WO2009001944A1 - 磁性体の製造方法 - Google Patents

磁性体の製造方法 Download PDF

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Publication number
WO2009001944A1
WO2009001944A1 PCT/JP2008/061777 JP2008061777W WO2009001944A1 WO 2009001944 A1 WO2009001944 A1 WO 2009001944A1 JP 2008061777 W JP2008061777 W JP 2008061777W WO 2009001944 A1 WO2009001944 A1 WO 2009001944A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
base material
insulating
magnetic powder
magnetic material
Prior art date
Application number
PCT/JP2008/061777
Other languages
English (en)
French (fr)
Inventor
Shichio Funakoshi
Masaki Ohshima
Katsuya Ikeda
Man Ho Song
Original Assignee
Shindengen Electric Manufacturing Co., Ltd.
Tmp Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co., Ltd., Tmp Co., Ltd. filed Critical Shindengen Electric Manufacturing Co., Ltd.
Priority to KR1020097026855A priority Critical patent/KR101096942B1/ko
Priority to US12/665,659 priority patent/US20100158743A1/en
Priority to JP2009520655A priority patent/JP4846025B2/ja
Priority to CN2008800209081A priority patent/CN101681720B/zh
Publication of WO2009001944A1 publication Critical patent/WO2009001944A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　本発明の磁性体の製造方法は、成形空間中に絶縁磁性粉末を堆積して押圧成形し、該押圧成形によって固化される表面に配線を形成する磁性体の製造方法であって、シート状の基材と、当該基材上に形成され当該基材から離脱可能な配線とを有する配線基材を準備する第１工程Ｓ１０と、前記成形空間中に前記絶縁磁性粉末を堆積した後、前記絶縁磁性粉末の表面に、前記配線が対向するように当該配線基材を配置し、これらを押圧成形する第２工程Ｓ２０と、固化した前記絶縁磁性粉末の表面から前記配線を残して前記基材を取除く第３工程Ｓ３０とをこの順序で含む。 　本発明の磁性体の製造方法によれば、絶縁磁性粉末が腐食することが防止され、信頼性の高い磁性体を製造することが可能となる。
PCT/JP2008/061777 2007-06-27 2008-06-27 磁性体の製造方法 WO2009001944A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097026855A KR101096942B1 (ko) 2007-06-27 2008-06-27 자성체의 제조 방법
US12/665,659 US20100158743A1 (en) 2007-06-27 2008-06-27 Method of manufacturing magentic body
JP2009520655A JP4846025B2 (ja) 2007-06-27 2008-06-27 磁性体の製造方法
CN2008800209081A CN101681720B (zh) 2007-06-27 2008-06-27 磁性体的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007168815 2007-06-27
JP2007-168815 2007-06-27

Publications (1)

Publication Number Publication Date
WO2009001944A1 true WO2009001944A1 (ja) 2008-12-31

Family

ID=40185753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061777 WO2009001944A1 (ja) 2007-06-27 2008-06-27 磁性体の製造方法

Country Status (5)

Country Link
US (1) US20100158743A1 (ja)
JP (1) JP4846025B2 (ja)
KR (1) KR101096942B1 (ja)
CN (1) CN101681720B (ja)
WO (1) WO2009001944A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155701A (ja) * 2019-03-22 2020-09-24 Tdk株式会社 積層コイル部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176728A (ja) * 1999-12-17 2001-06-29 Matsushita Electric Ind Co Ltd Ｌｃ複合部品および電源素子
JP2001267160A (ja) * 2000-01-12 2001-09-28 Tdk Corp コイル封入圧粉コアの製造方法およびコイル封入圧粉コア
JP2002305366A (ja) * 2001-02-05 2002-10-18 Tdk Corp 積層基板および電子部品の製造方法、
JP2003234214A (ja) * 2002-02-08 2003-08-22 Toko Inc 電子回路モジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536513A (ja) * 1991-07-30 1993-02-12 Tokin Corp 軟磁性金属合金粉末及びそれを用いた圧粉磁芯
JP3399366B2 (ja) * 1998-06-05 2003-04-21 株式会社村田製作所 インダクタの製造方法
EP1347475A4 (en) * 2000-12-28 2009-07-15 Tdk Corp LAMINATED PCB AND METHOD FOR PRODUCING AN ELECTRONIC PART AND LAMINATED ELECTRONIC PART
JP2002324729A (ja) * 2001-02-22 2002-11-08 Tdk Corp 電子部品とその製造方法
JP4112914B2 (ja) * 2002-06-28 2008-07-02 三井化学株式会社 インダクター内蔵型プリント配線基板の製造方法
JP4289365B2 (ja) * 2006-05-08 2009-07-01 パナソニック電工株式会社 プリント配線板の製造方法及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176728A (ja) * 1999-12-17 2001-06-29 Matsushita Electric Ind Co Ltd Ｌｃ複合部品および電源素子
JP2001267160A (ja) * 2000-01-12 2001-09-28 Tdk Corp コイル封入圧粉コアの製造方法およびコイル封入圧粉コア
JP2002305366A (ja) * 2001-02-05 2002-10-18 Tdk Corp 積層基板および電子部品の製造方法、
JP2003234214A (ja) * 2002-02-08 2003-08-22 Toko Inc 電子回路モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155701A (ja) * 2019-03-22 2020-09-24 Tdk株式会社 積層コイル部品
JP7229056B2 (ja) 2019-03-22 2023-02-27 Tdk株式会社 積層コイル部品

Also Published As

Publication number Publication date
JPWO2009001944A1 (ja) 2010-08-26
KR20100018583A (ko) 2010-02-17
JP4846025B2 (ja) 2011-12-28
CN101681720A (zh) 2010-03-24
CN101681720B (zh) 2012-01-18
KR101096942B1 (ko) 2011-12-20
US20100158743A1 (en) 2010-06-24

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