WO2009034557A3 - Method and apparatus for forming arbitrary structures for integrated circuit devices - Google Patents
Method and apparatus for forming arbitrary structures for integrated circuit devices Download PDFInfo
- Publication number
- WO2009034557A3 WO2009034557A3 PCT/IB2008/053714 IB2008053714W WO2009034557A3 WO 2009034557 A3 WO2009034557 A3 WO 2009034557A3 IB 2008053714 W IB2008053714 W IB 2008053714W WO 2009034557 A3 WO2009034557 A3 WO 2009034557A3
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- WIPO (PCT)
- Prior art keywords
- arbitrary structures
- arbitrary
- integrated circuits
- integrated circuit
- circuit devices
- Prior art date
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Abstract
A method of implementing arbitrary structures to provide electrical interconnection and mechanical fixturing for integrated circuits is provided. According to exemplary embodiments of the invention said arbitrary structures are manufactured using three dimensional manufacturing processes employing only additive steps for all materials within the arbitrary structure. Accordingly the arbitrary structure is provided in a single step incorporating mechanical, electrical, and thermal elements as required by the design incorporating simultaneously dielectric and metallic materials. The arbitrary structures may be manufactured directly in association with the integrated circuits or separately for subsequent assembly to the integrated circuits. Arbitrary structures ranging from a fraction of to all of the structural and electrical elements required for packaging the integrated circuit(s) being provided by the arbitrary structures according to the design boundary established.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08807647A EP2195830A2 (en) | 2007-09-14 | 2008-09-12 | Method and apparatus for forming arbitrary structures for integrated circuit devices |
CN200880106804A CN101802989A (en) | 2007-09-14 | 2008-09-12 | Method and apparatus for forming arbitrary structures for integrated circuit devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US97270107P | 2007-09-14 | 2007-09-14 | |
US60/972,701 | 2007-09-14 |
Publications (2)
Publication Number | Publication Date |
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WO2009034557A2 WO2009034557A2 (en) | 2009-03-19 |
WO2009034557A3 true WO2009034557A3 (en) | 2009-10-15 |
Family
ID=40452655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2008/053714 WO2009034557A2 (en) | 2007-09-14 | 2008-09-12 | Method and apparatus for forming arbitrary structures for integrated circuit devices |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2195830A2 (en) |
CN (1) | CN101802989A (en) |
WO (1) | WO2009034557A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104485416B (en) * | 2013-11-22 | 2018-11-27 | 北京大学 | A kind of resistance-variable storing device and preparation method thereof using Meta Materials electrode structure |
US9818665B2 (en) | 2014-02-28 | 2017-11-14 | Infineon Technologies Ag | Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces |
EP3216690B1 (en) | 2016-03-07 | 2018-11-07 | Airbus Operations GmbH | Method for manufacturing a lining panel |
DE102018104144B4 (en) | 2018-02-23 | 2022-12-15 | Technische Universität Chemnitz | Process for contacting and packaging a semiconductor chip |
CN111640842A (en) * | 2020-07-02 | 2020-09-08 | 江文涛 | Packaging structure for packaging LED flip chip and packaging method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140937A (en) * | 1989-05-23 | 1992-08-25 | Brother Kogyo Kabushiki Kaisha | Apparatus for forming three-dimensional article |
EP0523981A1 (en) * | 1991-07-15 | 1993-01-20 | Fritz B. Prinz | Method of making electronic packages and smart structures formed by thermal spray deposition |
US5779833A (en) * | 1995-08-04 | 1998-07-14 | Case Western Reserve University | Method for constructing three dimensional bodies from laminations |
-
2008
- 2008-09-12 CN CN200880106804A patent/CN101802989A/en active Pending
- 2008-09-12 EP EP08807647A patent/EP2195830A2/en not_active Withdrawn
- 2008-09-12 WO PCT/IB2008/053714 patent/WO2009034557A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140937A (en) * | 1989-05-23 | 1992-08-25 | Brother Kogyo Kabushiki Kaisha | Apparatus for forming three-dimensional article |
EP0523981A1 (en) * | 1991-07-15 | 1993-01-20 | Fritz B. Prinz | Method of making electronic packages and smart structures formed by thermal spray deposition |
US5779833A (en) * | 1995-08-04 | 1998-07-14 | Case Western Reserve University | Method for constructing three dimensional bodies from laminations |
Non-Patent Citations (1)
Title |
---|
JOHANDER ET AL: "Layer Manufacturing as a Generic Tool for Microsystem Integration", 2 July 2007 (2007-07-02), XP002541940, Retrieved from the Internet <URL:http://www.4m-net.org/KnowledgeBase/papers/PID373481> [retrieved on 20090819] * |
Also Published As
Publication number | Publication date |
---|---|
WO2009034557A2 (en) | 2009-03-19 |
CN101802989A (en) | 2010-08-11 |
EP2195830A2 (en) | 2010-06-16 |
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