WO2008142839A1 - Puce semi-conductrice et dispositif à semi-conducteur - Google Patents

Puce semi-conductrice et dispositif à semi-conducteur Download PDF

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Publication number
WO2008142839A1
WO2008142839A1 PCT/JP2008/001166 JP2008001166W WO2008142839A1 WO 2008142839 A1 WO2008142839 A1 WO 2008142839A1 JP 2008001166 W JP2008001166 W JP 2008001166W WO 2008142839 A1 WO2008142839 A1 WO 2008142839A1
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WO
WIPO (PCT)
Prior art keywords
electrode
bump electrode
semiconductor chip
semiconductor
bump
Prior art date
Application number
PCT/JP2008/001166
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Tomura
Kazuhiro Nobori
Yuichiro Yamada
Kentaro Kumazawa
Teppei Iwase
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009515080A priority Critical patent/JP5052605B2/ja
Priority to US12/531,819 priority patent/US7994638B2/en
Publication of WO2008142839A1 publication Critical patent/WO2008142839A1/fr

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

Une électrode de support de forme plane (13) est placée entre une électrode à bosse (14) et une languette de connexion d'électrode (6) formée sur une surface de puce semi-conductrice. L'électrode de support de forme plane (13) présente une surface supérieure à l'extrémité de l'électrode à bosse (14), une épaisseur inférieure à la hauteur de l'électrode à bosse (14), et un module d'élasticité de Young inférieur à celui de l'électrode à bosse (14). Lorsque la puce semi-conductrice (3) est connectée par billes sur un substrat (1), l'électrode à bosse (14) est plastiquement déformée et l'électrode de support de forme plane (13) est élastiquement déformée de façon appropriée, ce qui permet ainsi d'obtenir un état conducteur préférable.
PCT/JP2008/001166 2007-05-11 2008-05-09 Puce semi-conductrice et dispositif à semi-conducteur WO2008142839A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009515080A JP5052605B2 (ja) 2007-05-11 2008-05-09 半導体チップ
US12/531,819 US7994638B2 (en) 2007-05-11 2008-05-09 Semiconductor chip and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-126173 2007-05-11
JP2007126173 2007-05-11

Publications (1)

Publication Number Publication Date
WO2008142839A1 true WO2008142839A1 (fr) 2008-11-27

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PCT/JP2008/001166 WO2008142839A1 (fr) 2007-05-11 2008-05-09 Puce semi-conductrice et dispositif à semi-conducteur

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US (1) US7994638B2 (fr)
JP (1) JP5052605B2 (fr)
WO (1) WO2008142839A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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