WO2009031590A1 - 圧電センサ - Google Patents
圧電センサ Download PDFInfo
- Publication number
- WO2009031590A1 WO2009031590A1 PCT/JP2008/065899 JP2008065899W WO2009031590A1 WO 2009031590 A1 WO2009031590 A1 WO 2009031590A1 JP 2008065899 W JP2008065899 W JP 2008065899W WO 2009031590 A1 WO2009031590 A1 WO 2009031590A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- piezoelectric bodies
- bonded
- whose
- base material
- disposed
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 238000003475 lamination Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
基材の貼合せ時の空気の混入を防止し、浮遊容量の影響を抑えた高感度な圧電センサを実現する。加圧されることにより電位を生じる、第1の面a1と第1の面a1に対して表裏の関係にある第2の面a2を有する圧電体1と、圧電体1の第1の面a1と対向するシグナル電極4をその一方の面g1に有し、シグナル電極4を有する面g1が圧電体1の第1の面a1に貼接されるように配設された第1の基材5と、圧電体1の第2の面a2と対向する第1のグランド電極7をその一方の面d1に有し、第1のグランド電極7を有する面d1が圧電体1の第2の面a2に貼接されるように配設された第2の基材8と、一方の面b1が第1の基材5のシグナル電極4を有する面g1に貼接し、他方の面b2が第2の基材8の第1のグランド電極7を有する面d1に貼接され、圧電体1が配設された部分(例えば、h)以外に配設されたスペーサ部材6とを備える。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007229717 | 2007-09-05 | ||
JP2007-229717 | 2007-09-05 | ||
JP2007-301400 | 2007-11-21 | ||
JP2007301400A JP5111071B2 (ja) | 2007-09-05 | 2007-11-21 | 圧電センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009031590A1 true WO2009031590A1 (ja) | 2009-03-12 |
Family
ID=40428904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/065899 WO2009031590A1 (ja) | 2007-09-05 | 2008-09-03 | 圧電センサ |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009031590A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013501490A (ja) * | 2009-08-07 | 2013-01-10 | バイヤー・マテリアルサイエンス・アーゲー | 電気機械変換器を製造するための方法 |
EP2610016A1 (en) * | 2011-12-27 | 2013-07-03 | General Electric Company | Device for measuring material thickness |
JP2019125630A (ja) * | 2018-01-13 | 2019-07-25 | 学校法人早稲田大学 | 圧電型発電装置及びその製造方法 |
WO2019220111A1 (en) * | 2018-05-15 | 2019-11-21 | Imperial College Of Science, Technology And Medicine | Apparatus for monitoring physical characteristics |
WO2021105920A1 (en) * | 2019-11-27 | 2021-06-03 | Fondazione Istituto Italiano Di Tecnologia | Flexible piezoelectric sensor with integrated electromagnetic shield |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09511100A (ja) * | 1994-01-27 | 1997-11-04 | アクティブ コントロール エクスパーツ インコーポレイテッド | パッケージ化歪みアクチュエータ |
JP2000292272A (ja) * | 1999-04-06 | 2000-10-20 | Furukawa Electric Co Ltd:The | フィルムセンサ |
JP2004028883A (ja) * | 2002-06-27 | 2004-01-29 | Denso Corp | 感圧センサ |
EP1882920A1 (en) * | 2006-07-28 | 2008-01-30 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method of producing a film-type sensor |
-
2008
- 2008-09-03 WO PCT/JP2008/065899 patent/WO2009031590A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09511100A (ja) * | 1994-01-27 | 1997-11-04 | アクティブ コントロール エクスパーツ インコーポレイテッド | パッケージ化歪みアクチュエータ |
JP2000292272A (ja) * | 1999-04-06 | 2000-10-20 | Furukawa Electric Co Ltd:The | フィルムセンサ |
JP2004028883A (ja) * | 2002-06-27 | 2004-01-29 | Denso Corp | 感圧センサ |
EP1882920A1 (en) * | 2006-07-28 | 2008-01-30 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method of producing a film-type sensor |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013501490A (ja) * | 2009-08-07 | 2013-01-10 | バイヤー・マテリアルサイエンス・アーゲー | 電気機械変換器を製造するための方法 |
US8680745B2 (en) | 2010-07-21 | 2014-03-25 | General Electric Company | Device for measuring material thickness |
EP2610016A1 (en) * | 2011-12-27 | 2013-07-03 | General Electric Company | Device for measuring material thickness |
JP2019125630A (ja) * | 2018-01-13 | 2019-07-25 | 学校法人早稲田大学 | 圧電型発電装置及びその製造方法 |
WO2019220111A1 (en) * | 2018-05-15 | 2019-11-21 | Imperial College Of Science, Technology And Medicine | Apparatus for monitoring physical characteristics |
WO2021105920A1 (en) * | 2019-11-27 | 2021-06-03 | Fondazione Istituto Italiano Di Tecnologia | Flexible piezoelectric sensor with integrated electromagnetic shield |
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