Publication of WO2009036478A3 publication Critical patent/WO2009036478A3/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Leiterplattenelement (10) mit zumindest einem flexiblen Leiterplattenteil (12), und mit zumindest einem starren Leiterplattenteil (11A, 11C; 34, 35; 37) mit einem Bauelement (17), das in einer Kavität (14) untergebracht ist und mit einem Lichtabgabe- oder Lichtempfangsteil (20) über die Kante (18) der Kavität (14) ragt, wobei der flexible Leiterplattenteil (12) eine flexible Schicht (15') eines optischen, photopolymerisierbaren Materials (15) aufweist, in der ein Licht-Wellenleiter (15) in Ausrichtung zum Lichtabgabe- oder Lichtempfangsteil (17) des optoelektronischen Bauelements (17) durch Bestrahlung strukturiert ist.
PCT/AT2008/000321 2007-09-21 2008-09-11 Leiterplattenelement und verfahren zu dessen herstellung WO2009036478A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010525158A JP5283703B2 (ja) 2007-09-21 2008-09-11 プリント回路基板エレメント及びその製造方法
US12/675,884 US8705905B2 (en) 2007-09-21 2008-09-11 Printed circuit board element and method for the production thereof
CN2008801172262A CN101868747B (zh) 2007-09-21 2008-09-11 印刷电路板元件及其制造方法
EP08782849.7A EP2195693B1 (de) 2007-09-21 2008-09-11 Starr-flexibles leiterplattenelement und verfahren zu dessen herstellung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0149007A AT505834B1 (de) 2007-09-21 2007-09-21 Leiterplattenelement
ATA1490/2007 2007-09-21

Publications (2)

Publication Number Publication Date
WO2009036478A2 WO2009036478A2 (de) 2009-03-26
WO2009036478A3 true WO2009036478A3 (de) 2009-05-07

Family

ID=40342600

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2008/000321 WO2009036478A2 (de) 2007-09-21 2008-09-11 Leiterplattenelement und verfahren zu dessen herstellung

Country Status (8)

Country Link
US (1) US8705905B2 (de)
EP (1) EP2195693B1 (de)
JP (1) JP5283703B2 (de)
KR (1) KR20100071083A (de)
CN (1) CN101868747B (de)
AT (1) AT505834B1 (de)
TW (1) TW200922432A (de)
WO (1) WO2009036478A2 (de)

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US20170238416A1 (en) 2016-02-17 2017-08-17 Multek Technologies Limited Dummy core restrict resin process and structure
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US10064292B2 (en) * 2016-03-21 2018-08-28 Multek Technologies Limited Recessed cavity in printed circuit board protected by LPI
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KR20170138169A (ko) * 2016-06-07 2017-12-15 한국과학기술원 V자 구조 또는 곡면 구조의 반사체를 이용한 광 패키지 및 그 제작 방법
CN107872925A (zh) * 2016-09-27 2018-04-03 奥特斯奥地利科技与系统技术有限公司 将部件嵌入导电箔上的芯中
US10499500B2 (en) 2016-11-04 2019-12-03 Flex Ltd. Circuit board with embedded metal pallet and a method of fabricating the circuit board
CN108168444B (zh) 2016-11-17 2021-03-30 马尔泰克技术有限公司 用于pcb应用的在空气悬浮上的在线计量
US10353146B2 (en) * 2017-06-28 2019-07-16 Intel Corporation Flexible and stretchable optical interconnect in wearable systems
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CN108710173B (zh) * 2018-07-04 2024-06-21 湖南中科光电有限公司 一种微型环形器结构及其组装工艺
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KR20210020673A (ko) * 2019-08-16 2021-02-24 삼성전기주식회사 인쇄회로기판
US20210239594A1 (en) * 2020-01-31 2021-08-05 Carrier Corporation Detection Device and Method
TWI828130B (zh) * 2022-04-29 2024-01-01 國立臺北科技大學 連接器結構及提高資料傳輸速率的方法
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Also Published As

Publication number Publication date
AT505834B1 (de) 2009-09-15
WO2009036478A2 (de) 2009-03-26
EP2195693B1 (de) 2017-02-15
TW200922432A (en) 2009-05-16
US8705905B2 (en) 2014-04-22
CN101868747A (zh) 2010-10-20
JP5283703B2 (ja) 2013-09-04
AT505834A1 (de) 2009-04-15
EP2195693A2 (de) 2010-06-16
CN101868747B (zh) 2012-10-24
JP2010539545A (ja) 2010-12-16
US20110135248A1 (en) 2011-06-09
KR20100071083A (ko) 2010-06-28

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