FI20040253A - Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn - Google Patents

Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn Download PDF

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Publication number
FI20040253A
FI20040253A FI20040253A FI20040253A FI20040253A FI 20040253 A FI20040253 A FI 20040253A FI 20040253 A FI20040253 A FI 20040253A FI 20040253 A FI20040253 A FI 20040253A FI 20040253 A FI20040253 A FI 20040253A
Authority
FI
Finland
Prior art keywords
circuit board
immersing
optical component
optical
component
Prior art date
Application number
FI20040253A
Other languages
English (en)
Swedish (sv)
Other versions
FI20040253A0 (fi
Inventor
Joni Hietala
Lerber Tuomo Von
Esa Muukkonen
Original Assignee
Asperation Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asperation Oy filed Critical Asperation Oy
Priority to FI20040253A priority Critical patent/FI20040253A/fi
Publication of FI20040253A0 publication Critical patent/FI20040253A0/fi
Priority to CNA2005800051407A priority patent/CN1922524A/zh
Priority to JP2006552645A priority patent/JP2007522664A/ja
Priority to PCT/FI2005/000104 priority patent/WO2005078497A1/en
Priority to EP05708184A priority patent/EP1716441A1/en
Publication of FI20040253A publication Critical patent/FI20040253A/fi

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
FI20040253A 2004-02-17 2004-02-17 Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn FI20040253A (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20040253A FI20040253A (fi) 2004-02-17 2004-02-17 Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn
CNA2005800051407A CN1922524A (zh) 2004-02-17 2005-02-17 电路板和将光学部件嵌入电路板的方法
JP2006552645A JP2007522664A (ja) 2004-02-17 2005-02-17 回路基板および回路基板に光学構成部品を埋め込む方法
PCT/FI2005/000104 WO2005078497A1 (en) 2004-02-17 2005-02-17 Circuit board and method for embedding an optical component in a circuit board
EP05708184A EP1716441A1 (en) 2004-02-17 2005-02-17 Circuit board and method for embedding an optical component in a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20040253A FI20040253A (fi) 2004-02-17 2004-02-17 Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn

Publications (2)

Publication Number Publication Date
FI20040253A0 FI20040253A0 (fi) 2004-02-17
FI20040253A true FI20040253A (fi) 2005-08-18

Family

ID=31725729

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040253A FI20040253A (fi) 2004-02-17 2004-02-17 Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn

Country Status (5)

Country Link
EP (1) EP1716441A1 (fi)
JP (1) JP2007522664A (fi)
CN (1) CN1922524A (fi)
FI (1) FI20040253A (fi)
WO (1) WO2005078497A1 (fi)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT505834B1 (de) 2007-09-21 2009-09-15 Austria Tech & System Tech Leiterplattenelement
DE102009008087A1 (de) 2009-02-09 2010-08-19 Continental Automotive Gmbh Elektrooptisches Steuer-oder Regelgerät und Verfahren zum Austausch von Steuer-und Regelsignalen
WO2015103325A1 (en) * 2013-12-31 2015-07-09 Canon U.S. Life Sciences, Inc. Printed circuit board designs for laminated microfluidic devices
CN107872925A (zh) * 2016-09-27 2018-04-03 奥特斯奥地利科技与系统技术有限公司 将部件嵌入导电箔上的芯中
CN114567962B (zh) * 2020-11-27 2023-11-10 鹏鼎控股(深圳)股份有限公司 电路板的制造方法及电路板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4732446A (en) * 1985-10-02 1988-03-22 Lamar Gipson Electrical circuit and optical data buss
DE19917554C2 (de) * 1999-04-19 2001-07-12 Siemens Ag Positionsfixierung in Leiterplatten
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
US6768826B2 (en) * 2001-07-30 2004-07-27 Infineon Technologies Ag Delivering data optically to an integrated circuit
JP3846284B2 (ja) * 2001-11-26 2006-11-15 株式会社トッパンＮｅｃサーキットソリューションズ 光導波路の製造方法
TWI294262B (en) * 2002-06-28 2008-03-01 Matsushita Electric Ind Co Ltd A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same

Also Published As

Publication number Publication date
WO2005078497A1 (en) 2005-08-25
EP1716441A1 (en) 2006-11-02
CN1922524A (zh) 2007-02-28
JP2007522664A (ja) 2007-08-09
FI20040253A0 (fi) 2004-02-17

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Owner name: ASPOCOMP TECHNOLOGY OY

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