WO2009013409A2 - Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple - Google Patents
Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple Download PDFInfo
- Publication number
- WO2009013409A2 WO2009013409A2 PCT/FR2008/000867 FR2008000867W WO2009013409A2 WO 2009013409 A2 WO2009013409 A2 WO 2009013409A2 FR 2008000867 W FR2008000867 W FR 2008000867W WO 2009013409 A2 WO2009013409 A2 WO 2009013409A2
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- chips
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Classifications
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- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- the invention relates to a method for manufacturing an assembly of chips mechanically connected by means of a flexible connection, the method comprising: the production, on a substrate, of chips, each comprising a reception zone,
- microelectronic chip When a microelectronic chip can not respond alone to a specific function, the latter is usually connected to one or more other chips to obtain the desired functionality.
- This first approach consisting in making the connection on a rigid support, is conventionally used when there is a great complexity in the connection of the chips.
- this approach has the main disadvantage of using a mechanical support rigid which is particularly poorly suited for integration into flexible structures.
- a second approach described in WO-A-02/084617 is to integrate chips on a set of fibers or wire elements to achieve a device. This integration of the chips within the fibers can be carried out by coating. The different chips can be connected together by means of conductive filaments that can also be embedded or integrated within the fiber itself. However, this document does not indicate how to fix the filaments of conductive material between the different chips and the coating on the fibers.
- the invention relates to a method for producing an assembly of chips mechanically connected to each other, in a flexible manner, which is easy to implement.
- the reception area is constituted by a groove
- the connecting element is a wire which is embedded in said groove for producing said flexible connection means
- FIGS. 4 and 5 show a diagrammatic sectional view of the successive steps of a second embodiment according to the invention
- FIG. 6 is a diagrammatic sectional view of a third embodiment according to FIG. 'invention
- FIGS. 7 and 8 show a diagrammatic view, in section, of the successive steps of a fourth embodiment according to the invention.
- FIG. 9 represents a schematic view, in plan view, of FIG. 8, after photolithography
- a plurality of microelectronic chips 2 are integrated on a substrate 1, which may be a silicon substrate.
- the chips 2 may be identical or not.
- a conventional photolithography step is performed to delimit by means of a photosensitive resin 3, a reception zone 4 on each microelectronic chip 2.
- a fixing agent which may be glue 5 is deposited on the reception areas 4.
- a connecting element 6 is then attached to each chip 2 by means of the glue 5 to connect the chips together.
- the connecting element 6 is of linear form. It can have a round or square section and be constituted by a wire or a set of wires.
- the connecting element 6 may be made of an insulating material, for example natural or synthetic fiber. In the latter case, it may, for example, be constituted by a polymer, such as polyester or polyamide.
- the connecting element 6 is advantageously made of conductive material, for example metal, to provide an electrical connection between the chips 2.
- the adhesive 5 is advantageously conductive and the reception zone 4 may contain a zone of contact which makes the electrical connection with the components of the chip 2.
- the length of the connecting element 6 connecting two reception areas 4 and, therefore, two chips 2, is a function of their future use.
- the length of the connecting element 6 between two reception areas may be greater than the distance initially separating the two reception areas 4 (see Figure 6).
- longer lengths of the connecting element 6 are desirable to allow storage of the chips 2 later, for example in a coil or roll, or if the chips 2 use the connecting element as a antenna.
- the connecting element 6 can form a loop between two reception areas 4.
- the substrate 1 is then structured so as to separate, from each other, the chips 2 and the corresponding part of the substrate 1.
- the chips 2 are then connected in series only by a flexible mechanical connection by means of of the connecting element 6.
- the separation of the chips 2 is carried out in the case of a solid substrate 1 in a conventional manner, for example by sawing, taking care not to cut the connecting element 6.
- chips 2 having different functionalities can be connected to each other. to others. These chips 2 can then be integrated on the same substrate 1 or on different substrates and then connected by means of a single connecting element 6.
- a temporary support 7, constituting a holding film, is initially deposited on the face of the substrate 1 opposite to that comprising the chips 2.
- the chips 2 are separated from one another at the level of the substrate 1, after formation of the reception zones 4 in the resin. They nevertheless remain mechanically secured to one another via the temporary support 7.
- This partial separation of the chips 2 is achieved by any suitable method, for example, by sawing or by plasma etching.
- the connecting element 6 is then, as previously, fixed to each of the chips 2 on the reception area 4.
- the temporary support 7 is then removed and the chips 2 are no longer connected between they only by means of the flexible mechanical connection constituted by the connecting element 6, as in FIG.
- the chips 2 are integrated on a substrate on insulator (SOI).
- SOI substrate on insulator
- the active substrate 8 can be assimilated to the substrate 1 while the buried insulator 9 and the support substrate 10 constitute a support provisional.
- the chips 2 have already been partially disconnected at the level of the active substrate 8 and the connection element 6 fixed to each of the chips 2.
- the chips can then be detached from the temporary support constituted by the buried insulator 9 and the support substrate 10, for example by wet etching of the buried insulator 9 in particular by means of hydrofluoric acid. It is also possible to separate the temporary support by cleavage, the latter is then secured to the chip, but no longer provides any mechanical function. As previously, the chips 2 remain connected to each other only by the connecting element 6.
- the connecting element 6 is fixed by welding and not by gluing, to each chip 2 at a contact zone of the chip, for example in the form of a stud.
- the contact zone constitutes the reception zone 4 and the steps of depositing a photoresist 3 and forming the reception areas by photolithography are eliminated.
- the connecting element 6 is preferably maintained on the contact zone and an ultrasonic vibration is exerted in order to perform the welding. The operation is then repeated on each contact zone to perform the various welds.
- the connecting element 6 is to serve as an electrical connection between the chips 2, it is made of conductive material, preferably metal, and the contact zone of the chip is also made of conductive material, preferably metal.
- the welding can, as in Figure 2, be performed before cutting chips or, as in Figures 4 and 6, after partial die cutting, before removal of the temporary substrate (7 or 9 and 10).
- This welding can also be carried out, for example, by adding material, by plasma, by electrolysis, by sputtering, etc.
- the chips 2 are integrated on a substrate on insulator. Fixing the connecting element 6 is not performed by welding or gluing. The chips 2 are separated from one another at the level of the active substrate layer 8 by standard sawing or by dry etching until the buried insulator 9. Then, a filling material 11, for example a resin, fills the lines of thus formed in the layer 8. In the example shown in FIGS.
- the filling material 11 fills the entire space between the two chips 2.
- a layer 12 formed by the connecting material for constituting the connecting elements is then deposited on the assembly thus obtained ( Figure 8).
- the bonding material 12 may be conductive or insulating, for example of the mineral type, for example of nitride or silicon oxide, or of organic type, for example parylene®.
- This deposit is structured conventionally, for example by photolithography and plasma etching to form a conductive or insulating track constituting the connecting element 6 connecting the chips together at their reception areas 4 formed by the contact pads, as illustrated in plan view in FIG. 9.
- the filling material 11 is then eliminated by any suitable method and the chips 2 are separated from their support, for example by elimination of the buried insulator 9.
- a reception zone 4 consists of at least one recess made in the chip 2, preferably next to the microelectronic components.
- the recess may, for example, be a groove or a hole. Multiple shapes of grooves or holes are possible in particular with a square base, in
- V, V truncated or in an arc The dimensions as well as the shape of the recess will be chosen preferentially according to the characteristics of the connecting element 6.
- the depth and the width of a groove may vary in a range from 20 to 100 ⁇ m for a connecting element 6 of 20 to 100 ⁇ m in diameter.
- the recesses can be made by any suitable technique, for example, by dry etching, sawing or else by means of wet etching, for example with a KOH solution.
- a flexible, wire-shaped connecting element 6 is then embedded in each of the grooves, of square section in FIG. 10.
- the connecting element 6 is electrically conductive, it is advantageously coated with a layer of insulating material 13, so as to avoid any short circuit with the substrate 1.
- an electrical isolation of the groove can be achieved by any known method.
- the insulating material 13 is a thermosetting polymer, a hot insertion is preferably used to facilitate the embedding and to stick the connecting element 6 inside the groove.
- the chips 2 are then conventionally disconnected from the support layer and are connected to each other only by a flexible connection by means of the connecting element 6.
- an additional electrical connection step between the connecting element 6 and the chip 2 is carried out in the case where an electrical connection of the chip 2 with the outside must be carried out by means of the element link 6.
- the electrical connection between the element 6 and a contact pad of the chip 2 can be made in the form of a conductive track 14 by any known means, for example by inkjet, screen printing, or use of a conductive glue.
- the electrical connection can also be made, for example, by means of a conductive layer which is deposited on an inner portion of the groove.
- the electrical connection can also be provided by means of a conductive layer which serves as a barrier layer during the formation of the embedment groove of the wire (electrical connection by the bottom of the groove) or which is etched during the formation of the groove (electrical connection by the edge of the groove). All these embodiments are intended to transmit a current between the wire which is conductive and the chip.
- each chip has two grooves and that two link elements then connect each chip. The chip then has an additional groove.
- This embodiment can be advantageously used with a substrate which comprises a temporary film, for example an SOI substrate, in a manner similar to that described in the preceding embodiments.
- the separation of the SOI substrate can then be carried out as previously by etching a buried dielectric or by cleaving the substrate.
- a large number of chips 2, formed on the same wafer can be connected in series to each other by at least one flexible connecting element and disengaged from each other.
- a chip assembly is thus obtained in the form of a flexible garland, which can be stored in the form of a reel or roll and cut on demand.
- the assembly is advantageously coated with a polymer or any other protective material vis-à-vis the attacks of the external environment.
- This type of assembly can, for example, be advantageously used to equip antennas RFID chips.
- a plurality of chips 2, of the RFID type, are thus formed and connected by a flexible, conductive connecting element 6.
- the length of the connecting element 6 separating two chips 2 advantageously corresponds to the useful length of the antenna.
- the sectioning of the connecting element 6 is then made between two chips 2 and provides RFID chips with their antennas.
- the invention is not limited to the embodiments described above.
- different types of chips coming from separate substrates can be connected by the same connecting element 6 thus making it possible to produce complex functionalities.
- the manufacture of an assembly may use a combination of the features described above in connection with the different embodiments.
- the invention is not limited to the embodiments described above, and comprises another variant embodiment (not represented), in which the chip assembly is not produced by means of the same wire which is connected to all chips or has a lot of chips.
- the chip assembly is not produced by means of the same wire which is connected to all chips or has a lot of chips.
- two consecutive chips are connected to each other by means of at least one elementary wire.
- an elementary wire is connected to two chips and each elementary wire of the chip assembly provides the flexible connection of the assembly.
- the chips being connected two by two by an elementary wire it is easier to achieve functionalization of chip assembly, that is to say the association of chips in a desired order to allow obtaining the desired technological functions. It is then possible for the same groove to accommodate two different elementary wires at each of its ends and for these wires to be each connected to a different conducting zone.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Transmitters (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Die Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Led Device Packages (AREA)
- Multi-Conductor Connections (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2010512741A JP5405457B2 (ja) | 2007-06-21 | 2008-06-20 | フレキシブルな接続によって機械的に相互接続された複数のチップからなるセットを生成する方法 |
EP20080826649 EP2158605B1 (fr) | 2007-06-21 | 2008-06-20 | Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple |
CN2008800212154A CN101681887B (zh) | 2007-06-21 | 2008-06-20 | 通过柔性连接而机械互连的成套芯片的制造方法 |
DE200860003224 DE602008003224D1 (de) | 2007-06-21 | 2008-06-20 | Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips |
US12/452,137 US8258011B2 (en) | 2007-06-21 | 2008-06-20 | Method for producing a set of chips mechanically interconnected by means of a flexible connection |
AT08826649T ATE486367T1 (de) | 2007-06-21 | 2008-06-20 | Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips |
Applications Claiming Priority (2)
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FR0704445 | 2007-06-21 | ||
FR0704445A FR2917895B1 (fr) | 2007-06-21 | 2007-06-21 | Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple |
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WO2009013409A2 true WO2009013409A2 (fr) | 2009-01-29 |
WO2009013409A3 WO2009013409A3 (fr) | 2009-05-22 |
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PCT/FR2008/051079 WO2009004243A2 (fr) | 2007-06-21 | 2008-06-18 | Assemblage de puces radiofrequence |
PCT/FR2008/000867 WO2009013409A2 (fr) | 2007-06-21 | 2008-06-20 | Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple |
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PCT/FR2008/051079 WO2009004243A2 (fr) | 2007-06-21 | 2008-06-18 | Assemblage de puces radiofrequence |
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US (2) | US8471773B2 (fr) |
EP (2) | EP2158604B1 (fr) |
JP (2) | JP5385900B2 (fr) |
CN (2) | CN101711430B (fr) |
AT (1) | ATE486367T1 (fr) |
DE (1) | DE602008003224D1 (fr) |
ES (1) | ES2355180T3 (fr) |
FR (1) | FR2917895B1 (fr) |
WO (2) | WO2009004243A2 (fr) |
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WO2010125320A1 (fr) | 2009-04-30 | 2010-11-04 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé de fixation d'un composant électronique sur un produit |
WO2013114009A1 (fr) | 2012-01-31 | 2013-08-08 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Procédé d'assemblage d'un élément à puce micro-électronique sur un élément filaire, installation permettant de réaliser l'assemblage |
US8611101B2 (en) | 2008-10-21 | 2013-12-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly |
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WO2002084617A1 (fr) * | 2001-04-10 | 2002-10-24 | Philip Noel Leonard | Systemes electroniques incorpores dans des fils ou fibres textiles |
WO2003021679A2 (fr) * | 2001-09-03 | 2003-03-13 | National Microelectronic Research Centre University College Cork - National University Of Ireland Cork | Structure de circuit integre et son procede de fabrication |
US20030157783A1 (en) * | 2002-01-11 | 2003-08-21 | The Penn State Research Foundation | Use of sacrificial layers in the manufacture of high performance systems on tailored substrates |
US20050026328A1 (en) * | 2003-07-31 | 2005-02-03 | Shinko Electric Industries Co., Ltd. | Process for manufacturing semiconductor device |
WO2005048302A2 (fr) * | 2003-11-05 | 2005-05-26 | California Institute Of Technology | Procede d'integration de structures de puces prefabriquees dans des systemes electroniques fonctionnels |
WO2006089439A1 (fr) * | 2005-02-23 | 2006-08-31 | Textilma Ag | Transpondeur-fil et utilisation |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8611101B2 (en) | 2008-10-21 | 2013-12-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly |
WO2010125320A1 (fr) | 2009-04-30 | 2010-11-04 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé de fixation d'un composant électronique sur un produit |
WO2013114009A1 (fr) | 2012-01-31 | 2013-08-08 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Procédé d'assemblage d'un élément à puce micro-électronique sur un élément filaire, installation permettant de réaliser l'assemblage |
US9953953B2 (en) | 2012-01-31 | 2018-04-24 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed |
Also Published As
Publication number | Publication date |
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JP2010530584A (ja) | 2010-09-09 |
CN101711430B (zh) | 2013-10-16 |
CN101711430A (zh) | 2010-05-19 |
ES2355180T3 (es) | 2011-03-23 |
US20100245182A1 (en) | 2010-09-30 |
US20100136746A1 (en) | 2010-06-03 |
FR2917895B1 (fr) | 2010-04-09 |
JP2010530630A (ja) | 2010-09-09 |
JP5405457B2 (ja) | 2014-02-05 |
ATE486367T1 (de) | 2010-11-15 |
US8471773B2 (en) | 2013-06-25 |
EP2158604B1 (fr) | 2016-10-19 |
CN101681887A (zh) | 2010-03-24 |
WO2009004243A3 (fr) | 2009-05-14 |
FR2917895A1 (fr) | 2008-12-26 |
JP5385900B2 (ja) | 2014-01-08 |
WO2009013409A3 (fr) | 2009-05-22 |
WO2009004243A2 (fr) | 2009-01-08 |
EP2158605A2 (fr) | 2010-03-03 |
EP2158604A2 (fr) | 2010-03-03 |
CN101681887B (zh) | 2011-08-10 |
EP2158605B1 (fr) | 2010-10-27 |
WO2009004243A4 (fr) | 2009-07-23 |
US8258011B2 (en) | 2012-09-04 |
DE602008003224D1 (de) | 2010-12-09 |
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