WO2009028399A1 - Semiconductor wafer and method for manufacturing the same - Google Patents
Semiconductor wafer and method for manufacturing the same Download PDFInfo
- Publication number
- WO2009028399A1 WO2009028399A1 PCT/JP2008/064945 JP2008064945W WO2009028399A1 WO 2009028399 A1 WO2009028399 A1 WO 2009028399A1 JP 2008064945 W JP2008064945 W JP 2008064945W WO 2009028399 A1 WO2009028399 A1 WO 2009028399A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon wafer
- small silicon
- wafer pieces
- diameter
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A large diameter wafer having a diameter of 450mm or more is manufactured at high yield and low cost. On a circular quartz glass substrate having a diameter of 450mm or more to be a base material substrate, a plurality of rectangular small silicon wafer pieces are bonded by annealing or the like. After bonding, gaps between the small silicon wafer pieces are filled with polysilicon by depositing the polysilicon by CVD. Furthermore, the surfaces of the small silicon wafer pieces are polished to be a device forming surface. Alternately, a device surface is formed by forming an epitaxial layer on the surfaces of the small silicon wafer pieces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009530076A JP5294087B2 (en) | 2007-08-24 | 2008-08-21 | Semiconductor wafer and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-218956 | 2007-08-24 | ||
JP2007218956 | 2007-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028399A1 true WO2009028399A1 (en) | 2009-03-05 |
Family
ID=40387121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/064945 WO2009028399A1 (en) | 2007-08-24 | 2008-08-21 | Semiconductor wafer and method for manufacturing the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5294087B2 (en) |
TW (1) | TW200914653A (en) |
WO (1) | WO2009028399A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012060430A1 (en) * | 2010-11-05 | 2012-05-10 | シャープ株式会社 | Semiconductor substrate, method for manufacturing semiconductor substrate, thin-film transistor, semiconductor circuit, liquid crystal display device, electroluminescent device, wireless communication device, and light-emitting device |
WO2014020906A1 (en) * | 2012-07-30 | 2014-02-06 | 住友化学株式会社 | Method for manufacturing composite substrate and method for manufacturing semiconductor crystal layer formation substrate |
WO2019017398A1 (en) * | 2017-07-19 | 2019-01-24 | 株式会社テンシックス | Compound-semiconductor substrate and production method therefor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832038A (en) * | 1994-07-15 | 1996-02-02 | Komatsu Electron Metals Co Ltd | Manufacture of stuck soi substrate and stuck soi substrate |
JP2000082643A (en) * | 1999-07-30 | 2000-03-21 | Canon Inc | Semiconductor substrate and manufacture thereof |
JP2003068592A (en) * | 2001-08-22 | 2003-03-07 | Toshiba Corp | Method for producing epitaxial substrate, method for fabricating semiconductor element, and epitaxial substrate |
JP2003324188A (en) * | 2002-04-30 | 2003-11-14 | Ishikawajima Harima Heavy Ind Co Ltd | Method for manufacturing large-area single-crystal silicon substrate |
WO2006114999A1 (en) * | 2005-04-18 | 2006-11-02 | Kyoto University | Compound semiconductor device and method for fabricating compound semiconductor device |
-
2008
- 2008-08-15 TW TW97131098A patent/TW200914653A/en unknown
- 2008-08-21 WO PCT/JP2008/064945 patent/WO2009028399A1/en active Application Filing
- 2008-08-21 JP JP2009530076A patent/JP5294087B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832038A (en) * | 1994-07-15 | 1996-02-02 | Komatsu Electron Metals Co Ltd | Manufacture of stuck soi substrate and stuck soi substrate |
JP2000082643A (en) * | 1999-07-30 | 2000-03-21 | Canon Inc | Semiconductor substrate and manufacture thereof |
JP2003068592A (en) * | 2001-08-22 | 2003-03-07 | Toshiba Corp | Method for producing epitaxial substrate, method for fabricating semiconductor element, and epitaxial substrate |
JP2003324188A (en) * | 2002-04-30 | 2003-11-14 | Ishikawajima Harima Heavy Ind Co Ltd | Method for manufacturing large-area single-crystal silicon substrate |
WO2006114999A1 (en) * | 2005-04-18 | 2006-11-02 | Kyoto University | Compound semiconductor device and method for fabricating compound semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012060430A1 (en) * | 2010-11-05 | 2012-05-10 | シャープ株式会社 | Semiconductor substrate, method for manufacturing semiconductor substrate, thin-film transistor, semiconductor circuit, liquid crystal display device, electroluminescent device, wireless communication device, and light-emitting device |
WO2014020906A1 (en) * | 2012-07-30 | 2014-02-06 | 住友化学株式会社 | Method for manufacturing composite substrate and method for manufacturing semiconductor crystal layer formation substrate |
WO2019017398A1 (en) * | 2017-07-19 | 2019-01-24 | 株式会社テンシックス | Compound-semiconductor substrate and production method therefor |
CN110663096A (en) * | 2017-07-19 | 2020-01-07 | X-Vi株式会社 | Compound semiconductor substrate and method for manufacturing same |
CN110663096B (en) * | 2017-07-19 | 2023-06-06 | X-Vi株式会社 | Compound semiconductor substrate and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009028399A1 (en) | 2010-12-02 |
JP5294087B2 (en) | 2013-09-18 |
TW200914653A (en) | 2009-04-01 |
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