WO2009035038A1 - 二重成形インサート成形品及びこれを用いた電子機器 - Google Patents

二重成形インサート成形品及びこれを用いた電子機器 Download PDF

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Publication number
WO2009035038A1
WO2009035038A1 PCT/JP2008/066425 JP2008066425W WO2009035038A1 WO 2009035038 A1 WO2009035038 A1 WO 2009035038A1 JP 2008066425 W JP2008066425 W JP 2008066425W WO 2009035038 A1 WO2009035038 A1 WO 2009035038A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded article
conductive film
molded body
electronic device
insert molded
Prior art date
Application number
PCT/JP2008/066425
Other languages
English (en)
French (fr)
Inventor
Yuki Matsui
Takao Hashimoto
Ryomei Omote
Shuzo Okumura
Takahiro Okabe
Takeshi Nishimura
Original Assignee
Nissha Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co., Ltd. filed Critical Nissha Printing Co., Ltd.
Publication of WO2009035038A1 publication Critical patent/WO2009035038A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent

Abstract

　支持フィルム１４の表面に透明導電膜層１５が設けられた導電性フィルム部材２０の両面に第１成形体１１と第２成形体１２が形成された二重成形インサート成形品２であって、前記第１成形体１１と第２成形体１２は、前記導電性フィルム部材２０を覆うように形成されるとともに、前記第１成形体１１と第２成形体１２のうち前記透明導電膜層１５に接触する側のいずれか一方は、前記導電性フィルム部材２０の透明導電膜層１５を外部に露出させる切り欠き部１８ａが設けられている。
PCT/JP2008/066425 2007-09-12 2008-09-11 二重成形インサート成形品及びこれを用いた電子機器 WO2009035038A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-236754 2007-09-12
JP2007236754 2007-09-12

Publications (1)

Publication Number Publication Date
WO2009035038A1 true WO2009035038A1 (ja) 2009-03-19

Family

ID=40452045

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066425 WO2009035038A1 (ja) 2007-09-12 2008-09-11 二重成形インサート成形品及びこれを用いた電子機器

Country Status (2)

Country Link
TW (1) TW200927431A (ja)
WO (1) WO2009035038A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011126236A (ja) * 2009-12-21 2011-06-30 Nissha Printing Co Ltd 機能部品付き樹脂筐体及びその製造方法
JP2012011691A (ja) * 2010-07-01 2012-01-19 Nissha Printing Co Ltd 導電回路一体化成形品及びその製造方法
JP2013164716A (ja) * 2012-02-10 2013-08-22 Hosiden Corp 部品モジュール
EP2695715B1 (en) * 2012-08-07 2016-03-02 Hosiden Corporation Device module and method of manufacturing the same
KR101751244B1 (ko) 2015-08-21 2017-06-28 엠티코리아 주식회사 이엘(el)필름 삽입 제품용 이중 사출 금형 및 성형방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5525574B2 (ja) * 2012-08-07 2014-06-18 ホシデン株式会社 部品モジュール及び部品モジュールの製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (ja) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 電磁波または高周波シールド製品の製法
JPH06268391A (ja) * 1993-03-16 1994-09-22 Sumitomo Rubber Ind Ltd 電磁波遮蔽体およびその製造方法
JPH09277303A (ja) * 1996-04-11 1997-10-28 Sony Corp インサート成型品の成型方法とその成型品
JPH1041679A (ja) * 1996-07-22 1998-02-13 Matsushita Electric Works Ltd 電磁波シールド材及び電子部品用筐体
JPH11129403A (ja) * 1997-10-31 1999-05-18 Mitsubishi Heavy Ind Ltd 繊維強化樹脂製品とその製造方法
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
JP2001030288A (ja) * 1999-07-23 2001-02-06 Dainippon Printing Co Ltd 樹脂製成形品およびその製造方法
JP2003234814A (ja) * 2002-02-12 2003-08-22 Hayata Hiromichi 携帯電話用カバー
JP2003298280A (ja) * 2002-04-05 2003-10-17 Bridgestone Corp 電磁波シールド性プラスチック板及びその製造方法
JP2004165985A (ja) * 2002-11-13 2004-06-10 Well Company Mhk:Kk 携帯電話カバー
JP2004363450A (ja) * 2003-06-06 2004-12-24 Nissan Motor Co Ltd 電磁波シールド筐体およびその製造方法
JP2006210526A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd 電磁波シールド筐体

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (ja) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 電磁波または高周波シールド製品の製法
JPH06268391A (ja) * 1993-03-16 1994-09-22 Sumitomo Rubber Ind Ltd 電磁波遮蔽体およびその製造方法
JPH09277303A (ja) * 1996-04-11 1997-10-28 Sony Corp インサート成型品の成型方法とその成型品
JPH1041679A (ja) * 1996-07-22 1998-02-13 Matsushita Electric Works Ltd 電磁波シールド材及び電子部品用筐体
JPH11129403A (ja) * 1997-10-31 1999-05-18 Mitsubishi Heavy Ind Ltd 繊維強化樹脂製品とその製造方法
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
JP2001030288A (ja) * 1999-07-23 2001-02-06 Dainippon Printing Co Ltd 樹脂製成形品およびその製造方法
JP2003234814A (ja) * 2002-02-12 2003-08-22 Hayata Hiromichi 携帯電話用カバー
JP2003298280A (ja) * 2002-04-05 2003-10-17 Bridgestone Corp 電磁波シールド性プラスチック板及びその製造方法
JP2004165985A (ja) * 2002-11-13 2004-06-10 Well Company Mhk:Kk 携帯電話カバー
JP2004363450A (ja) * 2003-06-06 2004-12-24 Nissan Motor Co Ltd 電磁波シールド筐体およびその製造方法
JP2006210526A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd 電磁波シールド筐体

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011126236A (ja) * 2009-12-21 2011-06-30 Nissha Printing Co Ltd 機能部品付き樹脂筐体及びその製造方法
JP2012011691A (ja) * 2010-07-01 2012-01-19 Nissha Printing Co Ltd 導電回路一体化成形品及びその製造方法
JP2013164716A (ja) * 2012-02-10 2013-08-22 Hosiden Corp 部品モジュール
US9253908B2 (en) 2012-02-10 2016-02-02 Hosiden Corporation Device module
EP2695715B1 (en) * 2012-08-07 2016-03-02 Hosiden Corporation Device module and method of manufacturing the same
EP3045284A1 (en) * 2012-08-07 2016-07-20 Hosiden Corporation Device module and method of manufacturing the same
US9872409B2 (en) 2012-08-07 2018-01-16 Hosiden Corporation Device module and method of manufacturing the same
KR101751244B1 (ko) 2015-08-21 2017-06-28 엠티코리아 주식회사 이엘(el)필름 삽입 제품용 이중 사출 금형 및 성형방법

Also Published As

Publication number Publication date
TW200927431A (en) 2009-07-01

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