WO2008149548A1 - 半導体ナノワイヤおよびその製造方法 - Google Patents
半導体ナノワイヤおよびその製造方法 Download PDFInfo
- Publication number
- WO2008149548A1 WO2008149548A1 PCT/JP2008/001417 JP2008001417W WO2008149548A1 WO 2008149548 A1 WO2008149548 A1 WO 2008149548A1 JP 2008001417 W JP2008001417 W JP 2008001417W WO 2008149548 A1 WO2008149548 A1 WO 2008149548A1
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- WIPO (PCT)
- Prior art keywords
- region
- manufacturing
- semiconductor nanowire
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- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000002070 nanowire Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000002994 raw material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02653—Vapour-liquid-solid growth
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
- C30B11/08—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
- C30B11/12—Vaporous components, e.g. vapour-liquid-solid-growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
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- H—ELECTRICITY
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- H01L21/02656—Special treatments
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H01L29/068—Nanowires or nanotubes comprising a junction
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/775—Field effect transistors with one dimensional charge carrier gas channel, e.g. quantum wire FET
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
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- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
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- Chemical Vapour Deposition (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/451,898 US8143144B2 (en) | 2007-06-06 | 2008-06-04 | Semiconductor nanowire and its manufacturing method |
JP2009517723A JP5498161B2 (ja) | 2007-06-06 | 2008-06-04 | 半導体ナノワイヤの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150196 | 2007-06-06 | ||
JP2007-150196 | 2007-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008149548A1 true WO2008149548A1 (ja) | 2008-12-11 |
Family
ID=40093380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001417 WO2008149548A1 (ja) | 2007-06-06 | 2008-06-04 | 半導体ナノワイヤおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8143144B2 (ja) |
JP (1) | JP5498161B2 (ja) |
WO (1) | WO2008149548A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243711A (ja) * | 2010-05-18 | 2011-12-01 | National Institute For Materials Science | シリコンナノ粒子/シリコンナノワイヤ複合材料、太陽電池、発光デバイス、及び製造法 |
JP2012018919A (ja) * | 2010-06-11 | 2012-01-26 | Semiconductor Energy Lab Co Ltd | 蓄電装置 |
JP2012069940A (ja) * | 2010-09-22 | 2012-04-05 | Commissariat A L'energie Atomique & Aux Energies Alternatives | 触媒成長によって成長したワイヤの表面上の金属触媒残渣を取り除く方法 |
KR20140065980A (ko) * | 2012-11-22 | 2014-05-30 | 전북대학교산학협력단 | 다이오드의 제조방법 |
JP2014518004A (ja) * | 2011-04-05 | 2014-07-24 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 半導体構造体上の無触媒選択的成長方法 |
JP2015536565A (ja) * | 2012-10-26 | 2015-12-21 | アルディア | 光電子デバイス、及び光電子デバイスを製造する方法 |
JP2016157726A (ja) * | 2015-02-23 | 2016-09-01 | 学校法人早稲田大学 | 不純物半導体層の製造装置及び製造方法 |
US9991342B2 (en) | 2012-10-26 | 2018-06-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Electronic device containing nanowire(s), equipped with a transition metal buffer layer, process for growing at least one nanowire, and process for manufacturing a device |
JP2019036672A (ja) * | 2017-08-21 | 2019-03-07 | 日本電信電話株式会社 | ナノワイヤトランジスタの製造方法 |
JP2022026490A (ja) * | 2020-07-31 | 2022-02-10 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101588852B1 (ko) * | 2008-10-31 | 2016-01-26 | 삼성전자주식회사 | 반도체 소자 및 그 형성방법 |
JP5299105B2 (ja) * | 2009-06-16 | 2013-09-25 | ソニー株式会社 | 二酸化バナジウムナノワイヤとその製造方法、及び二酸化バナジウムナノワイヤを用いたナノワイヤデバイス |
KR101603767B1 (ko) * | 2009-11-12 | 2016-03-16 | 삼성전자주식회사 | 광조사를 이용한 반도체성 카본나노튜브의 선택적 성장방법 |
US8900935B2 (en) | 2011-01-25 | 2014-12-02 | International Business Machines Corporation | Deposition on a nanowire using atomic layer deposition |
GB201113464D0 (en) * | 2011-08-03 | 2011-09-21 | Sunflake As | Nanostructure, nanostructure fabrication method and photovoltaic cell incorporating a nanostructure |
WO2013055788A1 (en) * | 2011-10-12 | 2013-04-18 | The Regents Of The University Of California | Photoelectrode for solar water oxidation |
WO2013095342A1 (en) | 2011-12-19 | 2013-06-27 | Intel Corporation | High voltage field effect transistors |
FR2995729B1 (fr) * | 2012-09-18 | 2016-01-01 | Aledia | Dispositif opto-electrique a microfils ou nanofils semiconducteurs et son procede de fabrication |
US10170746B2 (en) * | 2012-10-17 | 2019-01-01 | Infineon Technologies Ag | Battery electrode, battery, and method for manufacturing a battery electrode |
FR2997420B1 (fr) | 2012-10-26 | 2017-02-24 | Commissariat Energie Atomique | Procede de croissance d'au moins un nanofil a partir d'une couche d'un metal de transition nitrure obtenue en deux etapes |
US20150243837A1 (en) * | 2013-03-15 | 2015-08-27 | Moonsub Shim | Multi-heterojunction nanoparticles, methods of manufacture thereof and articles comprising the same |
US9835954B2 (en) * | 2013-05-21 | 2017-12-05 | Asml Netherlands B.V. | Inspection method and apparatus, substrates for use therein and device manufacturing method |
WO2015002944A2 (en) * | 2013-07-01 | 2015-01-08 | The Regents Of The University Of Colorado, A Body Corporate | Nanostructured photocatalysts and doped wide-bandgap semiconductors |
CN105405745B (zh) * | 2015-11-10 | 2018-06-22 | 中国科学院半导体研究所 | 立式iii-v族锑化物半导体单晶薄膜的制备方法 |
US10312081B2 (en) | 2016-07-15 | 2019-06-04 | University Of Kentucky Research Foundation | Synthesis of metal oxide surfaces and interfaces with crystallographic control using solid-liquid-vapor etching and vapor-liquid-solid growth |
US11222950B2 (en) | 2019-04-24 | 2022-01-11 | National Technology & Engineering Solutions Of Sandia, Llc | Method for fabricating embedded nanostructures with arbitrary shape |
JP7298822B2 (ja) * | 2019-06-04 | 2023-06-27 | 国立大学法人 東京大学 | ナノワイヤ製造方法、及びナノワイヤ製造装置 |
CN111704105B (zh) * | 2020-06-23 | 2022-06-14 | 中国科学院半导体研究所 | 一种半导体/超导体异质结纳米线网络的制备方法 |
KR102415405B1 (ko) * | 2021-03-30 | 2022-06-29 | 한양대학교 에리카산학협력단 | 나노와이어형 발광소자를 이용한 표시 장치 |
KR102665449B1 (ko) * | 2021-11-03 | 2024-05-10 | (재)한국나노기술원 | 화합물 반도체 나노로드의 제조방법, 이를 이용하여 제조된 화합물 반도체 나노로드 및 화합물 반도체 나노로드 어레이 |
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JP2016157726A (ja) * | 2015-02-23 | 2016-09-01 | 学校法人早稲田大学 | 不純物半導体層の製造装置及び製造方法 |
JP2019036672A (ja) * | 2017-08-21 | 2019-03-07 | 日本電信電話株式会社 | ナノワイヤトランジスタの製造方法 |
JP2022026490A (ja) * | 2020-07-31 | 2022-02-10 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
JP7176700B2 (ja) | 2020-07-31 | 2022-11-22 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
Also Published As
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JPWO2008149548A1 (ja) | 2010-08-19 |
US8143144B2 (en) | 2012-03-27 |
JP5498161B2 (ja) | 2014-05-21 |
US20100133509A1 (en) | 2010-06-03 |
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