WO2009019987A1 - 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤 - Google Patents

基板処理方法、基板処理装置、プログラム、記録媒体および置換剤 Download PDF

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Publication number
WO2009019987A1
WO2009019987A1 PCT/JP2008/063263 JP2008063263W WO2009019987A1 WO 2009019987 A1 WO2009019987 A1 WO 2009019987A1 JP 2008063263 W JP2008063263 W JP 2008063263W WO 2009019987 A1 WO2009019987 A1 WO 2009019987A1
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WO
WIPO (PCT)
Prior art keywords
substrate processing
liquid
processing
substituting
substrate
Prior art date
Application number
PCT/JP2008/063263
Other languages
English (en)
French (fr)
Inventor
Koukichi Hiroshiro
Takayuki Toshima
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US12/671,338 priority Critical patent/US20100206337A1/en
Publication of WO2009019987A1 publication Critical patent/WO2009019987A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

　複数種類の液体を用いる基板処理方法において、液体を用いた処理の後に基板上に残留している当該液体を、次に使用される液体によって迅速かつより確実に置換することができる基板処理方法を提供する。基板処理方法は、処理液によって基板Ｗを処理する工程と、基板上に置換液を供給し、基板上に残留する処理液を置換液で置換する工程と、を備える。置換する工程に用いられる置換液は、処理液の表面張力よりも小さい表面張力を有し、かつ、処理液の密度と同一の密度を有する。
PCT/JP2008/063263 2007-08-03 2008-07-24 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤 WO2009019987A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/671,338 US20100206337A1 (en) 2007-08-03 2008-07-24 Substrate processing method, substrate processing apparatus, program, storage medium, and substitute agent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-202835 2007-08-03
JP2007202835A JP4994990B2 (ja) 2007-08-03 2007-08-03 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤

Publications (1)

Publication Number Publication Date
WO2009019987A1 true WO2009019987A1 (ja) 2009-02-12

Family

ID=40341223

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063263 WO2009019987A1 (ja) 2007-08-03 2008-07-24 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤

Country Status (5)

Country Link
US (1) US20100206337A1 (ja)
JP (1) JP4994990B2 (ja)
KR (1) KR20100049046A (ja)
TW (1) TWI408737B (ja)
WO (1) WO2009019987A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120073599A1 (en) * 2010-09-29 2012-03-29 Katsuhiko Miya Apparatus for and method of processing substrate
JP2016186971A (ja) * 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5297959B2 (ja) * 2009-09-18 2013-09-25 大日本スクリーン製造株式会社 基板乾燥方法及び基板乾燥装置
JP5859888B2 (ja) * 2012-03-26 2016-02-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6068029B2 (ja) * 2012-07-18 2017-01-25 株式会社東芝 基板処理方法、基板処理装置および記憶媒体
JP6585243B2 (ja) * 2013-09-30 2019-10-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6426927B2 (ja) * 2013-09-30 2018-11-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6454245B2 (ja) * 2014-10-21 2019-01-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6325182B2 (ja) * 2015-12-21 2018-05-23 株式会社東京精密 切断用ブレードの製造方法、及び切断用ブレード
EP3282474B1 (en) * 2016-08-11 2021-08-04 IMEC vzw Method for performing a wet treatment of a substrate
JP6411571B2 (ja) * 2017-03-27 2018-10-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
US20200176278A1 (en) * 2018-12-04 2020-06-04 Nanya Technology Corporation Wafer drying equipment and method thereof
TWI726728B (zh) * 2020-05-22 2021-05-01 辛耘企業股份有限公司 晶圓清洗裝置
KR102587371B1 (ko) * 2020-12-21 2023-10-12 주식회사 뉴파워 프라즈마 리프팅 커버 도어를 포함하는 글라스 세정 챔버, 이를 포함하는 글라스 화학 강화 설비, 및 초박형 글라스의 화학 강화 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297794A (ja) * 2002-03-29 2003-10-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351082B2 (ja) * 1994-01-14 2002-11-25 ソニー株式会社 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法
US5733416A (en) * 1996-02-22 1998-03-31 Entropic Systems, Inc. Process for water displacement and component recycling
US6165560A (en) * 1997-05-30 2000-12-26 Micell Technologies Surface treatment
US6344243B1 (en) * 1997-05-30 2002-02-05 Micell Technologies, Inc. Surface treatment
US5974689A (en) * 1997-09-23 1999-11-02 Gary W. Farrell Chemical drying and cleaning system
EP1168422B1 (en) * 2000-06-27 2009-12-16 Imec Method and apparatus for liquid-treating and drying a substrate
US7119025B2 (en) * 2004-04-08 2006-10-10 Micron Technology, Inc. Methods of eliminating pattern collapse on photoresist patterns
JP4612424B2 (ja) * 2005-01-12 2011-01-12 富士通セミコンダクター株式会社 基板処理方法および半導体装置の製造方法
JP2007158270A (ja) * 2005-12-08 2007-06-21 Ses Co Ltd 枚葉式基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297794A (ja) * 2002-03-29 2003-10-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120073599A1 (en) * 2010-09-29 2012-03-29 Katsuhiko Miya Apparatus for and method of processing substrate
JP2016186971A (ja) * 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10549322B2 (en) 2015-03-27 2020-02-04 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
TWI408737B (zh) 2013-09-11
JP4994990B2 (ja) 2012-08-08
US20100206337A1 (en) 2010-08-19
JP2009038282A (ja) 2009-02-19
KR20100049046A (ko) 2010-05-11
TW200908105A (en) 2009-02-16

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