WO2009028337A1 - 熱電変換モジュールおよびその製造方法 - Google Patents

熱電変換モジュールおよびその製造方法 Download PDF

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Publication number
WO2009028337A1
WO2009028337A1 PCT/JP2008/064623 JP2008064623W WO2009028337A1 WO 2009028337 A1 WO2009028337 A1 WO 2009028337A1 JP 2008064623 W JP2008064623 W JP 2008064623W WO 2009028337 A1 WO2009028337 A1 WO 2009028337A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric conversion
material layer
conversion material
type thermoelectric
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064623
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English (en)
French (fr)
Inventor
Masahiro Sasaki
Takanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2009028337A1 publication Critical patent/WO2009028337A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

　熱電変換モジュールは、絶縁層（１２）と、前記絶縁層（１２）の表面に形成され、温度差方向（９０）に沿ってそれぞれ延在し、なおかつ互いに直列に電気的に接続されたｎ型熱電変換材料層（１４）とｐ型熱電変換材料層（１３）とを備える熱電変換モジュールであり、ｎ型熱電変換材料層とｐ型熱電変換材料層とで前記温度差方向に垂直な面で切った断面積が等しい構成の場合に比べて熱電変換モジュール全体の抵抗が小さくなるように、ｎ型熱電変換材料層（１４）およびｐ型熱電変換材料層（１３）のうち抵抗率の高い方の層の前記断面積が抵抗率の低い方の層の前記断面積よりも大きくなっている。
PCT/JP2008/064623 2007-08-27 2008-08-15 熱電変換モジュールおよびその製造方法 Ceased WO2009028337A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-220055 2007-08-27
JP2007220055 2007-08-27

Publications (1)

Publication Number Publication Date
WO2009028337A1 true WO2009028337A1 (ja) 2009-03-05

Family

ID=40387063

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064623 Ceased WO2009028337A1 (ja) 2007-08-27 2008-08-15 熱電変換モジュールおよびその製造方法

Country Status (1)

Country Link
WO (1) WO2009028337A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022092039A1 (ja) * 2020-10-30 2022-05-05 日本ゼオン株式会社 熱電変換モジュール及び熱電変換モジュールの製造方法
CN116325475A (zh) * 2020-09-30 2023-06-23 日本瑞翁株式会社 热电转换模块及热电转换模块的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JP2000286462A (ja) * 1999-03-29 2000-10-13 Sanyo Electric Co Ltd 熱電素子、熱電素子の製造方法
JP2007500951A (ja) * 2003-05-19 2007-01-18 アプライド ディジタル ソリューションズ 低電力熱電発電装置
JP2007095897A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 半導体装置とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JP2000286462A (ja) * 1999-03-29 2000-10-13 Sanyo Electric Co Ltd 熱電素子、熱電素子の製造方法
JP2007500951A (ja) * 2003-05-19 2007-01-18 アプライド ディジタル ソリューションズ 低電力熱電発電装置
JP2007095897A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 半導体装置とその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116325475A (zh) * 2020-09-30 2023-06-23 日本瑞翁株式会社 热电转换模块及热电转换模块的制造方法
WO2022092039A1 (ja) * 2020-10-30 2022-05-05 日本ゼオン株式会社 熱電変換モジュール及び熱電変換モジュールの製造方法
JPWO2022092039A1 (ja) * 2020-10-30 2022-05-05
EP4239698A4 (en) * 2020-10-30 2024-10-09 Zeon Corporation THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE
US12538707B2 (en) 2020-10-30 2026-01-27 Zeon Corporation Thermoelectric conversion module and method of producing thermoelectric conversion module

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