WO2008143202A1 - 導体層形成用組成物、導体層の形成方法および回路基板の製造方法 - Google Patents

導体層形成用組成物、導体層の形成方法および回路基板の製造方法 Download PDF

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Publication number
WO2008143202A1
WO2008143202A1 PCT/JP2008/059103 JP2008059103W WO2008143202A1 WO 2008143202 A1 WO2008143202 A1 WO 2008143202A1 JP 2008059103 W JP2008059103 W JP 2008059103W WO 2008143202 A1 WO2008143202 A1 WO 2008143202A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor layer
layer formation
composition
coating
coating film
Prior art date
Application number
PCT/JP2008/059103
Other languages
English (en)
French (fr)
Inventor
Yasufumi Matsumura
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Publication of WO2008143202A1 publication Critical patent/WO2008143202A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)

Abstract

　絶縁基材上に導体層を形成するための塗布液として用いられる導体層形成用組成物は、ポリイミド前駆体樹脂と、金属化合物と、粘度調整剤としての含窒素複素環化合物とを含有する。含窒素複素環化合物としては、ピリジン、イミダゾールなどの第３級アミノ化合物が用いられる。また、粘度調整剤として、含窒素複素環化合物とともに有機カルボニル化合物を含有することもできる。導体層の形成方法は、導体層形成用組成物を塗布液として絶縁基材の表面に塗布し、乾燥して塗布膜を形成する工程と、塗布膜中に存在する金属イオンを還元し、塗布膜の表面に導体層としての金属析出層を形成する工程と、熱処理を行って塗布膜中のポリイミド前駆体樹脂をイミド化してポリイミド樹脂層を形成する工程を備えている。
PCT/JP2008/059103 2007-05-22 2008-05-19 導体層形成用組成物、導体層の形成方法および回路基板の製造方法 WO2008143202A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007135488A JP5051754B2 (ja) 2007-05-22 2007-05-22 導体層形成用組成物、導体層の形成方法および回路基板の製造方法
JP2007-135488 2007-05-22

Publications (1)

Publication Number Publication Date
WO2008143202A1 true WO2008143202A1 (ja) 2008-11-27

Family

ID=40031900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059103 WO2008143202A1 (ja) 2007-05-22 2008-05-19 導体層形成用組成物、導体層の形成方法および回路基板の製造方法

Country Status (3)

Country Link
JP (1) JP5051754B2 (ja)
TW (1) TWI386518B (ja)
WO (1) WO2008143202A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500370B (zh) * 2012-05-25 2015-09-11 Nat Univ Chung Hsing A method of forming a conductive metal pattern and a wiring on a surface of a plastic substrate and a method for forming a printing ink
CN110049619B (zh) * 2018-01-17 2020-08-07 庆鼎精密电子（淮安）有限公司 电路板及其制作方法
JP7340179B2 (ja) * 2018-05-24 2023-09-07 学校法人 芝浦工業大学 導体の製造方法、配線基板の製造方法及び導体形成用組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11302375A (ja) * 1997-11-20 1999-11-02 Kanegafuchi Chem Ind Co Ltd 金属を含有するポリアミド酸組成物並びにポリイミドフィルム及びそれからなるフレキシブル印刷配線用基板及びそれらの製造方法
JP2005154880A (ja) * 2003-11-28 2005-06-16 Toray Eng Co Ltd ポリイミド前駆体金属錯体溶液およびそれを用いた電子部品用基材およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101054A (ja) * 1992-09-21 1994-04-12 Ishihara Chem Co Ltd 銅系素材選択型無電解めっき用触媒液
JPH08193275A (ja) * 1994-11-17 1996-07-30 Ibiden Co Ltd 無電解めっき液、無電解めっき方法およびプリント配線板の製造方法
JP3355832B2 (ja) * 1994-12-08 2002-12-09 三菱マテリアル株式会社 回路パターンの形成方法及びそのペースト
JP2006104504A (ja) * 2004-10-01 2006-04-20 Yoichi Haruta ポリイミド樹脂材の無電解めっき前処理方法および表面金属化方法、並びにフレキシブルプリント配線板およびその製造方法
KR100568569B1 (ko) * 2004-10-26 2006-04-07 주식회사 이녹스 폴리이미드 접착제용 조성물 및 이를 이용한 폴리이미드접착테이프
JP2006165476A (ja) * 2004-12-10 2006-06-22 Tokai Rubber Ind Ltd フレキシブルプリント基板の製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11302375A (ja) * 1997-11-20 1999-11-02 Kanegafuchi Chem Ind Co Ltd 金属を含有するポリアミド酸組成物並びにポリイミドフィルム及びそれからなるフレキシブル印刷配線用基板及びそれらの製造方法
JP2005154880A (ja) * 2003-11-28 2005-06-16 Toray Eng Co Ltd ポリイミド前駆体金属錯体溶液およびそれを用いた電子部品用基材およびその製造方法

Also Published As

Publication number Publication date
TW200902756A (en) 2009-01-16
JP5051754B2 (ja) 2012-10-17
TWI386518B (zh) 2013-02-21
JP2008294060A (ja) 2008-12-04

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