WO2009003646A3 - Verfahren und vorrichtung zum trocknen einer oberfläche eines substrats - Google Patents

Verfahren und vorrichtung zum trocknen einer oberfläche eines substrats Download PDF

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Publication number
WO2009003646A3
WO2009003646A3 PCT/EP2008/005262 EP2008005262W WO2009003646A3 WO 2009003646 A3 WO2009003646 A3 WO 2009003646A3 EP 2008005262 W EP2008005262 W EP 2008005262W WO 2009003646 A3 WO2009003646 A3 WO 2009003646A3
Authority
WO
WIPO (PCT)
Prior art keywords
zone
substrate surface
axis
liquid
rotation
Prior art date
Application number
PCT/EP2008/005262
Other languages
English (en)
French (fr)
Other versions
WO2009003646A2 (de
Inventor
Uwe Dietze
Lothar Berger
Peter Dress
Original Assignee
Hamatech Ape Gmbh & Co Kg
Uwe Dietze
Lothar Berger
Peter Dress
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamatech Ape Gmbh & Co Kg, Uwe Dietze, Lothar Berger, Peter Dress filed Critical Hamatech Ape Gmbh & Co Kg
Publication of WO2009003646A2 publication Critical patent/WO2009003646A2/de
Publication of WO2009003646A3 publication Critical patent/WO2009003646A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

Um eine wenigstens teilweise gleichzeitige Nassbehandlung und Trocknung einer Substratoberfläche (3) vorzusehen, wird ein Verfahren vorgesehen, bei dem das Substrat (2) um eine Drehachse (A) gedreht wird, die Senkrecht zur zu behandelnden und zu trocknenden Oberfläche (3) des Substrats (3) steht. Eine erste Flüssigkeit wird auf die Oberfläche (3) des Substrats (2) in einem ersten Bereich (34) aufgebracht, eine zweite Flüssigkeit wird auf die Oberfläche (3) des Substrats (2) in einem zweiten Bereich (20) aufgebracht, und ein die Oberflächenspannung der zweiten Flüssigkeit verringerndes Fluid wird in einem dritten Bereich (22) auf die Oberfläche (3) des Substrats (2) aufgebracht. Dabei liegt während des Verfahrens der dritte Bereich (22) näher an der Drehachse als der zweite Bereich (20), und der zweite Bereich (20) näher an der Drehachse (A) als der erste Bereich (34). Das Aufbringen der Flüssigkeiten und des die Oberflächenspannung der zweiten Flüssigkeit verringernden Fluids erfolgt wenigstens teilweise zeitlich überlappend, und die ersten bis' dritten Bereiche (20,22,34) werden von der Drehachse (A) weg bewegt. Eine Vorrichtung (1), die zur Durchführung des obigen Verfahrens geeignet ist, wird ebenfalls vorgesehen.
PCT/EP2008/005262 2007-07-05 2008-06-27 Verfahren und vorrichtung zum trocknen einer oberfläche eines substrats WO2009003646A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007031314A DE102007031314A1 (de) 2007-07-05 2007-07-05 Verfahren und Vorrichtung zum Trocknen einer Oberfläche eines Substrats
DE102007031314.6 2007-07-05

Publications (2)

Publication Number Publication Date
WO2009003646A2 WO2009003646A2 (de) 2009-01-08
WO2009003646A3 true WO2009003646A3 (de) 2009-04-02

Family

ID=39828982

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/005262 WO2009003646A2 (de) 2007-07-05 2008-06-27 Verfahren und vorrichtung zum trocknen einer oberfläche eines substrats

Country Status (3)

Country Link
DE (1) DE102007031314A1 (de)
TW (1) TW200913027A (de)
WO (1) WO2009003646A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017111618B4 (de) * 2017-05-29 2021-03-11 CURO GmbH Vorrichtung, System und Verfahren zur Trocknung einer Halbleiterscheibe
CN110557956B (zh) * 2018-03-30 2020-06-05 明答克株式会社 帆布清洗装置、帆布的清洗方法及帆布清洗机构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040045589A1 (en) * 1998-09-23 2004-03-11 Imec Vzw Method and apparatus for removing a liquid from a surface of a substrate
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
US6770151B1 (en) * 2001-07-13 2004-08-03 Lam Research Corporation Drying a substrate using a combination of substrate processing technologies
EP1612847A2 (de) * 2004-06-30 2006-01-04 Lam Research Corporation Reinigungsapparat
US20060042664A1 (en) * 2004-08-30 2006-03-02 Vishwas Hardikar Apparatus and method for removing a liquid from a rotating substrate surface
WO2007084952A2 (en) * 2006-01-18 2007-07-26 Akrion Technologies, Inc. Systems and methods for drying a rotating substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6491764B2 (en) 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040045589A1 (en) * 1998-09-23 2004-03-11 Imec Vzw Method and apparatus for removing a liquid from a surface of a substrate
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
US6770151B1 (en) * 2001-07-13 2004-08-03 Lam Research Corporation Drying a substrate using a combination of substrate processing technologies
EP1612847A2 (de) * 2004-06-30 2006-01-04 Lam Research Corporation Reinigungsapparat
US20060042664A1 (en) * 2004-08-30 2006-03-02 Vishwas Hardikar Apparatus and method for removing a liquid from a rotating substrate surface
WO2007084952A2 (en) * 2006-01-18 2007-07-26 Akrion Technologies, Inc. Systems and methods for drying a rotating substrate

Also Published As

Publication number Publication date
TW200913027A (en) 2009-03-16
DE102007031314A1 (de) 2009-01-08
WO2009003646A2 (de) 2009-01-08

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