WO2009020051A1 - 固定治具並びにワークの処理方法 - Google Patents

固定治具並びにワークの処理方法 Download PDF

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Publication number
WO2009020051A1
WO2009020051A1 PCT/JP2008/063797 JP2008063797W WO2009020051A1 WO 2009020051 A1 WO2009020051 A1 WO 2009020051A1 JP 2008063797 W JP2008063797 W JP 2008063797W WO 2009020051 A1 WO2009020051 A1 WO 2009020051A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesion layer
main body
work
tool main
tool
Prior art date
Application number
PCT/JP2008/063797
Other languages
English (en)
French (fr)
Inventor
Takeshi Segawa
Kiyofumi Tanaka
Original Assignee
Lintec Corporation
Shin Etsu Polymer Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation, Shin Etsu Polymer Co., Ltd. filed Critical Lintec Corporation
Priority to CN200880100927.5A priority Critical patent/CN101802999B/zh
Priority to KR1020107002646A priority patent/KR101442305B1/ko
Priority to US12/452,647 priority patent/US8465011B2/en
Publication of WO2009020051A1 publication Critical patent/WO2009020051A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

　板状の治具本体（２）と、ワークＷを着脱自在に密着保持する密着層（３）とから構成され、治具本体は、片面に密着層を支持する複数の支持突起（４）を有すると共に、片面の外周部に支持突起と同等高さの側壁（５）を有し、この側壁の端面に密着層が接着されて、密着層と治具本体との間に区画空間（６）が画成され、治具本体に形成した通気孔（７）を介して区画空間内の空気を吸引することにより、密着層が変形されるようにしたものにおいて、ワークに力が加わるような処理を行う場合にもワークを確実に支持固定できるようにする。治具本体（２）に、密着層（３）側の外面に開口する、区画空間（６）に連通しない吸着孔（８）が形成される。そして、吸着孔（８）に連通する貫通孔（９）を密着層（３）に形成し、吸着孔（８）の真空引きによりワーク（Ｗ）に吸着力を作用させる。
PCT/JP2008/063797 2007-08-09 2008-07-31 固定治具並びにワークの処理方法 WO2009020051A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880100927.5A CN101802999B (zh) 2007-08-09 2008-07-31 固定夹具以及工件的处理方法
KR1020107002646A KR101442305B1 (ko) 2007-08-09 2008-07-31 고정 지그 및 작업물의 처리 방법
US12/452,647 US8465011B2 (en) 2007-08-09 2008-07-31 Fixing jig and method of processing work

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007208264A JP5074125B2 (ja) 2007-08-09 2007-08-09 固定治具並びにワークの処理方法
JP2007-208264 2007-08-09

Publications (1)

Publication Number Publication Date
WO2009020051A1 true WO2009020051A1 (ja) 2009-02-12

Family

ID=40341285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063797 WO2009020051A1 (ja) 2007-08-09 2008-07-31 固定治具並びにワークの処理方法

Country Status (6)

Country Link
US (1) US8465011B2 (ja)
JP (1) JP5074125B2 (ja)
KR (1) KR101442305B1 (ja)
CN (1) CN101802999B (ja)
TW (1) TWI466222B (ja)
WO (1) WO2009020051A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258638A (ja) * 2010-06-07 2011-12-22 Lapis Semiconductor Co Ltd 保護テープ剥離方法
US20120139192A1 (en) * 2010-12-02 2012-06-07 Fuji Electric Co., Ltd. Chucking device and chucking method

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JP5234644B2 (ja) * 2009-03-23 2013-07-10 信越ポリマー株式会社 粘着保持トレー
JP2011003691A (ja) * 2009-06-18 2011-01-06 Okamoto Machine Tool Works Ltd 半導体基板のパッド搬送機構
JP5337620B2 (ja) * 2009-08-05 2013-11-06 信越エンジニアリング株式会社 ワーク粘着保持装置及び真空貼り合わせ機
US20130140838A1 (en) * 2009-12-15 2013-06-06 Solexel, Inc. Mobile vacuum carriers for thin wafer processing
JP5757649B2 (ja) * 2011-02-14 2015-07-29 信越ポリマー株式会社 保持治具
US8960686B2 (en) 2011-09-30 2015-02-24 Electro Scientific Industries, Inc. Controlled surface roughness in vacuum retention
CN103128937B (zh) * 2011-11-24 2015-07-29 深圳市兆威机电有限公司 一种微小塑胶齿轮件的取出方法和装置
TWI437672B (zh) * 2011-12-16 2014-05-11 利用氣體充壓以抑制載板翹曲的載板固定方法
US20140166840A1 (en) * 2012-12-14 2014-06-19 Intermolecular, Inc. Substrate Carrier
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
JP6120748B2 (ja) * 2013-10-11 2017-04-26 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6283573B2 (ja) 2014-06-03 2018-02-21 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2018056159A (ja) * 2016-09-26 2018-04-05 セイコーエプソン株式会社 粘着テープ剥離治具、半導体チップの製造装置、ｍｅｍｓデバイスの製造装置、液体噴射ヘッドの製造装置、および、粘着テープ剥離方法
CN106378730A (zh) * 2016-11-24 2017-02-08 南京中电熊猫晶体科技有限公司 一种负压吸附夹具装置
CN106826510A (zh) * 2016-12-30 2017-06-13 郑州晶润光电技术有限公司 一种晶片扫光工艺
WO2019022293A1 (ko) * 2017-07-27 2019-01-31 주식회사 스마테크 플렉시블 기판의 흡착보호용 복합시트
EP4227010A1 (en) * 2020-10-05 2023-08-16 Creative Coatings Co., Ltd. Positioning jig assembly, positioning jig, positioning method for electronic component body, and method for mounting same to transport jig

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WO2005109489A1 (ja) * 2004-05-07 2005-11-17 Shin-Etsu Engineering Co., Ltd. ワーク除電方法及びその装置
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法

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JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258638A (ja) * 2010-06-07 2011-12-22 Lapis Semiconductor Co Ltd 保護テープ剥離方法
US20120139192A1 (en) * 2010-12-02 2012-06-07 Fuji Electric Co., Ltd. Chucking device and chucking method
US9233455B2 (en) * 2010-12-02 2016-01-12 Fuji Electric Co., Ltd. Chucking device and chucking method

Also Published As

Publication number Publication date
US20100164155A1 (en) 2010-07-01
TW200926347A (en) 2009-06-16
KR20100058457A (ko) 2010-06-03
JP5074125B2 (ja) 2012-11-14
JP2009043996A (ja) 2009-02-26
US8465011B2 (en) 2013-06-18
TWI466222B (zh) 2014-12-21
CN101802999B (zh) 2014-02-05
CN101802999A (zh) 2010-08-11
KR101442305B1 (ko) 2014-09-23

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