WO2008139876A1 - Dispositif de positionnement et dispositif pour la formation de film - Google Patents

Dispositif de positionnement et dispositif pour la formation de film Download PDF

Info

Publication number
WO2008139876A1
WO2008139876A1 PCT/JP2008/057898 JP2008057898W WO2008139876A1 WO 2008139876 A1 WO2008139876 A1 WO 2008139876A1 JP 2008057898 W JP2008057898 W JP 2008057898W WO 2008139876 A1 WO2008139876 A1 WO 2008139876A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
contact member
positioning device
contact
positioning
Prior art date
Application number
PCT/JP2008/057898
Other languages
English (en)
Japanese (ja)
Inventor
Junichi Nagata
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Publication of WO2008139876A1 publication Critical patent/WO2008139876A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif de positionnement capable d'empêcher un substrat de glisser latéralement. Un élément de contact (10) constitué d'un caoutchouc fluoré et ayant une surface plate est disposé sur le crochet (23) du dispositif de positionnement (3). Le substrat (7) est placé sur l'élément de contact (10) et est déplacé horizontalement pour assurer son positionnement. Du fait que le coefficient de friction statique du caoutchouc fluoré est élevé et que le substrat (7) est mis en contact face à face avec l'élément de contact (10), la force de frottement statique du substrat (7) est élevée, et donc, le substrat ne glisse pas latéralement sur le crochet (23). Un élément de contact doté d'une extrémité supérieure est fourni à la partie terminale de l'extrémité d'une broche de levage, et lorsque l'élément de contact est mis en contact face à face avec le substrat et est déplacé verticalement, le substrat ne tombe pas de la broche de levage.
PCT/JP2008/057898 2007-05-10 2008-04-24 Dispositif de positionnement et dispositif pour la formation de film WO2008139876A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007125144 2007-05-10
JP2007-125144 2007-05-10

Publications (1)

Publication Number Publication Date
WO2008139876A1 true WO2008139876A1 (fr) 2008-11-20

Family

ID=40002092

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057898 WO2008139876A1 (fr) 2007-05-10 2008-04-24 Dispositif de positionnement et dispositif pour la formation de film

Country Status (2)

Country Link
TW (1) TW200900516A (fr)
WO (1) WO2008139876A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016199759A1 (ja) * 2015-06-12 2018-01-25 株式会社アルバック 基板保持装置、成膜装置及び基板保持方法
CN111485216A (zh) * 2017-05-22 2020-08-04 佳能特机株式会社 基板载置装置、成膜装置、基板载置方法、成膜方法和电子器件的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480363B (zh) * 2009-08-19 2015-04-11 Jnc Corp 四氫吡喃化合物、液晶組成物及液晶顯示元件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693326A (en) * 1979-12-26 1981-07-28 Fujitsu Ltd Holding structure of substrate and mask
JP2004137584A (ja) * 2002-10-21 2004-05-13 Ulvac Japan Ltd アライメント装置、成膜装置及びアライメント方法
WO2005087969A1 (fr) * 2004-03-11 2005-09-22 Ulvac, Inc. Equipement d’alignement et equipement de formation de couche
JP2007046099A (ja) * 2005-08-09 2007-02-22 Canon Inc マスクホルダ及び基板ホルダ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693326A (en) * 1979-12-26 1981-07-28 Fujitsu Ltd Holding structure of substrate and mask
JP2004137584A (ja) * 2002-10-21 2004-05-13 Ulvac Japan Ltd アライメント装置、成膜装置及びアライメント方法
WO2005087969A1 (fr) * 2004-03-11 2005-09-22 Ulvac, Inc. Equipement d’alignement et equipement de formation de couche
JP2007046099A (ja) * 2005-08-09 2007-02-22 Canon Inc マスクホルダ及び基板ホルダ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016199759A1 (ja) * 2015-06-12 2018-01-25 株式会社アルバック 基板保持装置、成膜装置及び基板保持方法
CN111485216A (zh) * 2017-05-22 2020-08-04 佳能特机株式会社 基板载置装置、成膜装置、基板载置方法、成膜方法和电子器件的制造方法
CN111519158A (zh) * 2017-05-22 2020-08-11 佳能特机株式会社 基板载置装置、成膜装置、基板载置方法、成膜方法和电子器件的制造方法
CN111519158B (zh) * 2017-05-22 2023-03-28 佳能特机株式会社 基板载置装置、成膜装置、基板载置方法、成膜方法和电子器件的制造方法

Also Published As

Publication number Publication date
TW200900516A (en) 2009-01-01

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