WO2008142747A1 - 加熱処理装置 - Google Patents
加熱処理装置 Download PDFInfo
- Publication number
- WO2008142747A1 WO2008142747A1 PCT/JP2007/060021 JP2007060021W WO2008142747A1 WO 2008142747 A1 WO2008142747 A1 WO 2008142747A1 JP 2007060021 W JP2007060021 W JP 2007060021W WO 2008142747 A1 WO2008142747 A1 WO 2008142747A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature
- supporting member
- heated object
- object supporting
- heat treatment
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title abstract 4
- 238000009529 body temperature measurement Methods 0.000 abstract 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
- G01J5/0805—Means for chopping radiation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Control Of Resistance Heating (AREA)
- Furnace Details (AREA)
- Control Of Temperature (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Radiation Pyrometers (AREA)
- Discharge Heating (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800530025A CN101669016B (zh) | 2007-05-16 | 2007-05-16 | 加热处理设备 |
PCT/JP2007/060021 WO2008142747A1 (ja) | 2007-05-16 | 2007-05-16 | 加熱処理装置 |
JP2009515017A JP4436893B2 (ja) | 2007-05-16 | 2007-05-16 | 加熱処理装置 |
US12/613,288 US8150243B2 (en) | 2007-05-16 | 2009-11-05 | Heating process apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/060021 WO2008142747A1 (ja) | 2007-05-16 | 2007-05-16 | 加熱処理装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/613,288 Continuation US8150243B2 (en) | 2007-05-16 | 2009-11-05 | Heating process apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008142747A1 true WO2008142747A1 (ja) | 2008-11-27 |
Family
ID=40031474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/060021 WO2008142747A1 (ja) | 2007-05-16 | 2007-05-16 | 加熱処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8150243B2 (ja) |
JP (1) | JP4436893B2 (ja) |
CN (1) | CN101669016B (ja) |
WO (1) | WO2008142747A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7666763B2 (en) | 2007-05-29 | 2010-02-23 | Canon Anelva Corporation | Nanosilicon semiconductor substrate manufacturing method and semiconductor circuit device using nanosilicon semiconductor substrate manufactured by the method |
CN101847573A (zh) * | 2009-03-27 | 2010-09-29 | 佳能安内华股份有限公司 | 用于加热设备的温度控制方法 |
US7807553B2 (en) | 2006-12-08 | 2010-10-05 | Canon Anelva Corporation | Substrate heating apparatus and semiconductor fabrication method |
JP2010225613A (ja) * | 2009-03-19 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
CN102473641A (zh) * | 2009-08-04 | 2012-05-23 | 佳能安内华股份有限公司 | 热处理设备以及半导体装置制造方法 |
JPWO2011077702A1 (ja) * | 2009-12-25 | 2013-05-02 | キヤノンアネルバ株式会社 | 基板加熱処理装置の温度制御方法、半導体デバイスの製造方法、基板加熱処理装置の温度制御プログラム及び記録媒体 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012209278B4 (de) * | 2012-06-01 | 2018-04-12 | Kgt Graphit Technologie Gmbh | Suszeptor |
DE102013114412A1 (de) * | 2013-12-18 | 2015-06-18 | Aixtron Se | Vorrichtung und Verfahren zur Regelung der Temperatur in einer Prozesskammer eines CVD-Reaktors unter Verwendung zweier Temperatursensoreinrichtungen |
JP6479525B2 (ja) * | 2015-03-27 | 2019-03-06 | 株式会社ニューフレアテクノロジー | 成膜装置及び温度測定方法 |
JP6539578B2 (ja) | 2015-12-22 | 2019-07-03 | 株式会社Screenホールディングス | 熱処理装置および熱処理方法 |
US10629854B2 (en) * | 2017-08-18 | 2020-04-21 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Substrate pre-baking device |
CN108751186A (zh) * | 2018-08-28 | 2018-11-06 | 湖南烯瑞自动化设备有限公司 | 一种红外测温装置及石墨化炉 |
CN110875208B (zh) * | 2018-08-29 | 2022-11-25 | 北京北方华创微电子装备有限公司 | 工艺腔室用控温装置及方法、工艺腔室 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129714A (ja) * | 1995-05-30 | 1997-05-16 | Moore Epitaxial Inc | 高速熱処理炉のサセプタ |
JPH10104084A (ja) * | 1996-09-27 | 1998-04-24 | Mitsubishi Heavy Ind Ltd | 多色温度計 |
JPH1135334A (ja) * | 1997-07-15 | 1999-02-09 | Nikon Corp | 制御方法、および、これを用いた成形装置 |
JP2000036370A (ja) * | 1998-07-17 | 2000-02-02 | Sukegawa Electric Co Ltd | 板体加熱装置 |
JP2001021416A (ja) * | 1999-02-19 | 2001-01-26 | Applied Materials Inc | 非貫入型の作動温度測定及び監視システム |
JP2001081569A (ja) * | 1999-09-16 | 2001-03-27 | Toshiba Corp | 気相成長装置 |
JP2004193238A (ja) * | 2002-12-10 | 2004-07-08 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
WO2006043530A1 (ja) * | 2004-10-19 | 2006-04-27 | Canon Anelva Corporation | 基板加熱処理装置及び基板加熱処理に用いられる基板搬送用トレイ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5820686A (en) | 1993-01-21 | 1998-10-13 | Moore Epitaxial, Inc. | Multi-layer susceptor for rapid thermal process reactors |
US5444217A (en) * | 1993-01-21 | 1995-08-22 | Moore Epitaxial Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
US7734439B2 (en) * | 2002-06-24 | 2010-06-08 | Mattson Technology, Inc. | System and process for calibrating pyrometers in thermal processing chambers |
JP2008166729A (ja) * | 2006-12-08 | 2008-07-17 | Canon Anelva Corp | 基板加熱処理装置及び半導体製造方法 |
CN101569000B (zh) * | 2007-09-03 | 2011-07-13 | 佳能安内华股份有限公司 | 衬底热处理设备和衬底热处理方法 |
-
2007
- 2007-05-16 WO PCT/JP2007/060021 patent/WO2008142747A1/ja active Application Filing
- 2007-05-16 JP JP2009515017A patent/JP4436893B2/ja active Active
- 2007-05-16 CN CN2007800530025A patent/CN101669016B/zh active Active
-
2009
- 2009-11-05 US US12/613,288 patent/US8150243B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129714A (ja) * | 1995-05-30 | 1997-05-16 | Moore Epitaxial Inc | 高速熱処理炉のサセプタ |
JPH10104084A (ja) * | 1996-09-27 | 1998-04-24 | Mitsubishi Heavy Ind Ltd | 多色温度計 |
JPH1135334A (ja) * | 1997-07-15 | 1999-02-09 | Nikon Corp | 制御方法、および、これを用いた成形装置 |
JP2000036370A (ja) * | 1998-07-17 | 2000-02-02 | Sukegawa Electric Co Ltd | 板体加熱装置 |
JP2001021416A (ja) * | 1999-02-19 | 2001-01-26 | Applied Materials Inc | 非貫入型の作動温度測定及び監視システム |
JP2001081569A (ja) * | 1999-09-16 | 2001-03-27 | Toshiba Corp | 気相成長装置 |
JP2004193238A (ja) * | 2002-12-10 | 2004-07-08 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
WO2006043530A1 (ja) * | 2004-10-19 | 2006-04-27 | Canon Anelva Corporation | 基板加熱処理装置及び基板加熱処理に用いられる基板搬送用トレイ |
Non-Patent Citations (1)
Title |
---|
"MES Interface Kino o Goshiyo no Sai no Seino ni Tsuite", MITSUBISHI GRAPHIC OPERATION TERMINAL TECHNICAL NEWS NO.GOT-D-0012, 31 May 2006 (2006-05-31), XP003024094, Retrieved from the Internet <URL:http://wwwf2.mitsubishielectric.co.jp/got/technews/gotd0012/gotd0012.pdf> * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7807553B2 (en) | 2006-12-08 | 2010-10-05 | Canon Anelva Corporation | Substrate heating apparatus and semiconductor fabrication method |
US7666763B2 (en) | 2007-05-29 | 2010-02-23 | Canon Anelva Corporation | Nanosilicon semiconductor substrate manufacturing method and semiconductor circuit device using nanosilicon semiconductor substrate manufactured by the method |
JP2010225613A (ja) * | 2009-03-19 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
CN101847573A (zh) * | 2009-03-27 | 2010-09-29 | 佳能安内华股份有限公司 | 用于加热设备的温度控制方法 |
CN102473641A (zh) * | 2009-08-04 | 2012-05-23 | 佳能安内华股份有限公司 | 热处理设备以及半导体装置制造方法 |
US9147742B2 (en) | 2009-08-04 | 2015-09-29 | Canon Anelva Corporation | Heat treatment apparatus and semiconductor device manufacturing method |
JPWO2011077702A1 (ja) * | 2009-12-25 | 2013-05-02 | キヤノンアネルバ株式会社 | 基板加熱処理装置の温度制御方法、半導体デバイスの製造方法、基板加熱処理装置の温度制御プログラム及び記録媒体 |
JP5469678B2 (ja) * | 2009-12-25 | 2014-04-16 | キヤノンアネルバ株式会社 | 基板加熱処理装置の温度制御方法、半導体デバイスの製造方法、基板加熱処理装置の温度制御プログラム及び記録媒体 |
US9431281B2 (en) | 2009-12-25 | 2016-08-30 | Canon Anelva Corporation | Temperature control method for substrate heat treatment apparatus, semiconductor device manufacturing method, temperature control program for substrate heat treatment apparatus, and recording medium |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008142747A1 (ja) | 2010-08-05 |
JP4436893B2 (ja) | 2010-03-24 |
CN101669016A (zh) | 2010-03-10 |
US20100111512A1 (en) | 2010-05-06 |
US8150243B2 (en) | 2012-04-03 |
CN101669016B (zh) | 2012-01-18 |
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