WO2006033894A3 - Volet de rechauffeur - Google Patents

Volet de rechauffeur Download PDF

Info

Publication number
WO2006033894A3
WO2006033894A3 PCT/US2005/032574 US2005032574W WO2006033894A3 WO 2006033894 A3 WO2006033894 A3 WO 2006033894A3 US 2005032574 W US2005032574 W US 2005032574W WO 2006033894 A3 WO2006033894 A3 WO 2006033894A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat riser
riser
dissipation device
operative
Prior art date
Application number
PCT/US2005/032574
Other languages
English (en)
Other versions
WO2006033894A2 (fr
Inventor
Joseph P Capp
Gary G Chen
David S Flaherty
Original Assignee
Advanced Energy Tech
Joseph P Capp
Gary G Chen
David S Flaherty
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Energy Tech, Joseph P Capp, Gary G Chen, David S Flaherty filed Critical Advanced Energy Tech
Priority to CN2005800314506A priority Critical patent/CN101084704B/zh
Priority to EP05798089A priority patent/EP1794530A4/fr
Publication of WO2006033894A2 publication Critical patent/WO2006033894A2/fr
Publication of WO2006033894A3 publication Critical patent/WO2006033894A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne un volet de réchauffeur (10) permettant de combler l'espace entre une source thermique et un dispositif de dissipation thermique dans un composant électronique. Le volet de réchauffeur est constitué d'un article de graphite souple possédant deux surfaces fonctionnelles (10a, 10b), l'une venant en contact fonctionnel avec une surface de la source thermique (100), l'autre venant en contact fonctionnel avec une surface du dispositif de dissipation thermique (110).
PCT/US2005/032574 2004-09-17 2005-09-13 Volet de rechauffeur WO2006033894A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2005800314506A CN101084704B (zh) 2004-09-17 2005-09-13 热提升装置
EP05798089A EP1794530A4 (fr) 2004-09-17 2005-09-13 Volet de rechauffeur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/943,338 2004-09-17
US10/943,338 US20060070720A1 (en) 2004-09-17 2004-09-17 Heat riser

Publications (2)

Publication Number Publication Date
WO2006033894A2 WO2006033894A2 (fr) 2006-03-30
WO2006033894A3 true WO2006033894A3 (fr) 2007-06-07

Family

ID=36090472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/032574 WO2006033894A2 (fr) 2004-09-17 2005-09-13 Volet de rechauffeur

Country Status (5)

Country Link
US (1) US20060070720A1 (fr)
EP (1) EP1794530A4 (fr)
KR (1) KR20070083642A (fr)
CN (1) CN101084704B (fr)
WO (1) WO2006033894A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299261B2 (ja) * 2005-03-31 2009-07-22 東洋炭素株式会社 伝熱シート、放熱構造体および伝熱シートの使用方法
DE202006010757U1 (de) * 2006-07-11 2006-11-02 Sgl Carbon Ag Kühlvorrichtung
US20100009174A1 (en) * 2008-07-10 2010-01-14 Reis Bradley E Heat Dissipation For Low Profile Devices
EP2321607A1 (fr) * 2008-08-04 2011-05-18 Clustered Systems Company Boîtier électronique refroidi par contact
US8955580B2 (en) 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8537553B2 (en) * 2011-02-14 2013-09-17 Futurewei Technologies, Inc. Devices having anisotropic conductivity heatsinks, and methods of making thereof
CN103415184A (zh) * 2013-07-23 2013-11-27 苏州天脉导热科技有限公司 一种热传递与热扩散器件的结合方法
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US4895713A (en) * 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
US4961991A (en) * 1990-01-29 1990-10-09 Ucar Carbon Technology Corporation Flexible graphite laminate
US5198063A (en) * 1991-06-03 1993-03-30 Ucar Carbon Technology Corporation Method and assembly for reinforcing flexible graphite and article
US5260124A (en) * 1991-11-25 1993-11-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Intercalated hybrid graphite fiber composite
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5902762A (en) * 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
US6060166A (en) * 1998-02-05 2000-05-09 Raytheon Company Flexible graphite fiber thermal shunt
US6245400B1 (en) * 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
US6404061B1 (en) * 1999-02-26 2002-06-11 Rohm Co., Ltd. Semiconductor device and semiconductor chip
JP2000273196A (ja) * 1999-03-24 2000-10-03 Polymatech Co Ltd 熱伝導性樹脂基板および半導体パッケージ
EP2248645A1 (fr) * 1999-04-07 2010-11-10 GrafTech International Holdings Inc. Article de graphite flexible et son procédé de fabrication
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6286591B1 (en) * 1999-11-08 2001-09-11 Space Systems/Loral, Inc. Thermal harness using thermal conductive fiber and polymer matrix material
US6841250B2 (en) * 2000-02-25 2005-01-11 Advanced Energy Technology Inc. Thermal management system
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US6351386B1 (en) * 2001-03-13 2002-02-26 Motorola, Inc. Component shim for mounting a component on a heat spreader
US20020157819A1 (en) * 2001-04-04 2002-10-31 Julian Norley Graphite-based thermal dissipation component
US20020157818A1 (en) * 2001-04-04 2002-10-31 Julian Norley Anisotropic thermal solution
US7232601B2 (en) * 2001-05-31 2007-06-19 Advanced Energy Technology Inc. Method for preparing composite flexible graphite material
US6777086B2 (en) * 2001-08-31 2004-08-17 Julian Norley Laminates prepared from impregnated flexible graphite sheets
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US7108055B2 (en) * 2002-03-29 2006-09-19 Advanced Energy Technology Inc. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US20040118553A1 (en) * 2002-12-23 2004-06-24 Graftech, Inc. Flexible graphite thermal management devices
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US6874573B2 (en) * 2003-07-31 2005-04-05 National Starch And Chemical Investment Holding Corporation Thermal interface material
US7160619B2 (en) * 2003-10-14 2007-01-09 Advanced Energy Technology Inc. Heat spreader for emissive display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1794530A4 *

Also Published As

Publication number Publication date
CN101084704A (zh) 2007-12-05
KR20070083642A (ko) 2007-08-24
WO2006033894A2 (fr) 2006-03-30
US20060070720A1 (en) 2006-04-06
EP1794530A2 (fr) 2007-06-13
CN101084704B (zh) 2011-08-10
EP1794530A4 (fr) 2009-04-29

Similar Documents

Publication Publication Date Title
WO2006033894A3 (fr) Volet de rechauffeur
WO2005115742A3 (fr) Materiau d'interface thermique ameliore
EP1781076A3 (fr) Assemblage électronique avec refroidissement sur plusieurs côtés, ainsi qu'une méthode
TW200626059A (en) Systems to cool multiple electrical components
TW200729436A (en) Integrated circuit device
WO2006073553A3 (fr) Appareil de refroidissement, systeme et procede associe
TW200629524A (en) Semiconductor device and electronic apparatus
WO2005033237A3 (fr) Dispositif d'augmentation du coefficient de friction de surfaces courbes
WO2007134176A3 (fr) Garniture antimicrobienne pour produit alimentaire
GB2403596B (en) Electronic thermal management utilising device with deflectable, two leg conductive member; and with elastic, thermally-conductive material therebetween
AU2003297452A1 (en) Fuel management system comprising a fluoroelastomer layer having a hydrotalcite compound
WO2004003713A3 (fr) Unite de refroidissement de composant generateur de chaleur
TW200609340A (en) Thermally conductive composition
EP1670072A4 (fr) Dispositif d'eclairage
TW200742035A (en) Low profile semiconductor package-on-package
TW200516100A (en) Nano-composite materials for thermal management applications
ATE515079T1 (de) Oberflächenmontagekomponente bildender steckverbinder
WO2008103331A3 (fr) Dispositifs à semi-conducteurs à large écart énergétique
WO2005048298A3 (fr) Solution thermique en sandwich
DE60308825D1 (de) Sicherheitslagerungsvorrichtung
TW200638850A (en) Heat-dissipating device with elastic piece and heat-dissipating method thereof
WO2008103263A3 (fr) Plateau destiné à être utilisé avec un système de fixation et de libération thermique qui maintient des composants par aspiration
AU2003254588A1 (en) Data support with transponder coil
TW200702172A (en) Heat spreader for printed circuit boards
EP1395103A3 (fr) Radiateur pour un circuit imprimé

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005798089

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200580031450.6

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020077008137

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2005798089

Country of ref document: EP

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)