WO2009031590A1 - 圧電センサ - Google Patents

圧電センサ Download PDF

Info

Publication number
WO2009031590A1
WO2009031590A1 PCT/JP2008/065899 JP2008065899W WO2009031590A1 WO 2009031590 A1 WO2009031590 A1 WO 2009031590A1 JP 2008065899 W JP2008065899 W JP 2008065899W WO 2009031590 A1 WO2009031590 A1 WO 2009031590A1
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric bodies
bonded
whose
base material
disposed
Prior art date
Application number
PCT/JP2008/065899
Other languages
English (en)
French (fr)
Inventor
Ryuichi Sudo
Nobuhiro Moriyama
Tomoyuki Ogawa
Original Assignee
Kureha Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007301400A external-priority patent/JP5111071B2/ja
Application filed by Kureha Corporation filed Critical Kureha Corporation
Publication of WO2009031590A1 publication Critical patent/WO2009031590A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

　基材の貼合せ時の空気の混入を防止し、浮遊容量の影響を抑えた高感度な圧電センサを実現する。加圧されることにより電位を生じる、第１の面ａ１と第１の面ａ１に対して表裏の関係にある第２の面ａ２を有する圧電体１と、圧電体１の第１の面ａ１と対向するシグナル電極４をその一方の面ｇ１に有し、シグナル電極４を有する面ｇ１が圧電体１の第１の面ａ１に貼接されるように配設された第１の基材５と、圧電体１の第２の面ａ２と対向する第１のグランド電極７をその一方の面ｄ１に有し、第１のグランド電極７を有する面ｄ１が圧電体１の第２の面ａ２に貼接されるように配設された第２の基材８と、一方の面ｂ１が第１の基材５のシグナル電極４を有する面ｇ１に貼接し、他方の面ｂ２が第２の基材８の第１のグランド電極７を有する面ｄ１に貼接され、圧電体１が配設された部分（例えば、ｈ）以外に配設されたスペーサ部材６とを備える。  
PCT/JP2008/065899 2007-09-05 2008-09-03 圧電センサ WO2009031590A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007229717 2007-09-05
JP2007-229717 2007-09-05
JP2007-301400 2007-11-21
JP2007301400A JP5111071B2 (ja) 2007-09-05 2007-11-21 圧電センサ

Publications (1)

Publication Number Publication Date
WO2009031590A1 true WO2009031590A1 (ja) 2009-03-12

Family

ID=40428904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065899 WO2009031590A1 (ja) 2007-09-05 2008-09-03 圧電センサ

Country Status (1)

Country Link
WO (1) WO2009031590A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013501490A (ja) * 2009-08-07 2013-01-10 バイヤー・マテリアルサイエンス・アーゲー 電気機械変換器を製造するための方法
EP2610016A1 (en) * 2011-12-27 2013-07-03 General Electric Company Device for measuring material thickness
JP2019125630A (ja) * 2018-01-13 2019-07-25 学校法人早稲田大学 圧電型発電装置及びその製造方法
WO2019220111A1 (en) * 2018-05-15 2019-11-21 Imperial College Of Science, Technology And Medicine Apparatus for monitoring physical characteristics
WO2021105920A1 (en) * 2019-11-27 2021-06-03 Fondazione Istituto Italiano Di Tecnologia Flexible piezoelectric sensor with integrated electromagnetic shield

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511100A (ja) * 1994-01-27 1997-11-04 アクティブ コントロール エクスパーツ インコーポレイテッド パッケージ化歪みアクチュエータ
JP2000292272A (ja) * 1999-04-06 2000-10-20 Furukawa Electric Co Ltd:The フィルムセンサ
JP2004028883A (ja) * 2002-06-27 2004-01-29 Denso Corp 感圧センサ
EP1882920A1 (en) * 2006-07-28 2008-01-30 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. Method of producing a film-type sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511100A (ja) * 1994-01-27 1997-11-04 アクティブ コントロール エクスパーツ インコーポレイテッド パッケージ化歪みアクチュエータ
JP2000292272A (ja) * 1999-04-06 2000-10-20 Furukawa Electric Co Ltd:The フィルムセンサ
JP2004028883A (ja) * 2002-06-27 2004-01-29 Denso Corp 感圧センサ
EP1882920A1 (en) * 2006-07-28 2008-01-30 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. Method of producing a film-type sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013501490A (ja) * 2009-08-07 2013-01-10 バイヤー・マテリアルサイエンス・アーゲー 電気機械変換器を製造するための方法
US8680745B2 (en) 2010-07-21 2014-03-25 General Electric Company Device for measuring material thickness
EP2610016A1 (en) * 2011-12-27 2013-07-03 General Electric Company Device for measuring material thickness
JP2019125630A (ja) * 2018-01-13 2019-07-25 学校法人早稲田大学 圧電型発電装置及びその製造方法
WO2019220111A1 (en) * 2018-05-15 2019-11-21 Imperial College Of Science, Technology And Medicine Apparatus for monitoring physical characteristics
WO2021105920A1 (en) * 2019-11-27 2021-06-03 Fondazione Istituto Italiano Di Tecnologia Flexible piezoelectric sensor with integrated electromagnetic shield

Similar Documents

Publication Publication Date Title
WO2009028316A1 (ja) 圧電フィルムセンサ
WO2010134302A3 (en) Method for manufacturing a capacitive electromechanical transducer
JP2007533039A5 (ja)
WO2009050881A1 (ja) 超音波探触子
WO2009031590A1 (ja) 圧電センサ
WO2012075153A3 (en) Ultrasound device, and associated cable assembly
WO2006102273A3 (en) High-performance electroactive polymer transducers
WO2015088708A3 (en) Flexible micromachined transducer device and method for fabricating same
WO2012014111A3 (en) Thin film ultrasound transducer
GB2478853B (en) Touch sensing type liquid crystal display device and method of fabricating the same
WO2010036713A3 (en) Capacitive sensor having electrodes arranged on the substrate and the flex circuit
EP2381340A3 (en) Transparent piezoelectric combined touch sensor and haptic actuator
WO2008023980A3 (en) Permeation barrier on flexible device
EP1976015A3 (en) Switching element, method for manufacturing the same, and display device including switching element
WO2009063827A1 (ja) 回路接続材料、及び回路部材の接続構造
WO2009050833A1 (ja) 不揮発性記憶素子、並びにその不揮発性記憶素子を用いた不揮発性半導体装置
WO2009016606A3 (en) Cmuts with a high-k dielectric
WO2005079187A3 (en) Surface deformation electroactive polymer transducers
TW200735258A (en) Thin slice electrode of electrostatic sucking disc
WO2007146369A8 (en) Ammonia gas sensor with dissimilar electrodes
WO2009034682A1 (ja) 角速度センサ
CN104843627A (zh) 一种柔性贴片式传感驱动一体器件
WO2008146624A1 (ja) 加速度センサおよびその製造方法
WO2007017775A3 (en) Ultrasound transducer arrays
WO2009001815A1 (ja) 力学量センサおよびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08829229

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08829229

Country of ref document: EP

Kind code of ref document: A1