WO2009031536A1 - Insulating sheet and multilayer structure - Google Patents

Insulating sheet and multilayer structure Download PDF

Info

Publication number
WO2009031536A1
WO2009031536A1 PCT/JP2008/065763 JP2008065763W WO2009031536A1 WO 2009031536 A1 WO2009031536 A1 WO 2009031536A1 JP 2008065763 W JP2008065763 W JP 2008065763W WO 2009031536 A1 WO2009031536 A1 WO 2009031536A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating sheet
thermal conductivity
acid anhydride
less
monomer
Prior art date
Application number
PCT/JP2008/065763
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Maenaka
Yasunari Kusaka
Takuji Aoyama
Isao Higuchi
Daisuke Nakajima
Takashi Watanabe
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007230482A external-priority patent/JP4922108B2/en
Priority claimed from JP2007329140A external-priority patent/JP2009149770A/en
Priority claimed from JP2008076347A external-priority patent/JP4922220B2/en
Priority claimed from JP2008078797A external-priority patent/JP5150326B2/en
Priority claimed from JP2008078796A external-priority patent/JP2009231249A/en
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to CN2008801058680A priority Critical patent/CN101796106B/en
Priority to US12/676,435 priority patent/US20100297453A1/en
Publication of WO2009031536A1 publication Critical patent/WO2009031536A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/427—Polyethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of not less than 10 W/m•K to an electrically conductive layer. This insulating sheet has excellent handling properties in an uncured state, and a cured product of this insulating sheet is improved in adhesiveness, heat resistance, dielectric breakdown characteristics and thermal conductivity. Specifically disclosed is an insulating sheet used for bonding a heat conductor having a thermal conductivity of not less than 10 W/m•K to an electrically conductive layer, which sheet contains (A) a polymer having an aromatic skeleton and a weight average molecular weight of not less than 10,000, (B) a monomer composed of at least one of (B1) an epoxy monomer having an aromatic skeleton and a weight average molecular weight of not more than 600 and (B2) an oxethane monomer, (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of such an acid anhydride or a modified product of such an acid anhydride, and (D) a filler. This insulating sheet has a glass transition temperature Tg in an uncured state of not more than 25˚C.
PCT/JP2008/065763 2007-09-05 2008-09-02 Insulating sheet and multilayer structure WO2009031536A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801058680A CN101796106B (en) 2007-09-05 2008-09-02 Insulating sheet and multilayer structure
US12/676,435 US20100297453A1 (en) 2007-09-05 2008-09-02 Insulating sheet and multilayer structure

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2007-230482 2007-09-05
JP2007230482A JP4922108B2 (en) 2007-09-05 2007-09-05 Insulating sheet and laminated structure
JP2007323527 2007-12-14
JP2007-323527 2007-12-14
JP2007-329140 2007-12-20
JP2007329140A JP2009149770A (en) 2007-12-20 2007-12-20 Insulating sheet and multilayer structure
JP2008076347A JP4922220B2 (en) 2007-12-14 2008-03-24 Insulating sheet and laminated structure
JP2008-076347 2008-03-24
JP2008078797A JP5150326B2 (en) 2008-03-25 2008-03-25 Insulating sheet and laminated structure
JP2008078796A JP2009231249A (en) 2008-03-25 2008-03-25 Insulation sheet and laminated structural body
JP2008-078796 2008-03-25
JP2008-078797 2008-03-25

Publications (1)

Publication Number Publication Date
WO2009031536A1 true WO2009031536A1 (en) 2009-03-12

Family

ID=40428852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065763 WO2009031536A1 (en) 2007-09-05 2008-09-02 Insulating sheet and multilayer structure

Country Status (1)

Country Link
WO (1) WO2009031536A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010218975A (en) * 2009-03-18 2010-09-30 Sekisui Chem Co Ltd Insulating sheet, laminated plate, and multilayer laminated plate
EP2264102A1 (en) * 2009-06-17 2010-12-22 Hitachi Industrial Equipment Systems Co., Ltd. Cast insulation resin for electric apparatus and high voltage electric apparatus using the same
EP2316897A1 (en) * 2008-08-18 2011-05-04 Sekisui Chemical Co., Ltd. Insulating sheet and laminated structure
CN102803335A (en) * 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 Hardener composition for epoxy resins
CN102947390A (en) * 2010-06-22 2013-02-27 住友电木株式会社 Resin composition used to form resin layer of metal base substrate, metal base substrate, and method for producing metal base substrate
JP2013159098A (en) * 2012-02-08 2013-08-19 Sekisui Chem Co Ltd Laminated structure
WO2016088832A1 (en) * 2014-12-04 2016-06-09 積水化学工業株式会社 Curable composition, method for producing curable composition, and semiconductor device
JP2017036415A (en) * 2015-08-12 2017-02-16 三菱化学株式会社 Heat release resin sheet and device containing heat release resin sheet
EP3176198A1 (en) * 2015-12-03 2017-06-07 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
WO2019160143A1 (en) * 2018-02-19 2019-08-22 日立化成株式会社 Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
WO2021193690A1 (en) * 2020-03-26 2021-09-30 日本アエロジル株式会社 Insulating filler and production method therefor, insulating material containing said insulating filler and production method therefor
CN117255474A (en) * 2023-09-26 2023-12-19 广东格斯泰科技有限公司 High-temperature-resistant resin-based copper-clad laminate and preparation method thereof

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323889A (en) * 1991-04-23 1992-11-13 Matsushita Electric Works Ltd Metal base wiring board
JPH0883963A (en) * 1994-09-12 1996-03-26 Hitachi Chem Co Ltd Metal-based board
WO1996031574A1 (en) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
JPH08332696A (en) * 1995-06-06 1996-12-17 Hitachi Chem Co Ltd Metal member fitted with insulating adhesive material and production thereof
JPH09186462A (en) * 1996-01-04 1997-07-15 Hitachi Chem Co Ltd Manufacture of multilayered flexible printed wiring board
JPH10242606A (en) * 1997-02-27 1998-09-11 Hitachi Chem Co Ltd Metal base board
JP2004172597A (en) * 2002-10-30 2004-06-17 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP2004250470A (en) * 2003-02-18 2004-09-09 Hitachi Chem Co Ltd Insulating resin composition and use thereof
JP2006261555A (en) * 2005-03-18 2006-09-28 Mitsubishi Electric Corp Cooling structure, heat sink, and heater cooling method
JP2007145996A (en) * 2005-11-28 2007-06-14 Fujitsu Ltd Underfill composition and semiconductor apparatus using the same
JP2007246861A (en) * 2006-03-20 2007-09-27 Nippon Steel Chem Co Ltd Resin composition, and varnish obtained using the resin composition, film adhesive, and copper foil attached with film adhesive
WO2007129662A1 (en) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. Insulating material, process for producing electronic part/device, and electronic part/device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323889A (en) * 1991-04-23 1992-11-13 Matsushita Electric Works Ltd Metal base wiring board
JPH0883963A (en) * 1994-09-12 1996-03-26 Hitachi Chem Co Ltd Metal-based board
WO1996031574A1 (en) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
JPH08332696A (en) * 1995-06-06 1996-12-17 Hitachi Chem Co Ltd Metal member fitted with insulating adhesive material and production thereof
JPH09186462A (en) * 1996-01-04 1997-07-15 Hitachi Chem Co Ltd Manufacture of multilayered flexible printed wiring board
JPH10242606A (en) * 1997-02-27 1998-09-11 Hitachi Chem Co Ltd Metal base board
JP2004172597A (en) * 2002-10-30 2004-06-17 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP2004250470A (en) * 2003-02-18 2004-09-09 Hitachi Chem Co Ltd Insulating resin composition and use thereof
JP2006261555A (en) * 2005-03-18 2006-09-28 Mitsubishi Electric Corp Cooling structure, heat sink, and heater cooling method
JP2007145996A (en) * 2005-11-28 2007-06-14 Fujitsu Ltd Underfill composition and semiconductor apparatus using the same
JP2007246861A (en) * 2006-03-20 2007-09-27 Nippon Steel Chem Co Ltd Resin composition, and varnish obtained using the resin composition, film adhesive, and copper foil attached with film adhesive
WO2007129662A1 (en) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. Insulating material, process for producing electronic part/device, and electronic part/device

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2316897A1 (en) * 2008-08-18 2011-05-04 Sekisui Chemical Co., Ltd. Insulating sheet and laminated structure
EP2316897A4 (en) * 2008-08-18 2013-08-21 Sekisui Chemical Co Ltd Insulating sheet and laminated structure
JP2010218975A (en) * 2009-03-18 2010-09-30 Sekisui Chem Co Ltd Insulating sheet, laminated plate, and multilayer laminated plate
EP2264102A1 (en) * 2009-06-17 2010-12-22 Hitachi Industrial Equipment Systems Co., Ltd. Cast insulation resin for electric apparatus and high voltage electric apparatus using the same
CN101928443A (en) * 2009-06-17 2010-12-29 株式会社日立产机系统 Cast insulation resin for electric apparatus and use its high voltage electric apparatus
CN102803335A (en) * 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 Hardener composition for epoxy resins
CN106832224A (en) * 2009-06-22 2017-06-13 蓝立方知识产权有限责任公司 The hardener composition of epoxy resin
CN102947390A (en) * 2010-06-22 2013-02-27 住友电木株式会社 Resin composition used to form resin layer of metal base substrate, metal base substrate, and method for producing metal base substrate
JP2013159098A (en) * 2012-02-08 2013-08-19 Sekisui Chem Co Ltd Laminated structure
JP6093880B2 (en) * 2014-12-04 2017-03-08 積水化学工業株式会社 Curable composition, method for producing curable composition, and semiconductor device
JPWO2016088832A1 (en) * 2014-12-04 2017-04-27 積水化学工業株式会社 Curable composition, method for producing curable composition, and semiconductor device
WO2016088832A1 (en) * 2014-12-04 2016-06-09 積水化学工業株式会社 Curable composition, method for producing curable composition, and semiconductor device
JP2017036415A (en) * 2015-08-12 2017-02-16 三菱化学株式会社 Heat release resin sheet and device containing heat release resin sheet
EP3176198A1 (en) * 2015-12-03 2017-06-07 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
US10059866B2 (en) 2015-12-03 2018-08-28 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
WO2019160143A1 (en) * 2018-02-19 2019-08-22 日立化成株式会社 Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
JPWO2019160143A1 (en) * 2018-02-19 2020-12-03 昭和電工マテリアルズ株式会社 Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
WO2021193690A1 (en) * 2020-03-26 2021-09-30 日本アエロジル株式会社 Insulating filler and production method therefor, insulating material containing said insulating filler and production method therefor
JP2021155243A (en) * 2020-03-26 2021-10-07 日本アエロジル株式会社 Insulating filler and method for manufacturing the same, and insulating material containing the insulating filler and method for manufacturing the same
US11718729B2 (en) 2020-03-26 2023-08-08 Nippon Aerosil Co., Ltd. Insulating filler and production method therefor, insulating material containing said insulating filler and production method therefor
CN117255474A (en) * 2023-09-26 2023-12-19 广东格斯泰科技有限公司 High-temperature-resistant resin-based copper-clad laminate and preparation method thereof
CN117255474B (en) * 2023-09-26 2024-03-26 广东格斯泰科技有限公司 High-temperature-resistant resin-based copper-clad laminate and preparation method thereof

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