WO2009028256A1 - 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法 - Google Patents
化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法 Download PDFInfo
- Publication number
- WO2009028256A1 WO2009028256A1 PCT/JP2008/061428 JP2008061428W WO2009028256A1 WO 2009028256 A1 WO2009028256 A1 WO 2009028256A1 JP 2008061428 W JP2008061428 W JP 2008061428W WO 2009028256 A1 WO2009028256 A1 WO 2009028256A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aqueous dispersion
- mechanical polishing
- chemical mechanical
- preparation
- composition containing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Abstract
本発明に係る化学機械研磨用水系分散体調製用セットは、コロイダルシリカおよび塩基性化合物を含み、pHが8以上10以下である、第1の組成物と、ポリ(メタ)アクリル酸塩および塩基性化合物を含み、pHが11以上13.5以下である、第2の組成物と、を備えている。さらに、酸化剤を含む、第3の組成物を備えることもできる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009530015A JPWO2009028256A1 (ja) | 2007-08-31 | 2008-06-24 | 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007225415 | 2007-08-31 | ||
JP2007-225415 | 2007-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028256A1 true WO2009028256A1 (ja) | 2009-03-05 |
Family
ID=40386985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061428 WO2009028256A1 (ja) | 2007-08-31 | 2008-06-24 | 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2009028256A1 (ja) |
TW (1) | TW200919568A (ja) |
WO (1) | WO2009028256A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101906346A (zh) * | 2009-06-02 | 2010-12-08 | 日信化学工业株式会社 | 水性切削液和浆 |
JP2020132479A (ja) * | 2019-02-21 | 2020-08-31 | 三菱ケミカル株式会社 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006287207A (ja) * | 2005-03-09 | 2006-10-19 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007060869A1 (ja) * | 2005-11-24 | 2007-05-31 | Jsr Corporation | 化学機械研磨用水系分散体および化学機械研磨方法 |
JP5182483B2 (ja) * | 2005-12-16 | 2013-04-17 | Jsr株式会社 | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
-
2008
- 2008-06-24 JP JP2009530015A patent/JPWO2009028256A1/ja active Pending
- 2008-06-24 WO PCT/JP2008/061428 patent/WO2009028256A1/ja active Application Filing
- 2008-07-21 TW TW97127579A patent/TW200919568A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006287207A (ja) * | 2005-03-09 | 2006-10-19 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101906346A (zh) * | 2009-06-02 | 2010-12-08 | 日信化学工业株式会社 | 水性切削液和浆 |
JP2011012249A (ja) * | 2009-06-02 | 2011-01-20 | Nisshin Chem Ind Co Ltd | 水性切削液及び水性切削剤 |
JP2020132479A (ja) * | 2019-02-21 | 2020-08-31 | 三菱ケミカル株式会社 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200919568A (en) | 2009-05-01 |
JPWO2009028256A1 (ja) | 2010-11-25 |
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