WO2009019787A1 - 有機半導体装置用樹脂基板 - Google Patents
有機半導体装置用樹脂基板 Download PDFInfo
- Publication number
- WO2009019787A1 WO2009019787A1 PCT/JP2007/065631 JP2007065631W WO2009019787A1 WO 2009019787 A1 WO2009019787 A1 WO 2009019787A1 JP 2007065631 W JP2007065631 W JP 2007065631W WO 2009019787 A1 WO2009019787 A1 WO 2009019787A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- main face
- resin substrate
- semiconductor device
- organic semiconductor
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Thin Film Transistor (AREA)
Abstract
本発明の高い形状保存性を有する有機半導体装置用樹脂基板は、単一の樹脂材料からなり第1主面と第2主面とで画定され、第1主面と第2主面で樹脂材料の線膨張係数が異なる樹脂基板を有し、樹脂材料の線膨張係数が第1主面から第2主面までの厚さに対応して連続的に変化している。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/065631 WO2009019787A1 (ja) | 2007-08-09 | 2007-08-09 | 有機半導体装置用樹脂基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/065631 WO2009019787A1 (ja) | 2007-08-09 | 2007-08-09 | 有機半導体装置用樹脂基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009019787A1 true WO2009019787A1 (ja) | 2009-02-12 |
Family
ID=40341035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/065631 Ceased WO2009019787A1 (ja) | 2007-08-09 | 2007-08-09 | 有機半導体装置用樹脂基板 |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2009019787A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013003538A (ja) * | 2011-06-21 | 2013-01-07 | Japan Display Central Co Ltd | 基板、基板を備えた表示装置及び基板の製造方法 |
| CN111403351A (zh) * | 2018-12-26 | 2020-07-10 | 三菱电机株式会社 | 半导体模块、其制造方法以及电力变换装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214723A (ja) * | 1994-02-04 | 1995-08-15 | Kawasaki Heavy Ind Ltd | 熱遮蔽材料 |
| JP2001230558A (ja) * | 2000-02-14 | 2001-08-24 | Mitsubishi Electric Corp | 炭素繊維を含むアルミニウム筐体 |
| JP2002359341A (ja) * | 2001-05-31 | 2002-12-13 | Hitachi Ltd | 半導体モジュールおよびその製造方法 |
| JP2005140818A (ja) * | 2003-11-04 | 2005-06-02 | Sharp Corp | 表示装置およびその製造方法 |
| JP2005153273A (ja) * | 2003-11-25 | 2005-06-16 | Nitto Denko Corp | 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板 |
| JP2006323373A (ja) * | 2005-04-18 | 2006-11-30 | Sumitomo Chemical Co Ltd | 表示素子用基板 |
| JP2007065644A (ja) * | 2005-08-03 | 2007-03-15 | Asahi Kasei Corp | ディスプレイ用基板及びディスプレイ並びにそれらの製造方法 |
| JP2007116087A (ja) * | 2005-09-26 | 2007-05-10 | Tdk Corp | 熱電素子 |
| JP2007190844A (ja) * | 2006-01-20 | 2007-08-02 | Konica Minolta Holdings Inc | ガスバリア性樹脂基材および有機エレクトロルミネッセンスデバイス |
-
2007
- 2007-08-09 WO PCT/JP2007/065631 patent/WO2009019787A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214723A (ja) * | 1994-02-04 | 1995-08-15 | Kawasaki Heavy Ind Ltd | 熱遮蔽材料 |
| JP2001230558A (ja) * | 2000-02-14 | 2001-08-24 | Mitsubishi Electric Corp | 炭素繊維を含むアルミニウム筐体 |
| JP2002359341A (ja) * | 2001-05-31 | 2002-12-13 | Hitachi Ltd | 半導体モジュールおよびその製造方法 |
| JP2005140818A (ja) * | 2003-11-04 | 2005-06-02 | Sharp Corp | 表示装置およびその製造方法 |
| JP2005153273A (ja) * | 2003-11-25 | 2005-06-16 | Nitto Denko Corp | 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板 |
| JP2006323373A (ja) * | 2005-04-18 | 2006-11-30 | Sumitomo Chemical Co Ltd | 表示素子用基板 |
| JP2007065644A (ja) * | 2005-08-03 | 2007-03-15 | Asahi Kasei Corp | ディスプレイ用基板及びディスプレイ並びにそれらの製造方法 |
| JP2007116087A (ja) * | 2005-09-26 | 2007-05-10 | Tdk Corp | 熱電素子 |
| JP2007190844A (ja) * | 2006-01-20 | 2007-08-02 | Konica Minolta Holdings Inc | ガスバリア性樹脂基材および有機エレクトロルミネッセンスデバイス |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013003538A (ja) * | 2011-06-21 | 2013-01-07 | Japan Display Central Co Ltd | 基板、基板を備えた表示装置及び基板の製造方法 |
| CN111403351A (zh) * | 2018-12-26 | 2020-07-10 | 三菱电机株式会社 | 半导体模块、其制造方法以及电力变换装置 |
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