WO2009001822A1 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- WO2009001822A1 WO2009001822A1 PCT/JP2008/061462 JP2008061462W WO2009001822A1 WO 2009001822 A1 WO2009001822 A1 WO 2009001822A1 JP 2008061462 W JP2008061462 W JP 2008061462W WO 2009001822 A1 WO2009001822 A1 WO 2009001822A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical module
- optical
- heatsink
- heat
- transmission line
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
光モジュールは、光が出射又は入射する方向と、光モジュールからの放熱方向とが同じ方向である。光素子と光結合された光伝送路とヒートシンクとは、直接に又は熱良導体を介して接触する。光モジュールから発生する熱が、光伝送路14及びヒートシンク19を経由して効果的に放熱される。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009520595A JPWO2009001822A1 (ja) | 2007-06-26 | 2008-06-24 | 光モジュール |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-167288 | 2007-06-26 | ||
JP2007167288 | 2007-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009001822A1 true WO2009001822A1 (ja) | 2008-12-31 |
Family
ID=40185636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061462 WO2009001822A1 (ja) | 2007-06-26 | 2008-06-24 | 光モジュール |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2009001822A1 (ja) |
WO (1) | WO2009001822A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011013289A1 (ja) * | 2009-07-31 | 2011-02-03 | 日本電気株式会社 | 光モジュール |
JP2012514478A (ja) * | 2009-01-07 | 2012-06-28 | イシキリ インターフェイス テクノロジーズ ゲーエムベーハー | 検出器表面 |
WO2013128751A1 (ja) * | 2012-03-02 | 2013-09-06 | 株式会社日立製作所 | 多チャンネル光モジュール及びそれを用いた情報処理装置 |
JP2014086660A (ja) * | 2012-10-26 | 2014-05-12 | Fujitsu Ltd | 半導体装置の製造方法および半導体装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11211924A (ja) * | 1998-01-21 | 1999-08-06 | Nippon Telegr & Teleph Corp <Ntt> | 波長多重通信用光回路 |
JP2002158389A (ja) * | 2000-11-16 | 2002-05-31 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザモジュール |
JP2003004991A (ja) * | 2001-06-25 | 2003-01-08 | Matsushita Electric Ind Co Ltd | 光送受信モジュールとその製造方法 |
JP2004111446A (ja) * | 2002-09-13 | 2004-04-08 | Fuji Xerox Co Ltd | 半導体レーザ素子の実装方法及びその実装方法を用いた半導体レーザ装置並びに光学モジュール |
JP2004361439A (ja) * | 2003-05-30 | 2004-12-24 | Nichia Chem Ind Ltd | レーザ光源装置 |
JP2005208612A (ja) * | 2003-12-25 | 2005-08-04 | Matsushita Electric Ind Co Ltd | 光モジュール製造方法、光モジュール |
JP2005223111A (ja) * | 2004-02-05 | 2005-08-18 | Yokogawa Electric Corp | 波長可変レーザー |
-
2008
- 2008-06-24 JP JP2009520595A patent/JPWO2009001822A1/ja active Pending
- 2008-06-24 WO PCT/JP2008/061462 patent/WO2009001822A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11211924A (ja) * | 1998-01-21 | 1999-08-06 | Nippon Telegr & Teleph Corp <Ntt> | 波長多重通信用光回路 |
JP2002158389A (ja) * | 2000-11-16 | 2002-05-31 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザモジュール |
JP2003004991A (ja) * | 2001-06-25 | 2003-01-08 | Matsushita Electric Ind Co Ltd | 光送受信モジュールとその製造方法 |
JP2004111446A (ja) * | 2002-09-13 | 2004-04-08 | Fuji Xerox Co Ltd | 半導体レーザ素子の実装方法及びその実装方法を用いた半導体レーザ装置並びに光学モジュール |
JP2004361439A (ja) * | 2003-05-30 | 2004-12-24 | Nichia Chem Ind Ltd | レーザ光源装置 |
JP2005208612A (ja) * | 2003-12-25 | 2005-08-04 | Matsushita Electric Ind Co Ltd | 光モジュール製造方法、光モジュール |
JP2005223111A (ja) * | 2004-02-05 | 2005-08-18 | Yokogawa Electric Corp | 波長可変レーザー |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012514478A (ja) * | 2009-01-07 | 2012-06-28 | イシキリ インターフェイス テクノロジーズ ゲーエムベーハー | 検出器表面 |
WO2011013289A1 (ja) * | 2009-07-31 | 2011-02-03 | 日本電気株式会社 | 光モジュール |
WO2013128751A1 (ja) * | 2012-03-02 | 2013-09-06 | 株式会社日立製作所 | 多チャンネル光モジュール及びそれを用いた情報処理装置 |
JP2014086660A (ja) * | 2012-10-26 | 2014-05-12 | Fujitsu Ltd | 半導体装置の製造方法および半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009001822A1 (ja) | 2010-08-26 |
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