TWI391067B - Thermally conductive substrate for electronic component with low thermal resistance, low thermal expansion coefficient and high electrical reliability and manufacturing method thereof - Google Patents

Description

Thermal conductive substrate for electronic component with low thermal resistance, low thermal expansion coefficient and high electrical reliability and manufacturing method thereof

The invention relates to a heat-conducting substrate, in particular, disposed between an electronic component and a heat-dissipating module for conducting heat generated by the electronic component to the heat-dissipating module.

Under the advancement of technology, electronic products are gradually moving toward high-efficiency development, while high-performance electronic components require relatively high power to drive, but with the increase of power, electronic components also generate considerable heat during operation, which accumulate in electronics. The heat on the components will cause damage to the electronic components, resulting in a decrease in the life and reliability of the electronic components. For example, in the rapid development of the green energy industry, LEDs are light-emitting diodes in lighting and backlight modules. The importance of such fields is also increasing. Especially the lighting industry is actively replacing the incandescent light source with the LED light source, which in turn drives the increasing demand for LEDs. However, only about 15~25% of the LED input power is converted into light. The remaining 75~85% of the input power is converted into heat. If the heat accumulates in the LED, it will cause its luminous intensity to decrease, the color of the light to shift, the yellowing of the packaging material and the life reduction, especially for high-power LEDs. The heat generated by it has a greater impact on the LED.

As shown in the fourth figure, in order to solve the adverse effects caused by the above heat, an electronic component (40) may be provided with an insulated metal substrate (IMS) for mounting the electronic component (40). The generated heat is conducted to a heat dissipation module (not shown), which is commonly used in the prior art for a thermally conductive and insulated metal substrate for electronic components, and is structured by a conductive metal layer (31) and a thermally conductive metal layer (33). A thermal insulation layer (32) is disposed between the existing There are three processes for technically conductive thermally insulating metal substrates, among which: The first process first disperses and mixes the thermally conductive powder with the thermoplastic organic resin, and applies the mixed solution to the surface of the conductive metal layer (31) and the surface of the thermally conductive metal layer (33), respectively, and completely bakes the two. Drying to form a thermoplastic thermal conductive composite film on the surface of the two metal layers (31) (33), respectively, and then bonding the two metal layers (31) (33) to the side on which the thermoplastic thermal conductive composite film is formed, and borrowing The thermal compression bonding process causes the thermoplastic conductive composite film to be melted to adhere the two metal layers (31) (33) to form a thermally conductive and insulating metal substrate for an electronic component. The disadvantage of this process is that it is subjected to high temperature pressing and pressing. The temperature is greater than 200 ° C, and it is easy to create holes in the interface of each layer, thereby causing an increase in thermal resistance; The second process firstly mixes the heat conductive solid powder with the liquid thermosetting organic resin into a resin slurry, and applies the slurry on the surface of the heat conductive metal layer (33) to form a thin layer of the thermally conductive composite resin slurry. Then, the conductive metal layer (31) is covered on the thin layer of the slurry, and the thin layer of the thermally conductive composite resin slurry is thermally cured into a thermally conductive insulating layer by heating and pressing. The disadvantage of the process is that the resin slurry is in the form of heat curing. Fluidity, in the heating and pressing process, it is easy to have the problem that the uncured slurry overflows the plate, and the glue slurry is easy to produce the phenomenon of phase separation between the heat conductive solid powder and the liquid thermosetting resin during the pressing process. The thermally conductive solid powder is unevenly dispersed in the thermally conductive insulating layer, resulting in a decrease in thermal conductivity and reliability of the insulating layer; The third process is a temperature above the melting point of the resin, and the inorganic thermal conductive powder, the thermoplastic plastic, and the thermosetting epoxy resin are uniformly kneaded to form a uniform rubber material, and a thermosetting epoxy is added to the uniform rubber material before the film forming process. Curing agent and catalyst, and through plastic processing engineering (including extrusion, calendering, injection molding (injection) Molding)) forming a thermally conductive insulating composite film with a release profile, the polymer portion of the thermally conductive insulating composite film being an inter-penetrating network (IPN), which will remove the thermal insulation of the release profile The composite film is placed between the conductive metal layer (31) and the heat conductive metal layer (33), and then the insulating layer is bonded to the two metal layers (31) (33) by a heating and pressing process to form the heat conductive insulating metal substrate. The disadvantage of the process is that the rubber material preparation process needs to be mixed at a high temperature, the thermoplastic plastic is a high-viscosity fluid in the high-temperature mixing process, the inorganic thermal conductive powder is not easily dispersed therein, and the thermal conductive insulating composite film has an interactive penetration structure. When pressing, it must be heated above the melting point of the thermoplastic plastic, so that it is difficult to uniformly level the surface of the metal layer (31) (33) to form voids or holes in the interface, so that the thermal resistance value of the thermally conductive and insulating metal substrate rises.

The thermal conductive insulating metal substrate prepared by the above three processes is limited by the electrical reliability, and the thickness of the thermal conductive insulating layer must be greater than 75 micrometers (μm) or more, and in order to reduce the thermal resistance value of the thermally conductive insulating layer, The thermal conductivity of the thermally conductive insulating layer is increased, so that the volume percentage of the thermally conductive powder to be added needs to be greater than 50%, resulting in poor mechanical strength of the thermally conductive insulating composite material, and being susceptible to external forces to cause holes or cracks, thereby making electricity The reliability of the decline is reduced.

In view of the above-mentioned three kinds of processes, the thermal conductive insulating metal substrate has a thermal insulating layer which is easy to generate holes or voids at the interface, low heat conduction efficiency or poor mechanical strength, and the thermal conductive insulating metal substrate has thermal resistance value. The disadvantage of insufficient rise or electrical reliability is that the present invention is solved by improving the thermally conductive insulating layer.

In order to achieve the above object, the technical means of the present invention is to provide a thermally conductive substrate for electronic components having low thermal resistance, low thermal expansion coefficient and high electrical reliability, comprising: a conductive metal layer; a high electrical reliability a thermally conductive polymer composite layer formed on one side of the conductive metal layer, the high electrical reliability thermal conductive polymer composite layer having a thickness between 1 and 25 microns and a thermal resistance value of less than 0.13 ° C-in ² /W, and the glass transition temperature is greater than 200 ° C; a heat-conducting low-temperature pressure-bonded polymer composite layer formed on one side of the high-electricity reliability thermal conductive polymer composite layer, heat-conducting low-temperature pressure-bonded polymer composite The thickness of the material layer is between 1 and 65 micrometers, and the thermal resistance value is less than 0.1 ° C-in ² /W, and the thermal conductivity can be low-temperature pressed to the polymer composite layer and the high-electricity reliability thermal conductive polymer composite layer The total thickness is greater than 15 microns; a thermally conductive metal substrate layer is pressed against one side of the thermally conductive low temperature pressure bonded polymer composite layer.

Another technical method used in the present invention is to provide a method for manufacturing a heat-conductive substrate for an electronic component having low thermal resistance, low thermal expansion coefficient and high electrical reliability, the method comprising the steps of: providing a conductive metal layer; Forming a high-electricity reliability thermal conductive polymer composite layer on the side: first dispersing the thermal conductive powder in a polymer solution containing a high-reliability reliability resin, and the thermal conductive powder accounts for the high-electricity reliability of the thermal conductive polymer composite layer The percentage is less than 50%, and after mixing, it is a thermally conductive and highly reliable polymer composite solution, which is coated on one side of the conductive metal layer by wet coating technology and passed through at 140-350 ° C. ~60 minutes drying and cyclization process, forming the high-electricity reliability thermal conductive polymer composite layer on the conductive metal layer, the glass transition temperature is greater than 200 ° C; on the side of the high-electricity reliability thermal conductive polymer composite layer Forming a heat-conducting low-temperature pressure-bonding polymer composite material layer: first dispersing the heat conductive powder in a thermoplastic polymer, a thermosetting resin and a crosslinking agent mixed solution, and guiding The powder accounts for between 20% and 70% by volume of the thermally conductive low-temperature pressure-bonded polymer composite layer. After mixing, it becomes a thermally conductive low-temperature pressure-bonded polymer composite solution, which is then wet coated. It is coated on one side of the highly electrically reliable thermally conductive polymer composite layer and dried at 100-160 ° C for 1 to 3 minutes to form a half crosslink on a highly electrically reliable thermally conductive polymer composite layer ( Semi-curing) heat-conducting low-temperature pressure-bonding polymer composite film with a glass transition temperature of less than 120 ° C; pressing a thermally conductive metal substrate layer on one side of the thermally conductive low-temperature pressure-bonded polymer composite layer: first providing a heat conduction a metal substrate layer is disposed on one side of the layer of thermally conductive low-temperature pressure-bonded polymer composite material, and then heat-pressed at 120 ° C to 190 ° C and 55 to 95 Kgf / cm ² for 1 to 2 minutes to make half The cross-linked heat conduction can be low-temperature pressure-bonded polymer composite layer melting and heat-conducting metal substrate layer, and then baked and aged at 160 ° C ~ 200 ° C for 2-8 hours, so that the semi-crosslinked heat conduction can be low temperature pressure bonding The polymer composite layer is completely crosslinked.

The heat-conductive substrate for electronic components with low thermal resistance, low thermal expansion coefficient and high electrical reliability is coated with a high-reliability thermal conductive polymer composite layer and heat conduction by using wet coating technology. Low temperature bonding of the polymer composite layer, thus reducing it with conductive metal layers or thermal gold The pores at the interface of the substrate layer can avoid the disadvantage that the first process in the prior art causes an increase in the thermal resistance value due to the generation of the interfacial pores of the insulating layer, and the wet coating process can make the thermal conductivity of high electrical reliability. The polymer composite material layer and the heat conductive low temperature pressure bonding polymer composite material layer can more easily penetrate into the rough surface of the conductive metal layer or the heat conductive metal substrate layer, thereby increasing the mutual adhesion force, so that the finished product has the third technology in the prior art. The advantages of the finished product of the process, and the use of the wet coating technology, the thermally conductive powder can be more uniformly dispersed in the polymer composite solution through the solution dispersion process, which can solve the prior art process of heating to high temperature to disperse the thermal conductive powder. Disadvantages; In addition, the heat-conducting low-temperature pressure-bonded polymer composite material layer is semi-crosslinked before being completely cross-linked, and the characteristics thereof can avoid the liquidity of the resin slurry at a high temperature being too high in the second process of the prior art. The problem that the uncured slurry overflows the plate.

Referring to the first figure, the heat-conductive substrate for electronic components of the present invention having low thermal resistance, low thermal expansion coefficient and high electrical reliability can be disposed on an electronic component (20) for the electronic component (20). The heat generated during operation is quickly guided away from the electronic component (20). For example, the heat can be conducted to a heat dissipation module (not shown) to be dispersed, and the structure is sequentially stacked to include a conductive metal layer (11). A highly electrically reliable thermally conductive polymer composite layer (12), a thermally conductive low temperature pressure bonded polymer composite layer (13), and a thermally conductive metal substrate layer (14).

The conductive metal layer (11) is made of the same material as the conductive metal layer of the prior art thermally conductive insulated metal substrate. The conductive metal layer (11) can be designed through an etched circuit for carrying electronic components (20) and conducting electronic components. (20) produced Heat.

The high-electricity reliability thermal conductive polymer composite layer (12) is formed on one side of the conductive metal layer (11), as shown in the second figure, and is prepared by first dispersing the thermal conductive powder in a general physical state. The technology (for example, a kneading homogenizer) is dispersed in a polymer solution containing a high-reliability reliability resin, and the thermal conductive powder accounts for less than 50% by volume of the high-electricity reliability thermally conductive polymer composite layer (12). a thermally conductive and highly reliable polymer composite solution solution, and then coating the mixed thermally conductive and highly reliable polymer composite solution onto one side of the conductive metal layer (11) by a wet coating technique The wet coating technique can reduce the pores generated at the interface with the conductive metal layer (11), and then perform the drying and cyclization process at 140-350 ° C for 30-60 minutes, that is, forming on the conductive metal layer (11). The high-electricity reliability thermal conductive polymer composite layer (12) has a thickness of between 1 and 25 microns, a thermal resistance value of less than 0.13 ° C-in ² /W, and a glass transition temperature (Tg) of greater than 200 ° C; The thermally conductive powder may be selected from gold having a particle size of 10 microns or less Nitride, the group consisting of metal oxides, silicon carbide, boron nitride.

The heat-conducting low-temperature pressure-bonded polymer composite material layer (13) is formed on one side of the high-electricity reliability thermal conductive polymer composite material layer (12), as shown in the third figure, and the preparation method is as follows: First, the thermal conductive powder is dispersed in a mixed solution of a thermoplastic polymer, a thermosetting resin and a crosslinking agent by a general physical dispersion technique, and the thermal conductive powder accounts for a volume percentage of the thermally conductive low-temperature pressure-bonded polymer composite layer (13) of 20 Between % and 70%, after mixing, it becomes a thermally conductive low-temperature pressure-bonded polymer composite solution, and then the mixed heat-conducting low-temperature pressure-bonding polymer composite solution is applied to the high-voltage by wet coating technology. The reliability of the thermally conductive polymer composite layer (12) is one side of the layer and dried at 100 to 160 ° C for 1 to 3 minutes, while forming a half crosslink on the highly electrically reliable thermally conductive polymer composite layer (12). (Semi-curing) a thermally conductive low-temperature pressure-bonded polymer composite film having a thickness of between 1 and 65 μm, a thermal resistance value of less than 0.1 ° C-in ² /W, and a glass transition temperature of less than 120 ° C, in addition, Thermal conductivity can be low temperature pressed polymer composite layer (13) The high-reliability thermal conductive polymer composite layer (12) has a total thickness of more than 15 μm; the thermally conductive powder may be selected from metal nitrides, metal oxides, and lanthanum carbide having a particle diameter of less than 10 μm. a group of the thermoplastic polymer, which may be selected from Acrylic copolymer, butadiene copolymer, and polystyrene copolymer having a glass transition temperature of 90 ° C or lower. A group consisting of polystyrene copolymer or polyamide, which is selected from a thermoplastic polymer containing a carboxy group, an amine or a hydroxy group. The crosslinking agent forms a semi-curing polymer film in the solvent drying process; the thermosetting resin is an epoxy resin, and the epoxy resin molecule contains two or more epoxy groups. The epoxy equivalent weight is 100-5000 g/eq., and the cross-linking reaction can be cross-linked with a crosslinking agent or a thermoplastic polymer through a baking cross-linking process. Forming a network polymer; The crosslinking agent may be selected from the group consisting of aromatic or aliphatic groups containing two or more reactive functional groups, and the reactive functional group includes a carboxy group, an anhydride group, and an amine group. ), a hydroxy group or an isocyanate, which can form a semi-cured polymer or a thermosetting resin with a thermoplastic polymer in a solvent drying process. Crosslinking to form a network polymer.

The material of the heat conductive metal substrate layer (14) is the same as that of the heat conductive metal substrate of the prior art heat conductive insulating metal substrate, and is pressed against one side of the heat conductive low temperature pressable polymer composite material layer (13). The method is as follows: firstly, the heat conductive metal substrate layer (14) is placed on one side of the semi-crosslinked thermally conductive low temperature pressure-bonded polymer composite layer (13), and then at 120 ° C to 190 ° C and 55 to 95 Kgf / cm ² Under the condition of thermocompression bonding for 1 to 2 minutes, the semi-crosslinked thermally conductive low-temperature pressure-bonded polymer composite material layer (13) is melted and then adhered to the thermally conductive metal substrate layer (14), due to the semi-crosslinked polymer When the film is pressed at a temperature, it still has considerable fluidity, and can easily penetrate into the rough surface of the heat conductive metal substrate layer (14) during the pressing process, and increase the heat conduction and low temperature pressure bonding polymer composite layer (13) and heat conduction. The bonding force of the metal substrate layer (14) is then baked and aged at 160 ° C to 200 ° C for 2 to 8 hours to completely crosslink the semi-crosslinked thermally conductive low temperature laminated polymer composite layer (13). (full-curing), which constitutes the electron of the invention having low thermal resistance, low thermal expansion coefficient and high electrical reliability A thermally conductive substrate member.

The heat-conductive substrate for electronic components with low thermal resistance, low thermal expansion coefficient and high electrical reliability, the high-electricity reliability thermal conductive polymer composite material layer (12) and the heat-conductive low-temperature pressure-bonding polymer composite material layer ( 13) (hereinafter collectively referred to as the thermally conductive insulating layer (A)) has a thickness of less than 90 μm, and in a preferred embodiment may be less than 75 μm, and the total thermal resistance value of the thermally conductive insulating layer (A) may be lowered to 0.1 ° C-in. ² / W or less, and does not need to increase the thermal conductivity of the thermal conductive layer (A), so the volume percentage of the added thermal powder can be reduced, so that the mechanical strength of the thermal conductive layer (A) increases, and is not susceptible to external forces. In addition, the thermal insulation layer (A) has a total volume resistance of more than 10 ¹³ Ω-cm, has excellent insulation properties, and its coefficient of thermal expansion is in the low temperature range (below 120 ° C). Less than 30ppm/°C, and the coefficient of thermal expansion above 120°C can be less than 50ppm/°C, with good dimensional stability, the breakdown voltage of the thermal insulation layer (A) is more than 3000 volts, and the breakdown voltage per unit thickness is 1.70KV/mil. Above, therefore have Good electrical reliability, in addition, the thermal conductive insulating layer (A) can be immersed in a 288 ° C tin furnace for more than 10 seconds, so the thermal stability is good, and the thermal conductive low temperature pressable polymer composite material layer (13) has a better High elongation, which can buffer thermal stress caused by different thermal expansion coefficients of conductive metal layer (11) and thermal conductive metal substrate layer (14) of different materials during high temperature and low temperature cycle test The environmental reliability of the heat-conductive substrate for electronic components of the present invention having low thermal resistance, low thermal expansion coefficient and high electrical reliability is improved.

The following is a comparison of the characteristics of the thermally conductive substrate produced according to the foregoing embodiment. Since the present invention focuses on the characteristics of the thermally conductive insulating layer (A), it is only for the highly electrically reliable thermally conductive polymer composite layer (12) and heat conduction. The thermal conductive insulating layer (A) composed of the low-temperature pressure-bonded polymer composite material layer (13) is compared, and the properties to be considered are as described in Table 1, wherein the test bonding force is performed using a rolled copper foil of 1/2 Oz. The conductive metal layer (11) and the thermally conductive metal substrate layer (14) are intended to illustrate the adhesion between the thermally conductive insulating layer and the metal layer in various embodiments of the present invention, and the material type of the metal layer is not a limitation of the present invention. Modifications or alterations made without the spirit of creation are the intentions of the author of the creation; Table 1

Table 2 is a summary of the results of the three embodiments of the present invention. The embodiments are implemented according to the contents described in the present invention. Table 3 is a summary of the comparative examples, which is based on the product catalogues of the three commercially available product manufacturers, and the comparative example is According to the Denka product catalogue, the comparative example 2 is based on the Laird product catalogue, and the comparative example 3 is based on the Bergquist product catalogue. The comparative examples listed in the present invention are mainly compared with the embodiment of the present invention, only The results of the operation of the present invention in a preferred state are illustrated by way of illustration and comparison, and no attempt is made to infringe the manufacturer of the comparative example.

Table II

Embodiment 1 to Embodiment 3 of the present invention: the high-electricity reliability thermal conductive polymer composite material layer (12), and the high-electricity reliability polymer resin solution is polyamic acid in the first to third embodiments (Polyamic) a 2-methylethylpyridinone (NMP) polymer solution, which is formed by a solvent drying and heating cyclization process to form a polyimide polymer, and a thermal conductive powder. In the first embodiment, no addition is added, in the second embodiment, 18% of aluminum nitride is added, and in the third embodiment, 25% of boron nitride is added, and the high-electricity reliability thermal conductive polymer composite layer (12) The thickness of the dry film is 12 micrometers in the first embodiment, and 18 micrometers in the second and third embodiments; the heat conduction can pressurize the polymer composite material layer (13) at a low temperature, and the thermoplasticity is high in the first to third embodiments. The molecules are all butyl rubber copolymers, the cross-linking agents are all polyfunctional aromatic amines, and the thermal conductive powders are all aluminum nitride, the addition amount is 40% in each embodiment, and the heat conduction can be low-temperature pressed high. The dry film thickness of the molecular composite layer (13) is 37 microns in the first embodiment and 29 microns in the second embodiment. Example 40 is three microns.

Comparing the first embodiment of the present invention with the first comparative example, it can be seen that the first embodiment does not add a thermal conductive powder, and the total thickness of the thermal conductive insulating layer (A) is only 1/2 of that of the first embodiment, and the thermal conductive layer (A) is hot. The impedance value is similar (about 0.08 ° C - in ² /W), the breakdown voltage of Example 1 (6.93 KV) is greater than that of Comparative Example 1 (6.8 KV), and the unit thickness breakdown voltage of Example 1 (3.54 KV/mil.) Even for 2.08 times of Comparative Example 1 (1.70 KV/mil.), in summary, Embodiment 1 can achieve the same thermal resistance value when the total thickness of the thermally conductive insulating layer (A) is 1/2 of Comparative Example 1. And higher electrical reliability.

Comparing the second embodiment of the present invention with the second comparative example, the second embodiment is that the aluminum nitride thermal conductive powder is added to the high-electricity reliability thermal conductive polymer composite layer (12), and the total thermal conductive layer (A) The thickness is only 1/2 of that of the second example, and the thermal resistance value of the thermal conductive insulating layer (A) is similar (0.053 ° C - in ² /W), and the breaking voltage of the second embodiment and the second comparative example is the same (3.2 KV), and the implementation is performed. The unit thickness breakdown voltage (1.7KV/mil.) of Example 2 is 2.125 times that of Comparative Example 2 (0.8KV/mil.). In summary, after the addition of aluminum nitride (AlN) thermal conductive powder in the third embodiment, The thermal conductivity of the highly conductive reliability thermally conductive polymer composite layer (12) is increased to reduce the total thermal resistance of the thermally conductive insulating layer (A), but the high electrical reliability of the insulating layer can be maintained.

Comparing the third embodiment of the present invention with the second comparative example, the third embodiment is that the boron nitride thermal conductive powder is added to the high-electricity reliability thermal conductive polymer composite layer (12), and the total thermal conductive layer (A) is The thickness is only 0.6 times of that of the second embodiment, and the breakdown voltage (4.63 KV) of the third embodiment is larger than that of the second embodiment (3.2 kV) when the thermal resistance value of the insulating layer is similar (about 0.05 ° C - in. ² /W). The unit thickness reduction voltage (1.99 KV/mil.) of the third is 2.5 times that of the second comparative example (0.8 KV/mil.); and the thickness of the third embodiment is compared with the comparative example 3, and the thickness of the third embodiment is a comparative example. 0.77 times of the three, the thermal impedance of the insulation layer is similar (about 0.05 ° C - in. ² / W), the breakdown voltage per unit thickness is also similar (about 2.0 KV / mil.), in summary, the third embodiment is added After the boron nitride (h-BN) thermal conductive powder, the thermal conductivity and electrical reliability of the highly electrically reliable thermally conductive polymer composite layer (12) can also be improved.

In addition, in all embodiments of the present invention, the thermally conductive low temperature pressable composite layer (13) is interposed between the highly electrically reliable thermally conductive polymer composite layer (12) and the thermally conductive metal substrate layer (14). the bonding force may be up to 1Kg _f / cm or more, and the thermal insulation layer (a) of the thermal expansion coefficient of about 30ppm / ℃ or less, wherein the thermal expansion coefficient values are compared with all Comparative Examples is small, represents a thermally insulating layer according to the present invention ( A) has better thermal dimensional stability than the comparative examples.

The comparison between the embodiment and the comparative example shows that the present invention can maintain the electrical reliability of the entire insulating layer by reducing the thickness of the insulating layer and lower the insulating layer by the highly electrically reliable thermally conductive polymer composite layer (12). The thermal resistance value, in turn, reduces the proportion of the thermally conductive powder in the polymer composite to maintain the mechanical properties of the polymer composite.

In summary, the heat-conductive substrate for electronic components having low thermal resistance, low thermal expansion coefficient and high electrical reliability is suitable for carrying heat-dissipating electronic components, and has the advantages of low thermal resistance and high electrical reliability. In the heating process, the high dimensional stability can improve the reliability of the sheet during the tin-plated lead process for carrying electronic components.

(11)‧‧‧ Conductive metal layer

(12)‧‧‧High electrical reliability thermal polymer composite layer

(13) ‧‧‧ Thermally Conductive Low Temperature Pressing Polymer Composite Layer

(14) ‧‧‧thermal metal substrate layer

(A) ‧‧‧thermal insulation

(20)‧‧‧Electronic components

(31)‧‧‧ Conductive metal layer

(32)‧‧‧ Thermal insulation

(33) ‧‧‧thermal metal layer

(40)‧‧‧Electronic components

The first figure is a cross-sectional view of the present invention.

The second figure is a flow chart for preparing a high-electricity reliability thermal conductive polymer composite layer of the present invention.

The third figure is a flow chart for preparing a thermally conductive low temperature pressure-bonded polymer composite layer according to the present invention.

The fourth figure is a cross-sectional view of a prior art thermally conductive and insulated metal substrate.

(11)‧‧‧ Conductive metal layer

(12)‧‧‧High electrical reliability thermal polymer composite layer

(13) ‧‧‧ Thermally Conductive Low Temperature Pressing Polymer Composite Layer

(14) ‧‧‧thermal metal substrate layer

(20)‧‧‧Electronic components

(A) ‧‧‧thermal insulation

Claims (17)

A heat-conductive substrate for an electronic component having low thermal resistance, low thermal expansion coefficient and high electrical reliability, comprising: a conductive metal layer; a high-electricity reliability thermal conductive polymer composite layer formed on the conductive metal On one side of the layer, the thickness of the highly electrically reliable thermally conductive polymer composite layer is between 1 and 25 microns, the thermal resistance value is less than 0.13 ° C-in ² /W, and the glass transition temperature is greater than 200 ° C; The laminated polymer composite layer is formed on one side of the high-electricity reliability thermal conductive polymer composite layer, and the heat-conductive low-temperature pressure-bonded polymer composite layer has a thickness of between 1 and 65 micrometers, and the heat is The resistance value is less than 0.1 ° C - in ² /W, the thermal conductivity of the low temperature laminated polymer composite layer and the high electrical reliability thermal conductive polymer composite layer has a total thickness of more than 15 micrometers; and a thermally conductive metal substrate layer Pressing on a side surface of the thermally conductive low-temperature pressure-bonded polymer composite material layer; wherein the structure of the high-electricity reliability thermal conductive polymer composite material layer and the heat-conductive low-temperature pressure-bonding polymer composite material layer is below 120 ° C The coefficient of thermal expansion is less than 30 ppm/°C. The thermally conductive substrate of claim 1, wherein the high electrical reliability thermal conductive polymer composite layer and the thermally conductive low temperature pressable polymer composite layer have a total thickness of less than 75 micrometers. The thermally conductive substrate of claim 1, wherein the high thermal reliability thermally conductive polymer composite layer and the thermally conductive low temperature pressure bonded polymer composite layer have a total thermal resistance value of less than 0.1 ° C - in ² / W. The thermally conductive substrate according to claim 1, wherein the structure of the high-electricity reliability thermal conductive polymer composite material layer and the heat-conductive low-temperature pressure-bonding polymer composite material layer have a thermal expansion coefficient of less than 50 ppm at 120 ° C or higher. °C. The thermally conductive substrate according to claim 1, wherein the structure of the high-electricity reliability thermal conductive polymer composite material layer and the heat-conductive low-temperature pressure-bonding polymer composite material layer has a total breakdown voltage of 3,000 volts or more. The thermally conductive substrate according to claim 1, wherein the total electrical resistance of the structure of the high-electricity reliability thermal conductive polymer composite layer and the thermally conductive low-temperature pressure-bonded polymer composite layer is 10 ¹³ Ω-cm. the above. The thermally conductive substrate of claim 1, wherein the thermally conductive low temperature pressure-bonded polymer composite layer is followed by a high electrical reliability thermal conductive polymer composite layer and a thermally conductive metal substrate layer. The force is greater than 1Kg _f /cm. The thermally conductive substrate of claim 1, which can be immersed in a 288 ° C tin furnace for more than 10 seconds. A method for manufacturing a thermally conductive substrate according to any one of claims 1 to 8, wherein the method comprises the steps of: providing a conductive metal layer; forming a high electrical reliability thermal conductive polymer composite on one side of the conductive metal layer Layer: firstly disperse the thermal conductive powder in a polymer solution containing a high-reliability reliability resin, and the thermal conductive powder accounts for less than 50% by volume of the high-electricity reliability thermal conductive polymer composite layer, and is a heat-conducting high-electricity after mixing. The reliability polymer composite solution is coated on one side of the conductive metal layer by wet coating technology, and dried and looped at 140-350 ° C for 30-60 minutes. The high-reliability thermal conductive polymer composite layer is formed on the conductive metal layer; and a thermally conductive low-temperature pressure-bonded polymer composite layer is formed on one side of the high-electricity reliability thermal conductive polymer composite layer: Dispersing the thermal conductive powder in a mixed solution of the thermoplastic polymer, the thermosetting resin and the crosslinking agent, and the thermal conductive powder occupies between 20% and 70% by volume of the thermally conductive low-temperature pressure-bonded polymer composite layer, and after mixing A heat-conducting solution can be pressed at a low temperature to bond the polymer composite solution, and then applied to a side of the high-electricity reliability thermal conductive polymer composite layer by a wet coating technique, and dried at 100 to 160 ° C for 1 to 3 Minutes, and a half-crosslinked thermally conductive low-temperature pressure-bonded polymer composite film formed on a highly electrically reliable thermally conductive polymer composite layer having a glass transition temperature of less than 120 ° C; and a low temperature pressure-bondable polymer at a low temperature a side of the composite material layer is laminated with a heat conductive metal substrate layer; wherein the high electrical reliability polymer layer of the high thermal reliability polymer is a polymer solution of the high electrical reliability resin (Polyamic) polymer solution, the polymer solution was dried and the solvent molecular cyclization process to give a formed polyimide (Polyimide) polymer. The manufacturing method of claim 9, wherein the step of pressing the thermally conductive metal substrate layer on one side of the thermally conductive low-temperature pressure-bondable polymer composite layer first provides a thermally conductive metal substrate layer, and It is disposed on one side of the layer of thermally conductive low-temperature pressure-bonded polymer composite material, and then heat-pressed at 120 ° C to 190 ° C and 55 to 95 Kgf / cm ² for 1 to 2 minutes to make the semi-crosslinked heat conduction low temperature. The laminated polymer layer of the polymer composite material is melted and thermally conductive, and then baked and aged at 160 ° C to 200 ° C for 2 to 8 hours, so that the semi-crosslinked heat conductive low temperature pressure bonding polymer composite layer is completely Cross-linking. The manufacturing method according to claim 10, wherein the thermally conductive powder in the high-electricity reliability thermally conductive polymer composite layer is selected from the group consisting of metal nitrides and metal oxides having a powder particle size of 10 μm or less. a group consisting of boron nitride or tantalum carbide, and the thermally conductive powder in the thermally conductive low temperature pressable polymer composite layer may be selected from metal nitrides, metal oxides having a powder particle size of 10 microns or less. A group of tantalum carbides. The manufacturing method according to any one of claims 9 to 11, wherein the thermal plastic polymer capable of thermally bonding the polymer composite layer at a low temperature is required to contain a carboxy group or an amine group ( Amine) or a hydroxy group, which may be selected from Acrylic copolymer, butadiene copolymer, polystyrene having a glass transition temperature of 90 ° C or less. Group of copolymers or polyamides. The manufacturing method according to any one of claims 9 to 11, wherein the thermosetting resin capable of thermally bonding the polymer composite layer at a low temperature is an epoxy resin, the epoxy resin molecule comprising two or more epoxy functional groups. The epoxy group has an epoxy equivalent weight of 100 to 5000 g/eq. The manufacturing method according to any one of claims 9 to 11, wherein the crosslinking agent for thermally conductively low-temperature-bonding the polymer composite layer is selected from aromatics having two or more reactive functional groups. a group consisting of a class or an aliphatic group, the reactive functional group comprising a carboxyl group (carboxy group), anhydride group, amine, hydroxy group or isocyanate. The method for manufacturing a thermally conductive substrate according to claim 9, wherein the thermal plastic polymer capable of thermally bonding the polymer composite layer at a low temperature is required to contain a carboxy group or an amine group. Or a hydroxy group, which may be selected from Acrylic copolymer, butadiene copolymer, polystyrene copolymer having a glass transition temperature of 90 ° C or lower. Or a group of polyamides. The manufacturing method according to claim 15, wherein the thermosetting resin capable of thermally bonding the polymer composite layer at a low temperature is an epoxy resin, and the epoxy resin molecule comprises two or more epoxy groups. The epoxy equivalent weight is from 100 to 5000 g/eq. The manufacturing method according to claim 16, wherein the crosslinking agent for thermally conductively low-temperature-bonding the polymer composite layer may be selected from an aromatic or aliphatic group having two or more reactive functional groups ( Aliphatic, the reactive functional group comprises a carboxy group, an anhydride group, an amine, a hydroxy group or an isocyanate.