TW200734435A - Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing - Google Patents
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishingInfo
- Publication number
- TW200734435A TW200734435A TW095143163A TW95143163A TW200734435A TW 200734435 A TW200734435 A TW 200734435A TW 095143163 A TW095143163 A TW 095143163A TW 95143163 A TW95143163 A TW 95143163A TW 200734435 A TW200734435 A TW 200734435A
- Authority
- TW
- Taiwan
- Prior art keywords
- mechanical polishing
- chemical mechanical
- aqueous dispersion
- kit
- preparing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Abstract
Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) abrasive grains, (B) an organic acid, (C) an oxidizing agent, (D) a surface active agent and (E) a dispersion medium. In this aqueous dispersion, the above-mentioned (D) the surface active agent has a specific structure.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005338961 | 2005-11-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200734435A true TW200734435A (en) | 2007-09-16 |
Family
ID=38067099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095143163A TW200734435A (en) | 2005-11-24 | 2006-11-22 | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2007060869A1 (en) |
TW (1) | TW200734435A (en) |
WO (1) | WO2007060869A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5013732B2 (en) * | 2006-04-03 | 2012-08-29 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, chemical mechanical polishing kit, and kit for preparing chemical mechanical polishing aqueous dispersion |
JP5196112B2 (en) * | 2007-07-09 | 2013-05-15 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion and method for producing multilayer circuit board |
WO2009028256A1 (en) * | 2007-08-31 | 2009-03-05 | Jsr Corporation | Set for preparation of aqueous dispersion for chemical mechanical polishing and method for preparing aqueous dispersion for chemical mechanical polishing |
WO2009031389A1 (en) * | 2007-09-03 | 2009-03-12 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device |
JP2009164188A (en) * | 2007-12-28 | 2009-07-23 | Fujimi Inc | Polishing composition |
JP5403922B2 (en) | 2008-02-26 | 2014-01-29 | 富士フイルム株式会社 | Polishing liquid and polishing method |
JP5472585B2 (en) | 2008-05-22 | 2014-04-16 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
JP5495508B2 (en) * | 2008-05-23 | 2014-05-21 | 日揮触媒化成株式会社 | Abrasive particle dispersion and method for producing the same |
KR20110090920A (en) * | 2008-11-10 | 2011-08-10 | 아사히 가라스 가부시키가이샤 | Abrasive composition and method for manufacturing semiconductor integrated circuit device |
JP4990300B2 (en) * | 2009-01-14 | 2012-08-01 | パナソニック株式会社 | Manufacturing method of semiconductor device |
JP5493526B2 (en) * | 2009-07-14 | 2014-05-14 | 日立化成株式会社 | Polishing liquid and polishing method for CMP |
JP5493528B2 (en) * | 2009-07-15 | 2014-05-14 | 日立化成株式会社 | CMP polishing liquid and polishing method using this CMP polishing liquid |
CN109690741A (en) * | 2016-06-09 | 2019-04-26 | 日立化成株式会社 | CMP lapping liquid and grinding method |
JP7161894B2 (en) * | 2018-09-04 | 2022-10-27 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing system |
CN115595585A (en) * | 2022-11-10 | 2023-01-13 | 江西省科学院应用物理研究所(Cn) | Preparation method of special metallographic polishing agent for easily-oxidized metal |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4253141B2 (en) * | 2000-08-21 | 2009-04-08 | 株式会社東芝 | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
JP2003077920A (en) * | 2001-09-04 | 2003-03-14 | Nec Corp | Method for forming metal wiring |
JP2005014206A (en) * | 2003-05-30 | 2005-01-20 | Sumitomo Chemical Co Ltd | Metallic abrasive composition |
JP2005045229A (en) * | 2003-07-04 | 2005-02-17 | Jsr Corp | Water dispersion for chemical mechanical polishing and chemical mechanical polishing method |
JP4336550B2 (en) * | 2003-09-09 | 2009-09-30 | 花王株式会社 | Polishing liquid kit for magnetic disk |
JP4667013B2 (en) * | 2003-11-14 | 2011-04-06 | 昭和電工株式会社 | Polishing composition and polishing method |
JP2005302973A (en) * | 2004-04-12 | 2005-10-27 | Jsr Corp | Aqueous dispersant for chemical mechanical polishing, and method for the chemical mechanical polishing |
-
2006
- 2006-11-15 JP JP2007546412A patent/JPWO2007060869A1/en active Pending
- 2006-11-15 WO PCT/JP2006/322765 patent/WO2007060869A1/en active Application Filing
- 2006-11-22 TW TW095143163A patent/TW200734435A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007060869A1 (en) | 2007-05-31 |
JPWO2007060869A1 (en) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200734435A (en) | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing | |
TW200801046A (en) | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing | |
WO2009031389A1 (en) | Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device | |
TW200643156A (en) | Aqueous dispersant for chemical polishing, chemical polishing method, and kit used in preparation of aqueous dispersant for chemical polishing | |
EP1962334A4 (en) | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing | |
EP1757665B8 (en) | Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices | |
TW200628597A (en) | Polishing slurries and methods for chemical mechanical polishing | |
MY160946A (en) | Polishing composition containing polyether amine | |
EP2006890A4 (en) | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing | |
TW200720383A (en) | Polishing fluids and methods for CMP | |
EP1211024A3 (en) | Polishing method | |
EP1950263A3 (en) | Polishing composition and polishing method | |
EP1661961A3 (en) | Metal polishing composition and method of polishing using the same | |
MY145601A (en) | Silicon carbide polishing method utilizing water-soluble oxidizers | |
IN2014MN01903A (en) | ||
WO2005033234A3 (en) | Novel slurry for chemical mechanical polishing of metals | |
MY146015A (en) | Silicon carbide polishing method utilizing water-soluble oxidizers | |
TW200619364A (en) | Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry | |
WO2011028700A3 (en) | Chemical mechanical polishing conditioner | |
TW200734117A (en) | Friction reducing aid for CMP | |
DE602006003258D1 (en) | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method and kit for preparing an aqueous dispersion for chemical mechanical polishing | |
TW200706619A (en) | Polishing composition and method for defect improvement by reduced particle stiction on copper surface | |
TW200617151A (en) | Polishing composition and polishing method using the same | |
TW200626289A (en) | An optimized grooving structure for a CMP polishing pad | |
WO2007099403A3 (en) | Polishing machine comprising a work chamber and a platform |