WO2009008031A1 - 半導体メモリおよびシステム - Google Patents
半導体メモリおよびシステム Download PDFInfo
- Publication number
- WO2009008031A1 WO2009008031A1 PCT/JP2007/000753 JP2007000753W WO2009008031A1 WO 2009008031 A1 WO2009008031 A1 WO 2009008031A1 JP 2007000753 W JP2007000753 W JP 2007000753W WO 2009008031 A1 WO2009008031 A1 WO 2009008031A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- data
- pair
- access control
- control circuits
- logic
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/1201—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising I/O circuitry
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C2029/1806—Address conversion or mapping, i.e. logical to physical address
Landscapes
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009522424A JP4473943B2 (ja) | 2007-07-11 | 2007-07-11 | 半導体メモリおよびシステム |
KR1020107002809A KR101102130B1 (ko) | 2007-07-11 | 2007-07-11 | 반도체 메모리 및 시스템 |
PCT/JP2007/000753 WO2009008031A1 (ja) | 2007-07-11 | 2007-07-11 | 半導体メモリおよびシステム |
US12/684,502 US8116114B2 (en) | 2007-07-11 | 2010-01-08 | Semiconductor memory and system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/000753 WO2009008031A1 (ja) | 2007-07-11 | 2007-07-11 | 半導体メモリおよびシステム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/684,502 Continuation US8116114B2 (en) | 2007-07-11 | 2010-01-08 | Semiconductor memory and system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008031A1 true WO2009008031A1 (ja) | 2009-01-15 |
Family
ID=40228228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/000753 WO2009008031A1 (ja) | 2007-07-11 | 2007-07-11 | 半導体メモリおよびシステム |
Country Status (4)
Country | Link |
---|---|
US (1) | US8116114B2 (ja) |
JP (1) | JP4473943B2 (ja) |
KR (1) | KR101102130B1 (ja) |
WO (1) | WO2009008031A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5606883B2 (ja) * | 2010-11-22 | 2014-10-15 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
KR102125568B1 (ko) * | 2014-02-19 | 2020-06-23 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 테스트 방법 |
JP6383637B2 (ja) * | 2014-10-27 | 2018-08-29 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR20180021510A (ko) * | 2016-08-22 | 2018-03-05 | 삼성전자주식회사 | 메모리 장치 및 중앙 처리 장치 |
US10811057B1 (en) | 2019-03-26 | 2020-10-20 | Micron Technology, Inc. | Centralized placement of command and address in memory devices |
US10978117B2 (en) | 2019-03-26 | 2021-04-13 | Micron Technology, Inc. | Centralized placement of command and address swapping in memory devices |
US10811059B1 (en) | 2019-03-27 | 2020-10-20 | Micron Technology, Inc. | Routing for power signals including a redistribution layer |
US11031335B2 (en) | 2019-04-03 | 2021-06-08 | Micron Technology, Inc. | Semiconductor devices including redistribution layers |
US10937481B1 (en) * | 2019-08-07 | 2021-03-02 | Arm Limited | Polarity swapping circuitry |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005285248A (ja) * | 2004-03-30 | 2005-10-13 | Renesas Technology Corp | 半導体記憶装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2646972B2 (ja) | 1993-11-01 | 1997-08-27 | 日本電気株式会社 | 多ビットメモリ |
US5745420A (en) * | 1995-07-31 | 1998-04-28 | Sgs-Thomson Microelectronics, Inc. | Integrated memory circuit with sequenced bitlines for stress test |
JP2001084797A (ja) * | 1999-09-14 | 2001-03-30 | Mitsubishi Electric Corp | 半導体記憶装置 |
JP2002319299A (ja) | 2001-04-24 | 2002-10-31 | Mitsubishi Electric Corp | 半導体記憶装置 |
US7768840B1 (en) * | 2007-08-29 | 2010-08-03 | Virage Logic Corporation | Memory modeling using an intermediate level structural description |
-
2007
- 2007-07-11 JP JP2009522424A patent/JP4473943B2/ja not_active Expired - Fee Related
- 2007-07-11 KR KR1020107002809A patent/KR101102130B1/ko not_active IP Right Cessation
- 2007-07-11 WO PCT/JP2007/000753 patent/WO2009008031A1/ja active Application Filing
-
2010
- 2010-01-08 US US12/684,502 patent/US8116114B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005285248A (ja) * | 2004-03-30 | 2005-10-13 | Renesas Technology Corp | 半導体記憶装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101102130B1 (ko) | 2012-01-02 |
JP4473943B2 (ja) | 2010-06-02 |
JPWO2009008031A1 (ja) | 2010-08-26 |
US20100142250A1 (en) | 2010-06-10 |
KR20100034033A (ko) | 2010-03-31 |
US8116114B2 (en) | 2012-02-14 |
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