WO2008138231A1 - Led lamp of highly efficient heat dissipation - Google Patents

Led lamp of highly efficient heat dissipation Download PDF

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Publication number
WO2008138231A1
WO2008138231A1 PCT/CN2008/000957 CN2008000957W WO2008138231A1 WO 2008138231 A1 WO2008138231 A1 WO 2008138231A1 CN 2008000957 W CN2008000957 W CN 2008000957W WO 2008138231 A1 WO2008138231 A1 WO 2008138231A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
heat
light source
cavity
led light
Prior art date
Application number
PCT/CN2008/000957
Other languages
French (fr)
Chinese (zh)
Inventor
Jie She
Original Assignee
Jie She
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jie She filed Critical Jie She
Publication of WO2008138231A1 publication Critical patent/WO2008138231A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40Lighting for industrial, commercial, recreational or military use
    • F21W2131/406Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the utility model relates to a high-power LED lamp, in particular to an array type high-power LED lamp with high heat dissipation. Background technique
  • LEDs have the advantages of low energy consumption, low heat generation and long service life, which can be used to replace traditional light sources. Considering that the luminance of a single LED is insufficient, LED lamps generally use a plurality of LEDs arranged in an array, thereby causing a problem that heat dissipation of high-power LED lamps is difficult.
  • the purpose of the utility model is to overcome the deficiencies of the prior art, and to provide an LED lamp with high heat dissipation, which has better heat dissipation effect, low energy consumption, long service life and small attenuation of light energy.
  • An LED lamp with high efficiency heat dissipation comprising an electrical cavity cover, a PCB circuit board, a PCB mounting plate, an open heat sink, at least one LED light source component unit and a light transmissive cover plate; each LED light source component unit comprises a single LED light source, Lens and two #_ conductive leads;
  • the electrical cavity cover and the PCB mounting plate are connected to each other to form a sealed electrical cavity I; the PCB circuit board is disposed in the electrical cavity I;
  • the open heat dissipating body includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of heat conducting ribs, and an upper portion of the heat conducting rib and the PCB mounting plate are connected to each other to form an open heat dissipating cavity II;
  • the transparent cover plate and the heat dissipation plate of the open heat sink are connected to each other to form a closed LED illumination cavity III; the at least one LED light source is disposed in the LED illumination cavity III;
  • the other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire perforations, and each LED light source corresponds to two LED wire perforations;
  • the plurality of heat conducting ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each of the hollow wire struts directly communicating with the outside air Contacting; having a plurality of wire perforations corresponding to the LED wire perforations on the PCB mounting plate, each of the conductive leads of each of the LED light source assembly units passing through a hollow wire on a heat dissipation plate of the open heat sink
  • the struts, and through the wire perforations on the PCB mounting board, are connected to the PCB circuit board to make electrical connections to the corresponding electronic components.
  • An efficient heat dissipation LED lamp comprising an electrical cavity cover, a PCB circuit board, an open heat sink, at least one LED light source component unit and a light transmissive cover plate; each LED light source component unit comprises a single LED light source, a lens and two Conductive lead
  • the electrical cavity cover and the PCB circuit board are connected to each other to form a sealed electrical cavity I; and a circuit is directly printed on the PCB circuit board inside the electrical cavity I;
  • the open heat sink includes a heat dissipation plate, and one side of the heat dissipation plate is provided with a plurality of heat conduction ribs, and an upper portion of the heat conduction rib and another side of the PCB circuit board are connected to each other to form an open heat dissipation cavity.
  • the light-transmissive cover plate and the heat-dissipating plate of the open heat-dissipating body are connected to each other to form a sealed LED illumination cavity III; the at least one LED light source is disposed in the LED illumination cavity III;
  • the other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire perforations, and each LED light source corresponds to two LED wire perforations;
  • the plurality of heat conducting ribs includes a plurality of hollow wire struts, each hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire strut directly contacting the outside Air contact; on the PCB circuit board, there are a plurality of wire perforations corresponding to the LED wire perforations, and each of the conductive leads of each of the LED light source component units passes through a hollow plate on the heat dissipation plate of the open heat sink
  • the wire struts are pierced through the wires on the PCB circuit board and connected to the PCB circuit board to make electrical connections to the corresponding electronic components.
  • the high-efficiency heat-dissipating LED lamp of the utility model adopts a three-chamber structure, and the structure thereof is reasonable and compact, the manufacturing is easy, and the heat dissipation effect is good.
  • the present invention has the following advantages: (1) Efficient heat dissipation: transferring heat generated by the LED light source into the open heat sink; a plurality of heat conductive ribs are disposed on one side of the heat sink of the open heat sink, and the plurality of heat conductive ribs include a plurality of hollow Wire struts, each of the hollow wire struts is for accommodating only one conductive lead of the LED light source assembly unit, and each hollow wire strut is directly in contact with outside air; the open heat sink is exposed to the air, The outside natural wind convects the hot air in the open heat dissipation cavity and the cold air outside by the gap between the plurality of staggered grid-shaped heat conduction bars on the open heat radiator, and quickly maximizes the heat generated by the LED light
  • the heat generated by the electrical cavity does not affect the luminous efficiency and life of the light source:
  • the LED lamp designed by the three-cavity structure design method enables spatial isolation between the LED electrical cavity portion and the LED illumination cavity portion, so that The working environments of the two cavities do not affect each other, and the heat generated by the LED electric cavity part and the LED lighting cavity part does not form a superposition, so the cooling effect is realized by the reasonable arrangement of the space structure, and the LED is further extended. The life of the luminaire and the constant illuminating effect are maintained.
  • FIG. 1 is a schematic structural view of a vertical cross section of Embodiment 1 of an LED lamp for efficient heat dissipation of the present invention.
  • FIG. 1 is a schematic diagram of lateral heat conduction and air convection of the LED lamp shown in FIG. 1.
  • FIG. 2 is an LED of FIG. Schematic diagram of the structure of the luminaire;
  • FIG. 3 is a schematic structural view of a vertical longitudinal section of the LED lamp shown in FIG. 1;
  • FIG. 3a is a schematic diagram of the heat conduction principle of the vertical longitudinal section of the LED lamp shown in FIG. 1;
  • FIG. 3b is a schematic diagram of the air convection principle of the horizontal section of the LED lamp shown in FIG.
  • Embodiment 2 of the LED lamp of the present invention for efficiently dissipating heat
  • FIG. 5 is a schematic structural view of Embodiment 3 of the LED lamp of the present invention for efficiently dissipating heat
  • Embodiment 4 of the LED lamp of the present invention for efficiently dissipating heat
  • Embodiment 7 is a schematic structural view of Embodiment 5 of the LED lamp of the present invention for efficiently dissipating heat
  • Embodiment 6 of the LED lamp of the present invention is a schematic structural view of Embodiment 6 of the LED lamp of the present invention for efficiently dissipating heat
  • Embodiment 7 of the LED lamp of the present invention for efficiently dissipating heat
  • Embodiment 8 of the LED lamp of the present invention for efficiently dissipating heat
  • FIG. 11 is a schematic structural view of Embodiment 9 of the LED lamp of the present invention for efficiently dissipating heat
  • FIG. 12 is a schematic structural view of Embodiment 10 of the LED lamp of the present invention for efficiently dissipating heat.
  • 1 is the upper cover
  • 2 is the PCB circuit board
  • 3 is the PCB mounting board
  • 4 is the LED wire perforation
  • 5 is the LED receiving hole
  • 6 is the open heat sink
  • 7 is the LED light source
  • 8 is the LED base
  • the disc 9 is a translucent cover
  • 10 is a lower cover
  • 11 is an air deflector.
  • the LED lamp with high efficiency heat dissipation is a long street lamp base, including an upper cover 1, 'PCB circuit board 2, PCB mounting board 3, open type
  • the heat sink 6, at least one LED light source unit, the light transmissive cover 9 and the lower cover 10.
  • Each LED light source assembly unit includes a single LED light source 7, a lens, an LED substrate 8 and two conductive leads, the at least one LED light source assembly unit having the same structure and dimensions.
  • the upper cover 1 and the PCB mounting plate 3 are connected to each other to form a sealed electrical cavity I; the PCB circuit board 2 is disposed in the electrical cavity 1.
  • the PCB circuit board 2 can directly supply the working voltage required by the LED light source 7 by using a battery pack, a battery or other power supply device.
  • the open heat sink 6 includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of staggered heat conducting ribs, and the upper portion of the heat conducting rib and the PCB mounting plate 3 are connected to each other to form an open heat dissipating cavity II.
  • the heat dissipation plate and the heat conduction rib may be an integrated structure.
  • the heat dissipation plates of the transparent cover plate 9, the lower cover 10 and the open heat sink 6 are connected to each other to form a closed LED illumination cavity III; the at least one LED light source 7 is disposed in the LED illumination cavity .
  • the other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire through holes 4 and a plurality of LED receiving holes 5.
  • Each LED light source 7 corresponds to one LED receiving hole 5 and two LED wire through holes 4; the plurality of LED receiving holes 5 have the same size and are arranged in an array, and the adjacent LED receiving holes 5 are in the lateral direction. Have a consistent spacing with the longitudinal direction.
  • the surface of the heat dissipation plate to which the LED light source 7 is attached may be substantially planar or curved, and each LED light source 7 is attached to a LED receiving hole 5 through the LED substrate 8. Among them, the LED base plate 8 and the teaching hot plate are thermally contacted by a thermal conductive adhesive.
  • the plurality of thermally conductive ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire struts directly communicating with outside air contact. Having a plurality of wire perforations corresponding to the LED wire perforations 4 on the PCB mounting board 3, each of which Each of the conductive leads of the LED light source assembly unit passes through a hollow wire post on the heat dissipation plate of the open heat sink 6, and is pierced through a wire on the PCB mounting plate 3, and is connected to the PCB circuit board 2, and correspondingly Electronic components enable circuit connections.
  • the PCB mounting board 3, the upper cover 1, the open heat sink 6, the LED base 8, and the lower cover 10 are made of a heat conductive material, and the heat conductive material may be an aluminum alloy or a copper alloy or other heat conductive metal alloy.
  • the LED lamp that efficiently dissipates heat is an LED tunnel lamp.
  • the LED lamp that efficiently dissipates heat is an LED spotlight.
  • the LED lamp that efficiently dissipates heat is an LED floodlight.
  • the LED lamp that efficiently dissipates heat is an LED wall washer.
  • the LED lamp which efficiently dissipates heat is an LED embedded lamp.
  • the LED lamp that efficiently dissipates heat is an LED chandelier.
  • the LED lamp for efficient heat dissipation is an LED ceiling lamp.
  • the LED lamp which efficiently dissipates heat is an LED cup lamp.
  • the LED lamp which efficiently dissipates heat is an LED car headlight.
  • the LED electrical cavity I and the LED illumination cavity III of the LED lamp for outdoor illumination must have a sealing property inside the cavity to meet the waterproof requirement of IP65 or above; the LED electrical cavity of the LED lamp used for indoor illumination I, LED lighting cavity III, the internal sealing of the cavity must meet the waterproof requirements of IP20 or above.
  • a plurality of LED accommodating holes 5 are provided, each of the LED light sources 7 corresponding to one LED accommodating hole 5, and each of the LED light sources 7 It is attached to one of the LED housing holes 5 through the LED substrate 8.
  • the LED receiving hole 5 may not be used, but The LED light source 7 is directly attached to the heat dissipation plate.
  • the LED light source 7 is in contact with the open heat sink 6 through the LED base 8.
  • the LED base 8 may also be omitted, and the LED light source 7 is directly connected to the open heat sink. 6 to achieve contact.
  • the PCB circuit board 2 carrying the circuit is separately provided.
  • the PCB circuit board 2 and the PCB circuit mounting board 3 may be combined into a single PCB circuit board, and the circuit is covered by a lamination process.
  • the positional relationship between the three chambers of the LED electrical cavity I, the open heat dissipation cavity II, and the LED illumination cavity is not fixed, and the positional relationship can be adjusted according to the specific modeling requirements of the lighting fixture. And change.

Abstract

A LED lamp of highly efficient heat dissipation comprises a PCB install board, a PCB circuit board, a LED light source and lens. One LED electrical equipment cavity, an open-type heat dissipation cavity and a LED lighting cavity are set on the lamp body separately. The LED electrical equipment cavity is consisted of an upside cover board, the PCB circuit board and the PCB install board. Some grid ribs, on the upside of the open-type heat dissipation body, are made up of the open-type heat dissipation cavity. There are some LED lead perforations and LED holding holes at the down surface of the open-type heat dissipation body. The LED lightingcavity is consisted of the open-type heat dissipation body, the LED light source, the lens, a LED substrate, a lamp cover and a downside cover board.

Description

高效散热的 LED灯具  Efficient heat dissipation LED lamps
技术领域 Technical field
本实用新型涉及一种大功率 LED灯具,特別是涉及一种高效散热的阵列式大功率 LED灯具。 背景技术  The utility model relates to a high-power LED lamp, in particular to an array type high-power LED lamp with high heat dissipation. Background technique
LED有能耗低, 发热量较低和使用寿命长的优点, 可以用于替代传统光源。 考虑 到单个 LED的发光亮度不足, LED灯具一般采用阵列式排列的多个 LED, 由此产生了 大功率 LED灯具散热难的问题。  LEDs have the advantages of low energy consumption, low heat generation and long service life, which can be used to replace traditional light sources. Considering that the luminance of a single LED is insufficient, LED lamps generally use a plurality of LEDs arranged in an array, thereby causing a problem that heat dissipation of high-power LED lamps is difficult.
现有技术中的大功率 LED灯具所采用的散热技术多为间接散热, 散热效果不佳。 在中国专利授权公告号 CN2557805Y文献中, 公开了一种大功率发光二极管灯, 在该 方案中, 多个 LED管芯 1被安装在一个高导热率基板 2上, 基板 2与一个散热装置 3 紧密接触, 从而将多个 LED管芯 1 的热量散发出去。 但是, 在该方案中, 所有 LED 管芯通过公共的导电引线 10, 经由同一 >导线支柱被引导到驱动器 6, 因此, 空气流 通不畅, 散热效果不佳, 甚至需要加装风扇 11。 实用新型内容  The heat dissipation technology used in the high-power LED lamps in the prior art is mostly indirect heat dissipation, and the heat dissipation effect is not good. In the Chinese Patent Publication No. CN2557805Y, a high-power LED lamp is disclosed. In this solution, a plurality of LED dies 1 are mounted on a high thermal conductivity substrate 2, and the substrate 2 is closely coupled to a heat sink 3. Contact, thereby dissipating heat from the plurality of LED dies 1. However, in this solution, all of the LED dies are guided to the driver 6 through the common conductive lead 10 via the common conductive lead 10, so that the air flow is not smooth, the heat dissipation is not good, and even the fan 11 needs to be added. Utility model content
本实用新型的目的是克服现有技术的不足之处, 而提供一种高效散热的 LED灯 具, 其具有更好的散热效果, 能耗低, 使用寿命长, 光能衰減小。  The purpose of the utility model is to overcome the deficiencies of the prior art, and to provide an LED lamp with high heat dissipation, which has better heat dissipation effect, low energy consumption, long service life and small attenuation of light energy.
为了实现本实用新型的目的, 采用了以下的技术方案:  In order to achieve the object of the present invention, the following technical solutions are adopted:
一种高效散热的 LED灯具, 包括电器腔盖板, PCB电路板, PCB安装板, 开放式 散热体, 至少一个 LED光源组件单元和透光罩板; 每个 LED光源组件单元包括单个 LED光源、 透镜和两#_导电引线;  An LED lamp with high efficiency heat dissipation, comprising an electrical cavity cover, a PCB circuit board, a PCB mounting plate, an open heat sink, at least one LED light source component unit and a light transmissive cover plate; each LED light source component unit comprises a single LED light source, Lens and two #_ conductive leads;
其中, 所述电器腔盖板和所述 PCB安装板相互连接, 形成密闭式电器腔 I; 所述 PCB电路板被设置在所述电器腔 I内;  Wherein, the electrical cavity cover and the PCB mounting plate are connected to each other to form a sealed electrical cavity I; the PCB circuit board is disposed in the electrical cavity I;
所述开放式散热体包括散热板, 所述散热板的一侧设有多根导热筋条, 所述导热 筋条的上部和所述 PCB安装板相互连接, 形成开放式散热腔 II;  The open heat dissipating body includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of heat conducting ribs, and an upper portion of the heat conducting rib and the PCB mounting plate are connected to each other to form an open heat dissipating cavity II;
所述透光罩板和开放式散热体的所述散热板相互连接,形成密闭式的 LED照明腔 III; 所述至少一个 LED光源被设置在所述 LED照明腔 III内; 所迷散热板的与导热筋条相对的另一侧,设有多个 LED导线穿孔,每个 LED光源 对应于两个 LED导线穿孔; The transparent cover plate and the heat dissipation plate of the open heat sink are connected to each other to form a closed LED illumination cavity III; the at least one LED light source is disposed in the LED illumination cavity III; The other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire perforations, and each LED light source corresponds to two LED wire perforations;
所迷多个导热筋条包括有多个中空的导线支柱,每个中空导线支柱用于仅容纳所 述 LED光源组件单元的一根导电引线穿过,每个中空的导线支柱都直接与外界空气接 触; 在所述 PCB安装板上具有多个与所述 LED导线穿孔相应的导线穿孔, 每个所述 LED光源組件单元的每根导电引线, 穿过开放式散热体的散热板上的中空导线支柱, 并且穿过 PCB安装板上的导线穿孔,被连接到 PCB电路板上, 与相应的电子元器件实 现电路连接。  The plurality of heat conducting ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each of the hollow wire struts directly communicating with the outside air Contacting; having a plurality of wire perforations corresponding to the LED wire perforations on the PCB mounting plate, each of the conductive leads of each of the LED light source assembly units passing through a hollow wire on a heat dissipation plate of the open heat sink The struts, and through the wire perforations on the PCB mounting board, are connected to the PCB circuit board to make electrical connections to the corresponding electronic components.
本实用新型的技术方案还可以是:  The technical solution of the utility model can also be:
一种高效散热的 LED灯具, 包括电器腔盖板, PCB电路板, 开放式散热体, 至 少一个 LED光源组件单元和透光罩板;每个 LED光源組件单元包括单个 LED光源、透 镜和两根导电引线;  An efficient heat dissipation LED lamp, comprising an electrical cavity cover, a PCB circuit board, an open heat sink, at least one LED light source component unit and a light transmissive cover plate; each LED light source component unit comprises a single LED light source, a lens and two Conductive lead
其中, 所述电器腔盖板和所述 PCB电路板相互连接, 形成密闭式电器腔 I; 在所 述电器腔 I内侧的 PCB电路板上直接印刷有电路;  Wherein, the electrical cavity cover and the PCB circuit board are connected to each other to form a sealed electrical cavity I; and a circuit is directly printed on the PCB circuit board inside the electrical cavity I;
所述开放式散热体包括散热板, 所述散热板的一侧设有多根导热筋条, 所述导热 筋条的上部和所述 PCB电路板的另一个侧面相互连接, 形成开放式散热腔 II;  The open heat sink includes a heat dissipation plate, and one side of the heat dissipation plate is provided with a plurality of heat conduction ribs, and an upper portion of the heat conduction rib and another side of the PCB circuit board are connected to each other to form an open heat dissipation cavity. II;
所述透光罩板和开放式散热体的所述散热板相互连接,形成密闭式的 LED照明腔 III; 所述至少一个 LED光源被设置在所述 LED照明腔 III内;  The light-transmissive cover plate and the heat-dissipating plate of the open heat-dissipating body are connected to each other to form a sealed LED illumination cavity III; the at least one LED light source is disposed in the LED illumination cavity III;
所述散热板的与导热筋条相对的另一侧,设有多个 LED导线穿孔,每个 LED光源 对应于两个 LED导线穿孔;  The other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire perforations, and each LED light source corresponds to two LED wire perforations;
所述多个导热筋条包括有多个中空的导线支柱,每个中空导线支柱用于仅容纳所 述 LED光源组件单元的一才艮导电引线穿过,每个中空的导线支柱都直接与外界空气接 触; 在所迷 PCB电路板上具有多个与所述 LED导线穿孔相应的导线穿孔, 每个所述 LED光源组件单元的每根导电引线, 穿过开放式散热体的散热板上的中空导线支柱, 并且穿过 PCB电路板上的导线穿孔,被连接到 PCB电路板上, 与相应的电子元器件实 现电路连接。  The plurality of heat conducting ribs includes a plurality of hollow wire struts, each hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire strut directly contacting the outside Air contact; on the PCB circuit board, there are a plurality of wire perforations corresponding to the LED wire perforations, and each of the conductive leads of each of the LED light source component units passes through a hollow plate on the heat dissipation plate of the open heat sink The wire struts are pierced through the wires on the PCB circuit board and connected to the PCB circuit board to make electrical connections to the corresponding electronic components.
本实用新型的高效散热的 LED灯具采用了三腔结构, 其结构合理紧凑, 生产制造 容易, 散热效果好。 具体地说, 本实用新型具有以下优点: (一 )高效散热: 将 LED光源产生的热量传导入开放式散热体; 在开放式散热体 的散热板的一侧设有多根导热筋条, 所述多个导热筋条包括有多个中空的导线支柱, 每个中空导线支柱用于仅容纳所述 LED光源组件单元的一根导电引线穿过,每个中空 的导线支柱都直接与外界空气接触; 开放式散热体棵露于空气中, 外界自然风通过开 放式散热体上部分多根错落有致的格栅状导热筋条间的空隙实现开放式散热腔体内 的热空气与外界的冷空气对流, 迅速的将 LED光源产生的热量最大限度的散发出去, 从而实现了高效的散热效果。 The high-efficiency heat-dissipating LED lamp of the utility model adopts a three-chamber structure, and the structure thereof is reasonable and compact, the manufacturing is easy, and the heat dissipation effect is good. Specifically, the present invention has the following advantages: (1) Efficient heat dissipation: transferring heat generated by the LED light source into the open heat sink; a plurality of heat conductive ribs are disposed on one side of the heat sink of the open heat sink, and the plurality of heat conductive ribs include a plurality of hollow Wire struts, each of the hollow wire struts is for accommodating only one conductive lead of the LED light source assembly unit, and each hollow wire strut is directly in contact with outside air; the open heat sink is exposed to the air, The outside natural wind convects the hot air in the open heat dissipation cavity and the cold air outside by the gap between the plurality of staggered grid-shaped heat conduction bars on the open heat radiator, and quickly maximizes the heat generated by the LED light source. Emitted to achieve efficient heat dissipation.
(二)电器腔产生的热量不会影响光源的发光效率及寿命: 运用该三腔体结构设 计方法设计的 LED灯具,使 LED电器腔体部分与 LED照明腔体部分实现空间上的隔离, 使这两个腔体各自的工作环境互不影响, LED电器腔体部分与 LED照明腔体部分工作 时所产生热量不会形成叠加, 因而通过空间结构的合理配置实现了降温效果, 进一步 延长了 LED灯具的使用寿命和保持了发光效果的恒定。 说明  (2) The heat generated by the electrical cavity does not affect the luminous efficiency and life of the light source: The LED lamp designed by the three-cavity structure design method enables spatial isolation between the LED electrical cavity portion and the LED illumination cavity portion, so that The working environments of the two cavities do not affect each other, and the heat generated by the LED electric cavity part and the LED lighting cavity part does not form a superposition, so the cooling effect is realized by the reasonable arrangement of the space structure, and the LED is further extended. The life of the luminaire and the constant illuminating effect are maintained. Description
图 1是本实用新型高效散热的 LED灯具的实施例 1的垂直橫向截面的结构示意 图 la是图 1所示的 LED灯具的横向热量传导及空气对流原理示意图; 图 2是图 1所示的 LED灯具的结构分解示意图;  1 is a schematic structural view of a vertical cross section of Embodiment 1 of an LED lamp for efficient heat dissipation of the present invention. FIG. 1 is a schematic diagram of lateral heat conduction and air convection of the LED lamp shown in FIG. 1. FIG. 2 is an LED of FIG. Schematic diagram of the structure of the luminaire;
图 3是图 1所示的 LED灯具的垂直纵向截面的结构示意图;  3 is a schematic structural view of a vertical longitudinal section of the LED lamp shown in FIG. 1;
图 3a是图 1所示的 LED灯具的垂直纵向截面的热量传导原理示意图; 图 3b是图 1所示的 LED灯具的水平截面的空气对流原理示意图;  3a is a schematic diagram of the heat conduction principle of the vertical longitudinal section of the LED lamp shown in FIG. 1; FIG. 3b is a schematic diagram of the air convection principle of the horizontal section of the LED lamp shown in FIG.
图 4是本实用新型高效散热的 LED 灯具的实施例 2的结构示意图;  4 is a schematic structural view of Embodiment 2 of the LED lamp of the present invention for efficiently dissipating heat;
图 5是本实用新型高效散热的 LED灯具的实施例 3的结构示意图;  FIG. 5 is a schematic structural view of Embodiment 3 of the LED lamp of the present invention for efficiently dissipating heat; FIG.
图 6是本实用新型高效散热的 LED 灯具的实施例 4的结构示意图;  6 is a schematic structural view of Embodiment 4 of the LED lamp of the present invention for efficiently dissipating heat;
图 7是本实用新型高效散热的 LED 灯具的实施例 5的结构示意图;  7 is a schematic structural view of Embodiment 5 of the LED lamp of the present invention for efficiently dissipating heat;
图 8是本实用新型高效散热的 LED灯具的实施例 6的结构示意图;  8 is a schematic structural view of Embodiment 6 of the LED lamp of the present invention for efficiently dissipating heat;
图 9是本实用新型高效散热的 LED灯具的实施例 7的结构示意图;  9 is a schematic structural view of Embodiment 7 of the LED lamp of the present invention for efficiently dissipating heat;
图 10是本实用新型高效散热的 LED 灯具的实施例 8的结构示意图;  10 is a schematic structural view of Embodiment 8 of the LED lamp of the present invention for efficiently dissipating heat;
图 11是本实用新型高效散热的 LED 灯具的实施例 9的结构示意图; 图 12是本实用新型高效散热的 LED灯具的实施例 10的结构示意图。 11 is a schematic structural view of Embodiment 9 of the LED lamp of the present invention for efficiently dissipating heat; FIG. 12 is a schematic structural view of Embodiment 10 of the LED lamp of the present invention for efficiently dissipating heat.
图中: 1是上盖板, 2是 PCB电路板, 3是 PCB安装板, 4是 LED导线穿孔, 5 是 LED容置孔, 6是开放式散热体, 7是 LED光源, 8是 LED基盘, 9是透光罩板, 10 是下盖板, 11是空气导流板。  In the figure: 1 is the upper cover, 2 is the PCB circuit board, 3 is the PCB mounting board, 4 is the LED wire perforation, 5 is the LED receiving hole, 6 is the open heat sink, 7 is the LED light source, 8 is the LED base The disc, 9 is a translucent cover, 10 is a lower cover, and 11 is an air deflector.
图 la、 图 3a、 图 3b中: 实线示意热量散发方向, 虚线示意空气对流方向。 具体实施方式  In Figure la, Figure 3a, Figure 3b: the solid line indicates the direction of heat dissipation, and the dotted line indicates the direction of air convection. detailed description
如图 1、 图 2和图 3所示, 在实施例 1中, 高效散热的 LED灯具为长条状的路 灯灯头, 包括上盖板 1 , ' PCB电路板 2, PCB安装板 3, 开放式散热体 6, 至少一个 LED 光源组件单元,透光罩板 9和下盖板 10。每个 LED光源组件单元包括单个 LED光源 7、 透镜、 LED基盘 8和两根导电引线, 所述至少一个 LED光源组件单元具有相同的结构 和尺寸。  As shown in FIG. 1, FIG. 2 and FIG. 3, in the first embodiment, the LED lamp with high efficiency heat dissipation is a long street lamp base, including an upper cover 1, 'PCB circuit board 2, PCB mounting board 3, open type The heat sink 6, at least one LED light source unit, the light transmissive cover 9 and the lower cover 10. Each LED light source assembly unit includes a single LED light source 7, a lens, an LED substrate 8 and two conductive leads, the at least one LED light source assembly unit having the same structure and dimensions.
其中, 上盖板 1和 PCB安装板 3相互连接, 形成密闭式电器腔 I; PCB电路板 2 被设置在所述电器腔 I内。 其中, 所述 PCB电路板 2可以采用电池组、 蓄电池或其它 供电装置直接提供 LED光源 7所需的工作电压。  The upper cover 1 and the PCB mounting plate 3 are connected to each other to form a sealed electrical cavity I; the PCB circuit board 2 is disposed in the electrical cavity 1. Wherein, the PCB circuit board 2 can directly supply the working voltage required by the LED light source 7 by using a battery pack, a battery or other power supply device.
开放式散热体 6包括散热板, 所述散热板的一侧设有多根错落有致的导热筋条, 所述导热筋条上部和 PCB安装板 3相互连接, 形成开放式散热腔 II。 其中, 所述散 热板与所述导热筋条可以为一体化结构。  The open heat sink 6 includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of staggered heat conducting ribs, and the upper portion of the heat conducting rib and the PCB mounting plate 3 are connected to each other to form an open heat dissipating cavity II. The heat dissipation plate and the heat conduction rib may be an integrated structure.
透光罩板 9、 下盖板 10和开放式散热体 6的所述散热板相互连接, 形成密闭式 的 LED照明腔 III; 所述至少一个 LED光源 7 皮设置在所迷 LED照明腔 ΙΠ内。  The heat dissipation plates of the transparent cover plate 9, the lower cover 10 and the open heat sink 6 are connected to each other to form a closed LED illumination cavity III; the at least one LED light source 7 is disposed in the LED illumination cavity .
所述散热板的与导热筋条相对的另一侧, 设有多个 LED导线穿孔 4和多个 LED 容置孔 5。 每个 LED光源 7对应于一个 LED容置孔 5和两个 LED导线穿孔 4; 所述多 个 LED容置孔 5具有相同的尺寸,呈阵列式排列,相邻的 LED容置孔 5在横向和纵向 上分别具有一致的间距。 其中, 所述的 LED光源 7所附着的散热板的表面可以大体 上为平面或曲面, 且每个 LED光源 7通过 LED基盘 8附着在一个 LED容置孔 5内。其 中, LED基盘 8与教热板之间通过导热胶实现热接触。  The other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire through holes 4 and a plurality of LED receiving holes 5. Each LED light source 7 corresponds to one LED receiving hole 5 and two LED wire through holes 4; the plurality of LED receiving holes 5 have the same size and are arranged in an array, and the adjacent LED receiving holes 5 are in the lateral direction. Have a consistent spacing with the longitudinal direction. The surface of the heat dissipation plate to which the LED light source 7 is attached may be substantially planar or curved, and each LED light source 7 is attached to a LED receiving hole 5 through the LED substrate 8. Among them, the LED base plate 8 and the teaching hot plate are thermally contacted by a thermal conductive adhesive.
所述多个导热筋条包括有多个中空的导线支柱,每个中空导线支柱用于仅容纳所 述 LED光源组件单元的一根导电引线穿过,每个中空的导线支柱都直接与外界空气接 触。在所述 PCB安装板 3上具有多个与所述 LED导线穿孔 4相应的导线穿孔,每个所 述 LED光源组件单元的每根导电引线,穿过开放式散热体 6的散热板上的中空导线支 柱, 并且穿过 PCB安装板 3上的导线穿孔, 被连接到 PCB电路板 2上, 与相应的电子 元器件实现电路连接。 The plurality of thermally conductive ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire struts directly communicating with outside air contact. Having a plurality of wire perforations corresponding to the LED wire perforations 4 on the PCB mounting board 3, each of which Each of the conductive leads of the LED light source assembly unit passes through a hollow wire post on the heat dissipation plate of the open heat sink 6, and is pierced through a wire on the PCB mounting plate 3, and is connected to the PCB circuit board 2, and correspondingly Electronic components enable circuit connections.
其中, PCB安装板 3、 上盖板 1、 开放式散热体 6、 LED基盘 8、 下盖板 10是由导 热材料制成, 导热材料可以是铝合金或铜合金或其他导热金属合金。  The PCB mounting board 3, the upper cover 1, the open heat sink 6, the LED base 8, and the lower cover 10 are made of a heat conductive material, and the heat conductive material may be an aluminum alloy or a copper alloy or other heat conductive metal alloy.
如图 1 ( a;)、 图 3 ( a )和图 3 ( b )所示, LED光源 7所产生的绝大部分热量被 直接传导入开放式散热体 6的散热板直至开放式散热体 6上的多根格栅状导热筋条, 热量散发方向如图中的实线所示。由于本灯具的开放式散热腔 II直接棵露于外界空气 中,外界自然风通过开放式散热体 6上的多根错落有致的格栅状导热筋条间的空隙实 现开放式散热腔 II内的热空气与外界的冷空气的对流, 空气对流方向如图中的虛线 所示。 因此, LED光源 7所产生的热量被最大限度地散发出去, 从而实现了高效的散 热效果。  As shown in Fig. 1 (a;), Fig. 3 (a) and Fig. 3 (b), most of the heat generated by the LED light source 7 is directly conducted into the heat sink of the open heat sink 6 until the open heat sink 6 A plurality of grid-shaped heat conducting ribs on the upper side, the heat dissipation direction is shown by the solid line in the figure. Since the open heat dissipation cavity II of the lamp is directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-shaped heat conduction bars on the open heat sink 6 to realize the inside of the open heat dissipation cavity II. The convection of hot air and cold air from the outside, the direction of air convection is shown by the dotted line in the figure. Therefore, the heat generated by the LED light source 7 is maximally dissipated, thereby achieving an efficient heat dissipation effect.
如图 4所示, 在实施例 2中, 高效散热的 LED灯具为 LED隧道灯。  As shown in FIG. 4, in Embodiment 2, the LED lamp that efficiently dissipates heat is an LED tunnel lamp.
如图 5所示, 在实施例 3中, 高效散热的 LED灯具为 LED射灯。  As shown in FIG. 5, in Embodiment 3, the LED lamp that efficiently dissipates heat is an LED spotlight.
如图 6所示, 在实施例 4中, 高效散热的 LED灯具为 LED投光灯。  As shown in FIG. 6, in Embodiment 4, the LED lamp that efficiently dissipates heat is an LED floodlight.
如图 7所示, 在实施例 5中, 高效散热的 LED灯具为 LED洗墙灯。 .  As shown in FIG. 7, in Embodiment 5, the LED lamp that efficiently dissipates heat is an LED wall washer. .
如图 8所示, 在实施例 6中, 高效散热的 LED灯具为 LED嵌入灯。  As shown in Fig. 8, in the embodiment 6, the LED lamp which efficiently dissipates heat is an LED embedded lamp.
如图 9所示, 在实施例 7中, 高效散热的 LED灯具为 LED吊灯。  As shown in FIG. 9, in Embodiment 7, the LED lamp that efficiently dissipates heat is an LED chandelier.
如图 10所示, 在实施例 8中, 高效散热的 LED灯具为 LED吸顶灯。  As shown in Fig. 10, in the eighth embodiment, the LED lamp for efficient heat dissipation is an LED ceiling lamp.
如图 11所示, 在实施例 9中, 高效散热的 LED灯具为 LED杯灯。  As shown in Fig. 11, in the embodiment 9, the LED lamp which efficiently dissipates heat is an LED cup lamp.
如图 12所示, 在实施例 10中, 高效散热的 LED灯具为 LED汽车大灯。  As shown in Fig. 12, in the embodiment 10, the LED lamp which efficiently dissipates heat is an LED car headlight.
上述实施例中, 用于户外照明的 LED灯具的 LED电器腔 I、 LED照明腔 III, 其腔 体内部的密闭性必须要达到 IP65以上防水要求; 用于户内照明的 LED灯具的 LED电 器腔 I、 LED照明腔 III , 其腔体内部的密闭性必须要达到 IP20以上防水要求。  In the above embodiment, the LED electrical cavity I and the LED illumination cavity III of the LED lamp for outdoor illumination must have a sealing property inside the cavity to meet the waterproof requirement of IP65 or above; the LED electrical cavity of the LED lamp used for indoor illumination I, LED lighting cavity III, the internal sealing of the cavity must meet the waterproof requirements of IP20 or above.
上述实施例是本实用新型的典型实施方式, 在其他不同的实施例中, 可以对技 术方案作不同的调整。  The above embodiments are typical embodiments of the present invention, and in other different embodiments, different adjustments can be made to the technical solutions.
在上述实施例中, 在散热板的与导热筋条相对的另一侧, 设有多个 LED容置孔 5, 每个 LED光源 7对应于一个 LED容置孔 5, 且每个 LED光源 7通过 LED基盘 8附 着在一个 LED容置孔 5内。 在其他实施例中, 所述 LED容置孔 5也可以不要, 而将 LED光源 7直接附着于散热板上。 In the above embodiment, on the other side of the heat dissipation plate opposite to the heat conductive rib, a plurality of LED accommodating holes 5 are provided, each of the LED light sources 7 corresponding to one LED accommodating hole 5, and each of the LED light sources 7 It is attached to one of the LED housing holes 5 through the LED substrate 8. In other embodiments, the LED receiving hole 5 may not be used, but The LED light source 7 is directly attached to the heat dissipation plate.
在上述实施例中, LED光源 7是通过 LED基盘 8实现与开放式散热体 6的接触, 在其他实施例中, LED基盘 8也可以不要, 而使 LED光源 7直接与开放式散热体 6实 现接触。  In the above embodiment, the LED light source 7 is in contact with the open heat sink 6 through the LED base 8. In other embodiments, the LED base 8 may also be omitted, and the LED light source 7 is directly connected to the open heat sink. 6 to achieve contact.
在上述实施例中, 单独设置了承载电路的 PCB电路板 2, 在其他实施例中, 还可 以将 PCB电路板 2和 PCB电路安装板 3合并为单一的 PCB电路板,采用覆膜工艺将电 路直接印刷在 PCB电路板的与开放式散热体 6的导热筋条相对的另一侧,使 PCB电路 板及相应电子元器件所产生的热量以同样方式传导至开放式散热体 6 的多根错落有 致的格栅状导热筋条上, 然后通过空气自对流方式实现高效散热效果。  In the above embodiment, the PCB circuit board 2 carrying the circuit is separately provided. In other embodiments, the PCB circuit board 2 and the PCB circuit mounting board 3 may be combined into a single PCB circuit board, and the circuit is covered by a lamination process. Directly printed on the other side of the PCB circuit board opposite to the heat conducting ribs of the open heat sink 6, so that the heat generated by the PCB circuit board and the corresponding electronic components is transmitted to the plurality of the floating heat sinks 6 in the same manner. It has a grid-like heat-conducting rib on the strip, and then achieves efficient heat dissipation by air self-convection.
另外, 在所迷 LED光源 7及透镜之外, 还可以在其上再附加其他对光线有管理 作用的装置。  In addition, in addition to the LED light source 7 and the lens, other means for managing the light may be added thereto.
另外, 所述 LED电器腔 I、 开放式散热腔 II、 LED照明腔 ΙΠ三个腔体相互之间 的位置关系不是固定不变的,其位置关系可以根据照明灯具的具体造型要求做位置的 调整和改变。  In addition, the positional relationship between the three chambers of the LED electrical cavity I, the open heat dissipation cavity II, and the LED illumination cavity is not fixed, and the positional relationship can be adjusted according to the specific modeling requirements of the lighting fixture. And change.

Claims

权利要求 Rights request
1、一种高效散热的 LED灯具, 包括电器腔盖板( 1 ), PCB电路板( 2 ), PCB安装板( 3 ), 开放式散热体( 6 ), 至少一个 LED光源组件单元和透光罩板( 9 ); 每个 LED光源组件 单元包括单个 LED光源 (7 )、 透镜和两根导电引线;  1. An efficient heat-dissipating LED lamp, comprising an electrical cavity cover (1), a PCB circuit board (2), a PCB mounting plate (3), an open heat sink (6), at least one LED light source component unit and light transmission a cover plate (9); each LED light source assembly unit comprises a single LED light source (7), a lens and two conductive leads;
其中, 所述电器腔盖板 ( 1 )和所述 PCB安装板 ( 3 )相互连接, 形成密闭式电器 腔( I ); 所述 PCB电路板 ( 2 )被设置在所述电器腔( I ) 内;  Wherein, the electrical chamber cover (1) and the PCB mounting plate (3) are connected to each other to form a closed electrical cavity (I); the PCB circuit board (2) is disposed in the electrical cavity (I) Inside;
所迷开放式散热体(6 ) 包括散热板, 所述散热板的一侧设有多根导热筋条, 所 述导热筋条的上部和所述 PCB安装板 ( 3 )相互连接, 形成开放式散热腔(II ) ; 所迷透光罩板(9 )和开放式散热体(6 )的所述散热板相互连接, 形成密闭式的 LED照明腔( III ) ; 所述至少一个 LED光源 ( 7 )被设置在所述 LED照明腔 III内; 所迷散热板的与导热筋条相对的另一侧, 设有多个 LED导线穿孔( 4 ), 每个 LED 光源 (7 )对应于两个 LED导线穿孔(4 );  The open heat sink (6) includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of heat conducting ribs, and an upper portion of the heat conducting rib and the PCB mounting plate (3) are connected to each other to form an open type The heat dissipation cavity (II); the heat dissipation plate of the translucent cover plate (9) and the open heat sink (6) are connected to each other to form a closed LED illumination cavity (III); the at least one LED light source (7) Is disposed in the LED illumination cavity III; on the other side of the heat dissipation plate opposite to the heat conducting rib, a plurality of LED wire perforations (4) are provided, and each LED light source (7) corresponds to two LEDs Wire perforation (4);
所述多个导热筋条包括有多个中空的导线支柱,每个中空导线支柱用于仅容纳所 述 LED光源组件单元的一根导电引线穿过,每个中空的导线支柱都直接与外界空气接 触; 在所述 PCB安装板 ( 3 )上具有多个与所述 LED导线穿孔(4 )相应的导线穿孔, 每个所迷 LED光源组件单元的每根导电引线, 穿过开放式散热体 ( 6 )的散热板上的 中空导线支柱, 并且穿过 PCB安装板 ( 3 )上的导线穿孔, 被连接到 PCB电路板 ( 2 ) 上, 与相应的电子元器件实现电路连接。  The plurality of thermally conductive ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire struts directly communicating with outside air Contacting; having a plurality of wire perforations corresponding to the LED wire through holes (4) on the PCB mounting board (3), each of the conductive leads of each of the LED light source component units passing through the open heat sink ( 6) The hollow wire struts on the heat sink board, and through the wire perforations on the PCB mounting board (3), are connected to the PCB circuit board (2) to make electrical connections with the corresponding electronic components.
2、 一种高效散热的 LED灯具, 包括电器腔盖板(1 ), PCB电路板, 开放式散热 体( 6 ), 至少一个 LED光源组件单元和透光罩板( 9 ); 每个 LED光源组件单元包括单 个 LED光源 (7 )、 透镜和两根导电引线;  2. An efficient heat-dissipating LED lamp, comprising an electrical cavity cover (1), a PCB circuit board, an open heat sink (6), at least one LED light source component unit and a light-transmitting cover plate (9); each LED light source The component unit comprises a single LED light source (7), a lens and two conductive leads;
其中,所述电器腔盖板( 1 )和所述 PCB电路板相互连接,形成密闭式电器腔( I ) ; 在所述电器腔(I ) 内侧的 PCB电路板上直接印刷有电路;  Wherein, the electrical chamber cover (1) and the PCB circuit board are connected to each other to form a closed electrical cavity (I); and a circuit is directly printed on the PCB circuit board inside the electrical cavity (I);
所述开放式散热体(6 ) 包括散热板, 所述散热板的一侧设有多根导热筋条, 所 述导热筋条的上部和所述 PCB电路板的另一个侧面相互连接, 形成开放式散热腔 ( II );  The open heat sink (6) includes a heat dissipating plate, and one side of the heat dissipating plate is provided with a plurality of heat conducting ribs, and an upper portion of the heat conducting rib and another side of the PCB circuit board are connected to each other to form an open Heat sink (II);
所述透光罩板(9 )和开放式散热体(6 )的所述散热板相互连接, 形成密闭式的 LED照明腔( III ) ; 所述至少一个 LED光源 ( 7 )被设置在所述 LED照明腔( III ) 内; 所述散热板的与导热筋条相对的另一侧, 设有多个 LED导线穿孔(4 ), 每个 LED 光源 (7 )对应于两个 LED导线穿孔(4 ); The light-transmitting cover plate (9) and the heat dissipation plate of the open heat sink (6) are connected to each other to form a closed LED illumination cavity (III); the at least one LED light source (7) is disposed in the LED lighting cavity (III); The other side of the heat dissipation plate opposite to the heat conducting rib is provided with a plurality of LED wire through holes (4), and each LED light source (7) corresponds to two LED wire holes (4);
所述多个导热筋条包括有多个中空的导线支柱,每个中空导线支柱用于仅容纳所 述 LED光源组件单元的一根导电引线穿过,每个中空的导线支柱都直接与外界空气接 触; 在所述 PCB电路板上具有多个与所述 LED导线穿孔(4 )相应的导线穿孔, 每个 所述 LED光源组件单元的每根导电引线, 穿过开放式散热体(6 ) 的散热板上的中空 导线支柱, 并且穿过 PCB电路板上的导线穿孔, 被连接到 PCB电路板上, 与相应的电 子元器件实现电路连接。  The plurality of thermally conductive ribs includes a plurality of hollow wire struts, each of the hollow wire struts for accommodating only one conductive lead of the LED light source assembly unit, each hollow wire struts directly communicating with outside air Contacting; having a plurality of wire perforations corresponding to the LED wire through holes (4) on the PCB circuit board, each of the conductive leads of each of the LED light source component units passing through the open heat sink (6) The hollow wire struts on the heat sink board, and through the wire perforations on the PCB circuit board, are connected to the PCB circuit board to make electrical connections with the corresponding electronic components.
3、 根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 所述的 LED 光源組件单元为多个。  The high-efficiency heat-dissipating LED lamp according to claim 1 or 2, wherein the LED light source component unit is plural.
4、 根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 在所述散热 板的与导热筋条相对的另一侧, 还设有多个 LED容置孔( 5 ), 每个 LED光源 ( 7 )对 应于一个 LED容置孔(5 ) , 每个 LED光源 (7 ) 附着在一个 LED容置孔(5 ) 内。  The LED lamp of the high-efficiency heat dissipation according to claim 1 or 2, wherein a plurality of LED receiving holes (5) are further disposed on the other side of the heat dissipation plate opposite to the heat conducting ribs, Each LED light source (7) corresponds to one LED receiving hole (5), and each LED light source (7) is attached to one LED receiving hole (5).
5、 根据权利要求 4所述的高效散热的 LED灯具, 其特征在于, 所述多个 LED容 置孔(5 )具有相同的尺寸, 呈阵列式排列, 相邻的 LED容置孔(5 )在横向和纵向上 分别具有一致的间距。  The high-efficiency heat-dissipating LED lamp according to claim 4, wherein the plurality of LED accommodating holes (5) have the same size and are arranged in an array, and the adjacent LED accommodating holes (5) There is a uniform spacing in the lateral and longitudinal directions, respectively.
6、 根据权利要求 4所述的高效散热的 LED灯具, 其特征在于, 每个所述 LED光 源组件单元还包括 LED基盘 ( 8 ), 每个 LED光源( 7 )通过所述 LED基盘 ( 8 )附着在 一个 LED容置孔( 5 ) 内。  6. The high-efficiency heat-dissipating LED lamp of claim 4, wherein each of the LED light source assembly units further comprises an LED substrate (8) through which each LED light source (7) passes ( 8) Attached to a LED receiving hole ( 5 ).
7、 根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 所述散热板 与所述导热筋条为一体化结构。  The high-efficiency heat-dissipating LED lamp according to claim 1 or 2, wherein the heat dissipation plate and the heat-conductive rib are integrated.
8、 根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 还包括照明 腔盖板( 10 ), 所述透光罩板 ( 9 )通过所述照明腔盖板 ( 10 )和所迷开放式散热体( 6 ) 的所述散热板相互连接, 形成密闭式的 LED照明腔(III ) 。  The high-efficiency heat-dissipating LED lamp according to claim 1 or 2, further comprising an illumination chamber cover (10), wherein the translucent cover plate (9) passes through the illumination chamber cover (10) The heat sinks of the open heat sink (6) are connected to each other to form a closed LED illumination cavity (III).
9. 根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 所述多个 LED光源组件单元具有相同的结构和尺寸。  9. The high efficiency heat dissipating LED lamp according to claim 1 or 2, wherein the plurality of LED light source unit units have the same structure and size.
10、根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 所述高效散 热的 LED灯具用于户外照明, 其 LED电器腔( I )和 LED照明腔( ΠΙ )的腔体内部的 密闭性达到 IP65以上防水要求。 s The high-efficiency heat-dissipating LED lamp according to claim 1 or 2, wherein the high-efficiency heat-dissipating LED lamp is used for outdoor lighting, and the cavity of the LED electrical cavity (I) and the LED illumination cavity (ΠΙ) The internal airtightness meets the waterproof requirement of IP65 or above. s
11、根据权利要求 1或 2所述的高效散热的 LED灯具, 其特征在于, 所述高效散 热的 LED灯具用于户内照明, 其 LED电器腔( I )和 LED照明腔( III )的腔体内部的 密闭性达到 IP20以上防水要求。 The high-efficiency heat-dissipating LED lamp according to claim 1 or 2, wherein the high-efficiency heat-dissipating LED lamp is used for indoor lighting, the cavity of the LED electrical cavity (I) and the LED illumination cavity (III) The airtightness inside the body reaches the waterproof requirement of IP20 or above.
PCT/CN2008/000957 2007-05-16 2008-05-16 Led lamp of highly efficient heat dissipation WO2008138231A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103968298A (en) * 2014-04-16 2014-08-06 宁波腾隆户外用品有限公司 Outdoor lighting lamp
CN104421807A (en) * 2013-08-22 2015-03-18 江苏卡威汽车工业集团有限公司 Automotive light-emitting diode (LED) headlamp

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010003312U1 (en) * 2010-03-09 2011-08-26 Ridi-Leuchten Gmbh lamp
CN101907239A (en) * 2010-08-17 2010-12-08 史杰 LED (Light Emitting Diode) intelligent regulate-control annular lamp tube
WO2013044601A1 (en) * 2011-09-30 2013-04-04 Yang Dongzuo Led dot matrix display and combined dot matrix display
CN102384412B (en) * 2011-11-18 2014-06-18 深圳市华星光电技术有限公司 Backlight system
US8985796B2 (en) 2011-11-18 2015-03-24 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight system of display device with printed circuit board separate from and mounted to LED substrate with support pillars
US8899786B1 (en) * 2012-05-04 2014-12-02 Cooper Technologies Company Method and apparatus for light square assembly
CN103423614A (en) * 2012-05-17 2013-12-04 黄慧娟 Efficient-cooling LED lamp
CN103196051B (en) * 2013-03-15 2014-11-26 于德海 Efficiently-radiating LED module and LED display screen
CN105822959A (en) * 2016-05-24 2016-08-03 合肥皆达信息科技有限公司 Hidden LED wall lamp
CN106299086A (en) * 2016-09-30 2017-01-04 广州莱迪光电股份有限公司 A kind of cooling LED encapsulating structure
CN114606103B (en) * 2022-03-16 2023-07-25 德默特生物科技(珠海)有限公司 Hybrid type photobioreactor
CN116608453B (en) * 2023-07-06 2023-10-13 江苏赛鸥电气集团有限公司 Intelligent LED energy-saving street lamp with convection heat dissipation function

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1603679A (en) * 2004-11-09 2005-04-06 李学霖 Heat radiation structure of LED lamp
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
CN201078676Y (en) * 2007-05-16 2008-06-25 史杰 LED light fitting with high efficiency and heat sinking

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003178602A (en) * 2001-12-10 2003-06-27 Koito Mfg Co Ltd Lighting system
CN2644878Y (en) * 2003-08-14 2004-09-29 葛世潮 Light emitting diode
JP2005166578A (en) * 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk Electric-bulb-shaped led lamp
JP2005286267A (en) * 2004-03-31 2005-10-13 Hitachi Lighting Ltd Light emitting diode lamp
JP2005297865A (en) * 2004-04-14 2005-10-27 Miyata Ind Co Ltd High output type led light emitting lamp
JP4566061B2 (en) * 2005-05-09 2010-10-20 株式会社小糸製作所 Lamp
CN2804575Y (en) * 2005-07-27 2006-08-09 陈斌 Tunnel head lamp
CN2878909Y (en) * 2005-08-11 2007-03-14 周应东 LED lamp capable of improving radiation effect

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1603679A (en) * 2004-11-09 2005-04-06 李学霖 Heat radiation structure of LED lamp
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
CN201078676Y (en) * 2007-05-16 2008-06-25 史杰 LED light fitting with high efficiency and heat sinking

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104421807A (en) * 2013-08-22 2015-03-18 江苏卡威汽车工业集团有限公司 Automotive light-emitting diode (LED) headlamp
CN103968298A (en) * 2014-04-16 2014-08-06 宁波腾隆户外用品有限公司 Outdoor lighting lamp

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