WO2009011015A1 - 高周波誘導加熱装置およびプラズマｃｖｄ装置 - Google Patents

高周波誘導加熱装置およびプラズマｃｖｄ装置 Download PDF

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Publication number
WO2009011015A1
WO2009011015A1 PCT/JP2007/063964 JP2007063964W WO2009011015A1 WO 2009011015 A1 WO2009011015 A1 WO 2009011015A1 JP 2007063964 W JP2007063964 W JP 2007063964W WO 2009011015 A1 WO2009011015 A1 WO 2009011015A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating
frequency induction
work coil
heat insulating
induction heating
Prior art date
Application number
PCT/JP2007/063964
Other languages
English (en)
French (fr)
Inventor
Masayasu Suzuki
Itsuo Yuzurihara
Toyoaki Suenaga
Ko Masada
Hiroshi Hamanaka
Original Assignee
Shimadzu Corporation
Kyosan Electric Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corporation, Kyosan Electric Mfg. Co., Ltd. filed Critical Shimadzu Corporation
Priority to JP2009523455A priority Critical patent/JPWO2009011015A1/ja
Priority to PCT/JP2007/063964 priority patent/WO2009011015A1/ja
Publication of WO2009011015A1 publication Critical patent/WO2009011015A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Treatment Of Fiber Materials (AREA)
  • General Induction Heating (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

ワークコイルと被加熱体との間に反射特性を有する断熱性繊維材を配置することによって、相互の放射伝熱を抑制すると共に断熱効果を奏することで、被加熱体とワークコイルの相互の放射伝熱による干渉を低減させる。高周波誘導加熱装置は、減圧環境で使用する高周波誘導加熱作用を利用した加熱機構において、高周波電力の供給を受け、高周波誘導によって被加熱部に誘導電流を流して加熱する平面螺旋状のワークコイルを備え、ワークコイルと被加熱部との間に反射特性を有する断熱性繊維材を配置する。
PCT/JP2007/063964 2007-07-13 2007-07-13 高周波誘導加熱装置およびプラズマｃｖｄ装置 WO2009011015A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009523455A JPWO2009011015A1 (ja) 2007-07-13 2007-07-13 高周波誘導加熱装置およびプラズマｃｖｄ装置
PCT/JP2007/063964 WO2009011015A1 (ja) 2007-07-13 2007-07-13 高周波誘導加熱装置およびプラズマｃｖｄ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/063964 WO2009011015A1 (ja) 2007-07-13 2007-07-13 高周波誘導加熱装置およびプラズマｃｖｄ装置

Publications (1)

Publication Number Publication Date
WO2009011015A1 true WO2009011015A1 (ja) 2009-01-22

Family

ID=40259364

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063964 WO2009011015A1 (ja) 2007-07-13 2007-07-13 高周波誘導加熱装置およびプラズマｃｖｄ装置

Country Status (2)

Country Link
JP (1) JPWO2009011015A1 (ja)
WO (1) WO2009011015A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041732A (ja) * 2017-09-27 2018-03-15 ワイエス電子工業株式会社 プラズマ処理装置
WO2022230728A1 (ja) * 2021-04-26 2022-11-03 東京エレクトロン株式会社 下部電極機構、基板処理装置及び基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0892746A (ja) * 1994-09-21 1996-04-09 Mitsubishi Heavy Ind Ltd プラズマ化学蒸着方法及び装置
JP2003306772A (ja) * 2002-04-16 2003-10-31 Tokyo Electron Ltd 処理装置および処理方法ならびに載置部材
JP2004091885A (ja) * 2002-09-02 2004-03-25 Sharp Corp 薄膜製造装置およびその装置を用いた薄膜製造方法
JP2004315930A (ja) * 2003-04-18 2004-11-11 Denso Corp Ｃｖｄ装置
JP2006186015A (ja) * 2004-12-27 2006-07-13 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051153A (ja) * 2003-07-31 2005-02-24 Toyota Motor Corp Ｃｖｄ装置
JP4345617B2 (ja) * 2004-09-01 2009-10-14 トヨタ自動車株式会社 Ｃｖｄ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0892746A (ja) * 1994-09-21 1996-04-09 Mitsubishi Heavy Ind Ltd プラズマ化学蒸着方法及び装置
JP2003306772A (ja) * 2002-04-16 2003-10-31 Tokyo Electron Ltd 処理装置および処理方法ならびに載置部材
JP2004091885A (ja) * 2002-09-02 2004-03-25 Sharp Corp 薄膜製造装置およびその装置を用いた薄膜製造方法
JP2004315930A (ja) * 2003-04-18 2004-11-11 Denso Corp Ｃｖｄ装置
JP2006186015A (ja) * 2004-12-27 2006-07-13 Hitachi Kokusai Electric Inc 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041732A (ja) * 2017-09-27 2018-03-15 ワイエス電子工業株式会社 プラズマ処理装置
WO2022230728A1 (ja) * 2021-04-26 2022-11-03 東京エレクトロン株式会社 下部電極機構、基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JPWO2009011015A1 (ja) 2010-09-09

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