WO2008137477A1 - Interface coaxiale d'impédance à faible perte pour des circuits intégrés - Google Patents

Interface coaxiale d'impédance à faible perte pour des circuits intégrés Download PDF

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Publication number
WO2008137477A1
WO2008137477A1 PCT/US2008/062095 US2008062095W WO2008137477A1 WO 2008137477 A1 WO2008137477 A1 WO 2008137477A1 US 2008062095 W US2008062095 W US 2008062095W WO 2008137477 A1 WO2008137477 A1 WO 2008137477A1
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WO
WIPO (PCT)
Prior art keywords
interface
energy
waveguide
assembly
integrated circuit
Prior art date
Application number
PCT/US2008/062095
Other languages
English (en)
Inventor
Rob Zienkewicz
Dave Harper
Ken Buer
John Decamp
Dean Cook
Charles Woods
Original Assignee
Viasat, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/743,496 external-priority patent/US7625131B2/en
Priority claimed from US11/874,369 external-priority patent/US7855612B2/en
Application filed by Viasat, Inc. filed Critical Viasat, Inc.
Priority to EP08747243A priority Critical patent/EP2151007A1/fr
Publication of WO2008137477A1 publication Critical patent/WO2008137477A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions

Definitions

  • the present invention generally relates to an interface for use, for example, between an integrated circuit and a waveguide. More particularly and according to one exemplary embodiment, the present invention relates to an interface comprised of a low-loss pin and pin assembly that transports signals from, for example, an integrated circuit, such as a monolithic microwave integrated circuit, to a waveguide. In another exemplary embodiment, the present invention also relates to an interface comprised of a low-loss pin and pin assembly that transports energy signals from, for example, an integrated circuit, such as a monolithic microwave integrated circuit, to a waveguide.
  • circuits and other electronic devices that produce energy waves such as electromagnetic waves and microwaves. These circuits produce energy waves that are delivered to a destination through different wires, guides, and other mediums.
  • Energy waves can be difficult to control on various circuits, cables, wires, and other mediums that transport the energy waves because these mediums are "lossy.” Lossy materials and mediums loose energy by radiation, attenuation, or dissipation as heat. By being lossy, a portion of the signal is lost as it travels through the circuits, wires, and other mediums. Stated another way, a signal entering a lossy material will be greater at the point of entry than at the point of exit. Microwave energy is particularly difficult to control as many of the materials and mediums that transport microwave energy are lossy.
  • One exemplary circuit that generates and transports microwaves is a "monolithic microwave integrated circuit" or "MMIC.”
  • MMIC monolithic microwave integrated circuit
  • Lost signal waves are unusable and decrease the efficiency of a MMIC as the signal strength decreases due to loss.
  • the higher the frequency of the microwave the more lossy the transmission medium and more inefficient the circuit.
  • Even signal losses that reduce the signal small amounts, such as 1/10 of a decibel may result in a significant performance loss.
  • One exemplary application where loss from energy waves such as microwaves is problematic is a power amplifier.
  • One structure used to reduce lossiness is a waveguide. Waveguides are structures that guide energy waves with minimal signal loss.
  • impedance matching interfaces or “impedance matching and transforming interfaces.”
  • interface is meant to denote an "impedance matching interface” or “impedance matching and transforming interface.”
  • MMICs and waveguide comprise numerous structures that include wirebonds, microstrips, pins, and other devices to connect a circuit to a waveguide or another structure. These interfaces also attempt to match and transform the impedance of the MMIC to the impedance at the waveguide.
  • current impendence matching interfaces between an integrated circuit such as a MMIC and a waveguide still have an unacceptable amount of loss.
  • circuits such as MMICS also have different modes of energy wave propagation compared to other energy transporting devices such as a waveguide.
  • a MMIC may have a mode of energy wave propagation of quasi-TEM (Transverse Electromagnetic) while a waveguide has a mode of energy wave propagation of TEio (Transverse Electric, 10).
  • TEio Transverse Electric, 10
  • Present interfaces between a MMIC and waveguide comprise numerous structures that include wirebonds, microstrips, pins, and other devices to connect a circuit to a waveguide or another structure. These interfaces also attempt to match and transform the impedance of the MMIC to the impedance at the waveguide.
  • present impedance and mode of energy wave propagation matching interfaces between an integrated circuit such as a MMIC and a waveguide still have an unacceptable amount of loss.
  • Certain present impedance matching interfaces comprise devices with coaxial structures. Specifically, coaxial cable is used as an impedance matching interface depending on how it is used. Specifically, coaxial structures are utilized as impedance matching interfaces when their impedance is somewhere in between the impedance of the devices they are connecting.
  • a MMIC may have an impedance of fifty ohms and a waveguide may have an impedance of two hundred and seventy ohms.
  • a coaxial structure may be used as part of the interface connecting the MMIC to the waveguide with an impedance of one hundred ohms. This impedance of one hundred ohms helps reduce loss of energy traveling from the fifty ohm MMIC to the two hundred and seventy ohm waveguide. Loss is reduced because the impedance of the devices transporting the energy changes much more gradually (fifty-hundred-two hundred and seventy) than merely connecting the MMIC to the waveguide (fifty-two hundred and seventy).
  • impedance matching interfaces are complex as they comprise several different parts and require numerous mechanisms to be connected to circuits or other energy transmission devices. Further, known coaxial impedance matching interfaces are not used to directly connect an integrated circuit such as a MMIC to another energy transmission device such a waveguide.
  • coaxial interface that directly connected an integrated circuit, such as a MMIC, to a waveguide, or other structure that reduces signal loss by matching the impedance. It would also be advantageous to produce a coaxial interface that reduced loss that was inexpensive and easy to manufacture, particularly one that was constructed from parts that were commercially available such a coaxial cable or other type of coaxial materials.
  • an interface for connecting an integrated circuit such as a MMTC to a waveguide comprises a pin placed within an assembly which is configured to reduce signal loss.
  • two or more beads connect the pin to the assembly to further define the space.
  • one bead is formed from glass to form a hermetic seal and the interface is connected to the integrated circuit.
  • a coaxial interface for directly connecting an integrated circuit such as a MMIC to a waveguide is provided.
  • the interface is a coaxial cable that directly connects the integrated circuit to the waveguide.
  • the coaxial structure has an impedance in between that of the integrated circuit and waveguide and assists in transforming the impedance between the integrated circuit and waveguide to reduce loss.
  • other coaxial structures are used such as coaxial pins to directly connect an integrated circuit such as a MMIC to a waveguide or other energy transmitting structure or device.
  • FIG. 1 illustrates an exemplary schematic diagram of the interface in accordance with an exemplary embodiment of the present invention
  • FIG. 2 illustrates an exemplary schematic diagram of the pin and beads apart from the assembly in accordance with an exemplary embodiment of the present invention
  • FIG. 3 illustrates an exemplary schematic diagram of the assembly apart from the pin and beads in accordance with an exemplary embodiment of the present invention
  • FIG. 4 illustrates an exemplary schematic diagram of a side view of the interface in accordance with an exemplary embodiment of the present invention
  • FIG. 5 illustrates an exemplary schematic diagram of a top view of the interface shown in FIG. 4 in accordance with an exemplary embodiment of the present invention.
  • an interface for connecting an integrated circuit to an energy transmission device such as a waveguide is disclosed.
  • a method of manufacturing an interface is disclosed.
  • interface 10 is a low-loss interface comprising a coaxial structure that is configured to transmit energy from one device to another.
  • interface 10 connects an integrated circuit 1 1 to another energy transmission device 13 and matches the impedance at integrated circuit 11 to the impedance at energy transmission device 13.
  • interface 10 can be any device configured to transmit energy and match impedance between two or more energy producing or transmission devices.
  • circuit 11 is a monolithic microwave integrated circuit (MMIC).
  • circuit 11 comprises discrete components on a circuit board such as memory devices, power sources, light emitting diodes, and the like.
  • Circuit 11 can be any type of circuit, circuit board, printed circuit board, integrated circuit, or other type of device or medium that produces or transfers energy waves.
  • the term "circuit” is not limited to devices with discrete components on a circuit board but rather includes any device that produces or transmits energy waves such as wires, cables, or waveguides.
  • energy transmission device 13 can be any type of device or medium configured to produce or transport energy.
  • energy transmission device 13 is a waveguide that guides microwave energy waves.
  • energy transmission device 13 comprises wires, cables or other devices configured to transport and guide energy waves from one source to another.
  • interface 10 is a coaxial structure comprising a pin 12 that connects to circuit 1 1 on one end and energy transmission device 13 on the other end.
  • Pin 12 is disposed within an assembly 14.
  • a set of beads 16, 18 contact pin 12 and assembly 14 and further define a space 20 between pin 12 and assembly 14 which helps impart the coaxial structure to interface 10.
  • an insulator 22 contacts pin 12 and circuit 11 and a wire connector 24 connects pin 12 to circuit 11.
  • Pin 12 is a low-loss pin comprising a low-loss conductive medium.
  • pin 12 is a feedthru pin, such as a microwave feedthra pin comprising a low- loss conductive material.
  • pin 12 comprises two ends with one end configured to be connected to energy transmission device 13 and the other opposing end connected to circuit 11.
  • Pin 12 can be connected to circuit 11 and energy transmission device 13 by mere contact without adhesives or the like or it can be connected by an adhesive, soldering, or attachment devices such as pins and screws.
  • pin 12 is configured to be connected to circuit 11 by wire connector 24.
  • pin 12 is a relatively long, narrow member that is round.
  • Other shapes of pin 12 in other exemplary embodiments of the present invention comprise an oval, square, rectangular shaped, irregularly shaped or the like.
  • pin 12 is one continuous shape from one end to the other.
  • half of pin 12 can be round while the other half is another shape (such as an oval) resulting in pin 12 having two shaped regions. Numerous different shaped regions can be located along pin 12.
  • one end of pin 12 can be tapered and rests on insulator 22.
  • pin 12 is configured to have a flat portion 17 configured to receive wire connector 24, e.g. a bond wire.
  • flat portion 17 may be prepared with an ohmic material for forming a better connection with wire connector 24.
  • the end of pin 12 can be non-tapered and have the same radius as the rest of pin 12.
  • the end of pin 12 that contacts insulator 22 can be larger than the remaining portion of pin 12.
  • pin 12 can be any length or radius.
  • the length and radius of pin 12 are selected based on the impedance of pin 12 and energy transmission device 13. Further, the length and radius of pin 12 may depend on the frequency of the energy being transmitted, or the physical properties (size and overall dimensions) of pin 12 and energy transmission device 13. In one exemplary embodiment, where the impedance at circuit 1 1 is fifty ohms, pin 12 has a radius of 0.086 inches. Any other radius of pin 12 configured to facilitate impedance matching, appropriate for the frequency of the energy traveling through pin 12, and physically appropriate to match the physical properties of circuit 11 and energy transmission device 13 can be used and fall within the scope of the present invention.
  • pin 12 comprises or is formed of a single conductive metal.
  • pin 12 may be solid gold, silver, copper, and/or other similar materials with low resistance.
  • the conductive material may be any material configured to conduct the energy being transmitted through pin 12.
  • pin 12 comprises a core formed from a rigid material and the core is coated (or partially coated) with a conductive material.
  • pin 12 may comprise a rigid material such as a Kovar® alloy produced by the Westinghouse Electric and Manufacturing Company of Pittsburgh, Pennsylvania.
  • the rigid alloy gives pin 12 strength and is coated with conductive materials such as gold, silver, or copper which is configured to conduct energy along pin 12.
  • any rigid material (certain exemplary materials, include, but are certainly not limited to, metal, alloy, or plastic) configured to impart strength to pin 12 and/or configured to be plated or coated in a conductive material can be used.
  • the conductive material may be the same as described above in the single conductive material embodiment.
  • Pin 12 can be custom manufactured or it can be a commercially available feedthru pin that is easily available to the public.
  • pin 12 is a microwave feedthru pin that is commercially available from numerous sources including Special Hermetic Products, Inc. of Wilton, New Hampshire, Thunderline Z (a division of Emerson, Inc.) of Hampstead, New Hampshire or Tyco Electronics of Wilmington, Delaware.
  • pin 12 is disposed within assembly 14.
  • assembly 14 comprises a metal core that is coated with a low-loss metal.
  • assembly 14 comprises a plastic or an alloy to impart strength to assembly 14 that is covered in a low-loss metal.
  • Certain exemplary low-loss metals are silver, gold, and copper.
  • An exemplary alloy is a Kovar® alloy which is covered or coated with a low-loss material.
  • assembly 14 can comprise a single piece of material or it can comprise two or more pieces of material.
  • assembly 14 comprises a metal block that has been drilled out to form a space 15.
  • assembly 14 is formed from two or more pieces of conductive material that are joined together by welding, soldering, or other connectors such as screws, bolts, pins or adhesives.
  • any materials configured to facilitate impedance matching and reduce signal loss can be used to construct assembly 14.
  • assembly 14 comprises two openings.
  • One opening 26 may be smaller and configured to be disposed next to energy transmission device 13.
  • the other opening 28 may be larger and configured to be located next to circuit 11.
  • openings 26 and 28 help define space 20 together with pin 12 and beads 16, 18.
  • the size of opening 26 may be selected based on various factors such as (but not limited to) the size of pin 12, the size of space 20 desired, the size of bead 18, and to facilitate impedance matching and to reduce loss.
  • the diameter of opening 28 may be selected based on various factors such as (but not limited to) the size of pin 12, the size and related depth of energy transmission device 13, the size of bead 16, and to facilitate impedance matching and reduce loss.
  • Beads 16 and 18 are disposed within and contact assembly 14. Each bead 16, 18 further comprises a center hole or other opening which enables beads 16, 18 to slide onto and concentrically surround pin 12.
  • beads 16, 18 Similar to openings 26 and 28, the diameter of beads 16, 18 varies depending on the application interface 10 is used for and various other factors such as (but not limited to) the size of pin 12, and the size of space 20. Beads 16, 18 create space 20 when they are attached to pin 12 and disposed within assembly 14. In one exemplary embodiment, bead 16 is larger than bead 18.
  • bead 16 is the larger of the two beads and comprises a non-conductive material such as glass.
  • bead 16 comprises a Teflon® material produced by the E.I. DuPont De Nemours Company of Wilmington, Delaware.
  • bead 16 comprises non- conductive plastics, metals, or alloys. Any non-conductive material now known or developed in the future can be used for beads 16, 18 and fall within the scope of the present invention.
  • bead 18 is smaller than bead 16 and is placed adjacent to energy transmission device 13. Bead 18 is used to secure pin 12 within assembly 14 and hold it in place in an exemplary embodiment, hi other exemplary embodiments, bead 18 can be eliminated. As noted herein, in one exemplary embodiment, bead 18 comprises a Teflon® material. Further, as depicted, a notch 23 is defined within assembly 14 to allow bead 16 to fit completely within assembly 14 and not slide into energy transmission device 13. In other exemplary embodiments, notch 23 is eliminated and bead 18 is completely flush with the edge of assembly 14. In other exemplary embodiments, bead 18 protrudes from assembly 14 into energy transmission device 13.
  • interface 10 is configured to form a hermetic seal between the space containing energy transmission device 13 and the space containing circuit 1 1. This seal is formed by sealing bead 16 to assembly 14. This hermetic seal prevents water, dust, air, and other pollutants from entering space 20.
  • pin 12 and assembly 14 define space 20 which is further defined by beads 16, 18. Space 20 further reduces signal loss from interface 10. As depicted, space 20 concentrically surrounds pin 12 and extends from bead 16 to bead 18 in one exemplary embodiment.
  • the size of space 20 is directly related to application interface 10 is used for, the frequency of the energy being transmitted, and the impedance of circuit and energy transmission device 13.
  • the size of space 20 can also be directly related to physical properties of circuit 11 and energy transmission device 13 similarly to the size of beads 16, 18 and their respective openings 26, 28.
  • Insulator 22 can comprise any type of insulating material and can be any size. However, in one exemplary embodiment, insulator 22 is a thin insulator comprising a piece of insulating tape. In another exemplary embodiment, insulator 22 comprises a thin layer of liquid epoxy which has insulating properties. Further, in these exemplary embodiments, insulator 22 is two thousandths of an inch or smaller. In other exemplary embodiments, other insulators of various sizes and constructions are used and still fall within the scope of the present invention. Insulator 22 may be configured to prevent pin 12 from bending. Furthermore, insulator 22 may comprise material that is configured to separate pin 12 from the environment.
  • wire connector 24 further connects interface 10 to circuit 1 1.
  • wire connector 24 is a wire bond connector comprising gold, aluminum, copper or a combination of two or more of these metals. Further, wire connector 24 is attached to flat edge 17 of pin 12.
  • Certain exemplary types of wire bonds comprise, but are not limited to, ball bonds and wedge bonds. In other exemplary embodiments, other metals or materials are used to construct wire connector 24.
  • An exemplary method of manufacturing interface 10 will now be discussed. While specific materials and techniques are mentioned herein, other materials, parts, supplies, and techniques can certainly be used to manufacture interface 10 and fall within the scope of the present invention. This exemplary method of manufacturing interface 10 first comprises the step of producing assembly 14.
  • Assembly 14 comprises a metal block covered with another low- loss material such as a metal or alloy.
  • assembly 14 is a metal block which is non-coated and constructed entirely from a low-loss material. The metal block is drilled out creating a cavity which forms space 15.
  • assembly 14 comprises two or more pieces of material that are attached together as described above. The size of space 15 is determined based on the application that interface 10 will be used for.
  • pin 12 is an off-the-shelf RF feedthru pin such as a microwave feedthru pin that is commercially available from numerous sources as noted above.
  • pin 12 is custom manufactured and not an off-the-shelf pin.
  • pin 12 comprises a solid piece of conductive material.
  • pin 12 comprises a rigid core coated or plated with a conductive material. The size of pin 12 is determined based on the application that interface 10 will be used for.
  • bead 16 is placed around pin 12.
  • Bead 16 may be placed around pin 12 in one exemplary embodiment or pin 12 may be manufactured with bead 16 already attached to pin 12.
  • bead 16 may comprise a low-loss material such as glass or a Teflon® material.
  • a hole is placed through bead 16 which is slightly larger than the radius of pin 12. Bead 16 is then slid onto pin 12 and concentrically surrounds pin 12.
  • Pin 12 and bead 16 are then placed within assembly 14. Once pin 12 and bead 16 are placed within assembly 14, bead 18 is placed around pin 12. As noted above, bead 18 may comprise a low-loss material such as a glass or a Teflon® material. A hole is placed through bead 18 which is slightly smaller than the radius of pin 12. Bead 18 can still be slid onto pin 12 because, in one exemplary embodiment, bead 18 is made from a pliable material.
  • beads 16, 18 are attached to the assembly 14 to create a hermetic seal at one or both ends of the assembly 14. This hermetic seal helps reduce loss in an exemplary embodiment.
  • the exact spacing around pin 12 and beads 16, 18 can vary. Bead 18 is completely flush within the cavity and seated directly against assembly 14. hi other exemplary embodiments, there is no space around either bead 16, 18 and pin 12 and beads 16, 18 are firmly seated within space 15.
  • the next step in this exemplary manufacturing process is to connect pin 12 to insulator 22.
  • pin 12 is merely placed on and not attached to insulator 22 to prevent pin 12 from bending.
  • pin 12 is attached to insulator 22 by adhesives.
  • wire connector 24 is a wire bond between interface 10 and circuit 11 and is attached by wire bonding techniques. Further, any number of wires or other connector members can be used as wire connector 24 and fall within the scope of the present invention.
  • interface 10 is configured to deliver energy waves such as microwaves from circuit 11 to energy transmission device 13.
  • circuit 1 1 is a MMIC and energy transmission device 13 is a waveguide.
  • interface 10 is configured to be an impedance matching device and loose little energy and signal even as the frequency of the energy and signal is increased.
  • a coaxial interface for connecting a circuit to an energy transmission device such as a waveguide is disclosed.
  • the interface according to this exemplary embodiment shall be referred to as interface 110.
  • coaxial interface 110 is a low-loss interface comprising a coaxial structure that is configured to transmit energy between two devices that it is directly connected or coupled to. It should be noted that the term "low-loss" refers to the ability to reduce signal loss as discussed above.
  • coaxial interface 110 connects a circuit 111 to another energy transmission device 113.
  • coaxial interface 110 can be any device with a coaxial structure configured to transmit energy with minimal loss by matching or transforming impedance and modes of energy wave propagation between two or more energy producing or transmission devices.
  • circuit 111 is an integrated circuit such as a monolithic microwave integrated circuit (MMIC).
  • circuit 1 11 comprises discrete components on a circuit board, such as memory devices, power sources, light emitting diodes, and the like.
  • Circuit 11 1 can be any type of circuit, integrated circuit, circuit board, printed circuit board, or other type of device or medium that produces or transfers energy waves.
  • the term "circuit” is not limited to devices with discrete components on a circuit board but rather includes any device that produces or transmits energy waves such as wires, cables, or waveguides.
  • energy transmission device 1 13 can be any type of device or medium configured to produce or transport energy.
  • energy transmission device 113 is a waveguide that guides microwave energy waves.
  • energy transmission device 113 comprises wires, cables or other devices configured to transport and guide energy waves from one source to another.
  • coaxial interface 1 10 is any device with two or more layers that share a common axis that is configured to transport energy with minimal loss.
  • an exemplary coaxial interface 110 has an impedance that is in between the impedance of the two devices it is directly connected to.
  • the impedance of coaxial interface 1 10 is determined by the ratio of the outer to inner diameters of the coaxial interface 110 and an insulating material such as a spacer as described below.
  • One exemplary coaxial interface 110 with a fifty ohm impedance has an inner diameter of 0.0255 inches, an outer diameter of 0.66 inches, and a spacer with a dielectric of T-PTFE with a relative dielectric constant of 1.3.
  • coaxial interface 110 comprises a pin 114 surrounded by a spacer 116, a conductor sheath 118, and an insulating jacket 120.
  • coaxial interface 110 is directly connected to circuit 1 1 1 and energy transmission device 113 such as a waveguide.
  • pin 114 is constructed from an electrically conductive low-loss medium such as solid gold, silver, copper, and/or other similar materials with low resistance.
  • Pin 1 14 also generally defines the central axis of coaxial interface 110.
  • Pin 1 14 can be a single piece of metal or it can be a constructed from numerous smaller pieces of metal that are joined together. Certain exemplary pins therefore comprise numerous strands of low- loss conductive material that are braided together to form pin 114.
  • Pin 114 can also be any shape, for example, pin 114 can be round, square, or rectangular. In one exemplary embodiment, pin 114 is a relatively long, narrow member that is round. Other shapes of pin 1 14 in other exemplary embodiments of the present invention comprise an oval, square, rectangular shaped, irregularly shaped or the like. In one exemplary embodiment, pin 114 is one continuous shape from one end to the other. In other exemplary embodiments, half of pin 114 can be round while the other half is another shape (such as an oval) resulting in pin 114 having two shaped regions. Numerous different shaped regions can be located along pin 114.
  • pin 114 may also extend out of and away from spacer 116, conductor sheath 118, and insulating jacket 120 to contact circuit 111 on one end and energy transmission device 113 on the opposing end. Pin 114 may also contact circuit 111 at certain connection points such as one or more bond pads 122. Pin 114 may be may soldered or connected to bond pad 122 by any known method in the art such as an adhesive, soldering, or attachment devices such as pins and screws. In one exemplary embodiment, pin 1 14 is wire bonded to bond pad 122.
  • coaxial interface 110 may further comprise one or more ground wires 124 that connect coaxial interface 1 10 to circuit 11 1.
  • coaxial interface 110 comprises a ground-signal- ground interface with both ground wires 124 flanking pin 114.
  • pin 114 and ground wires 124 are connected to circuit 11 1 such as a MMIC at bond pads 122.
  • Spacer 116 is any device or material that is configured to act as an insulator.
  • spacer 116 is a dielectric material such as PTFE such as a Teflon® PTFE produced by the E. I. Du Pont De Nemours and Company of Wilmington, Delaware.
  • spacer 116 can be constructed of a solid material or a perforated material with air spaces
  • spacer 116 is nothing more than a space that can comprise air or a vacuum
  • spacer 116 functions as an ideal dielectric with no loss
  • conductor sheath 1 18 is a cylindrical member that concenti ically sunounds the spacei 116
  • Conductor sheath 118 can be any type of material configured to conduct electricity with low loss Certain exemplary materials include solid gold, silvei, copper, and/or other similar materials with low resistance
  • conductor sheath 1 18 can be rigid or flexible depending on whether a rigid or flexible coaxial interface 110 is desired For example, if a rigid coaxial cable is used, conductor sheath 118 is rigid Alternatively, if a flexible coaxial cable is used, conductor sheath 118 is flexible Insulating jacket 120 coveis and sunounds conductor sheath 118
  • coaxial interface 1 10 is a rigid or flexible coaxial cable such as the types that are readily available from numerous commercial sources such as Haverhill Cable and Manufacturing Corporation of Haverhill, Massachusetts In other cxcmplaiy embodiments, coaxial interface 110 is a coaxial pin available from various commercial sources such as Thunderlme Z (a division of Emerson, Inc ) of Hampstead, New Hampshire, Special Hermetic Products, Inc of Wilton, New Hampshire, and Mill-Max Manufacturing Corporation of Oyster Bay, New York
  • coaxial interface 110 can be any device with a coaxial structure that is constructed of two or more parts that are joined together to create a coaxial structure
  • the parts of the coaxial interface 110 are coaxial structures themselves and when they are connected or otherwise joined together, these individual coaxial parts create a coaxial interface created from at least two or more coaxial parts
  • circuit 111 and energy transmission device 1 13 also have diffeient modes of energy wave propagation
  • a mode of energy wave piopagation foi energy transmission device 113 such as a waveguide may be TEi 0 (Tiansverse Electric, 10) while circuit 111 such as a MMIC may have a microst ⁇ p mode of wave propagation of quasi-TEM (Traverse Electromagnetic)
  • a coaxial structure such as a coaxial cable is used and directly connected to a MMIC on one end and a waveguide on the other opposing end

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Abstract

L'invention concerne, en général, selon un aspect à titre d'exemple, une interface à faible perte destinée à connecter un circuit intégré, tel qu'un circuit intégré hyperfréquence monolithique à un dispositif de transmission d'énergie tel qu'un guide d'ondes. Selon un mode de réalisation à titre d'exemple, l'interface comporte une broche placée dans un ensemble qui forme une structure coaxiale fermée hermétiquement afin d'empêcher une perte de signal à des fréquences accrues. Selon un autre mode de réalisation à titre d'exemple, l'interface comporte une structure coaxiale, telle qu'un câble coaxial, qui connecte directement le circuit hyperfréquence monolithique au guide d'ondes pour transmettre des signaux d'énergie tels qu'une énergie hyperfréquence avec une perte minimum.
PCT/US2008/062095 2007-05-02 2008-04-30 Interface coaxiale d'impédance à faible perte pour des circuits intégrés WO2008137477A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08747243A EP2151007A1 (fr) 2007-05-02 2008-04-30 Interface coaxiale d'impédance à faible perte pour des circuits intégrés

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/743,496 2007-05-02
US11/743,496 US7625131B2 (en) 2007-05-02 2007-05-02 Interface for waveguide pin launch
US11/874,369 2007-10-18
US11/874,369 US7855612B2 (en) 2007-10-18 2007-10-18 Direct coaxial interface for circuits

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WO2008137477A1 true WO2008137477A1 (fr) 2008-11-13

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7782156B2 (en) 2007-09-11 2010-08-24 Viasat, Inc. Low-loss interface
JPWO2014174983A1 (ja) * 2013-04-22 2017-02-23 ソニーセミコンダクタソリューションズ株式会社 コネクタ装置及び無線伝送システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170142A (en) 1991-09-09 1992-12-08 Watkins-Johnson Company Radio frequency feedthrough seal and method
JPH06338709A (ja) * 1993-05-31 1994-12-06 Toshiba Corp 同軸ビーズ
EP0954045A2 (fr) * 1998-04-28 1999-11-03 TRW Inc. Traversées céramique-métal pour ondes millimétriques
WO2003084001A1 (fr) * 2002-04-01 2003-10-09 Gigalane Co., Ltd. Connecteur coaxial et structure de connexion l'incluant
US20040038587A1 (en) 2002-08-23 2004-02-26 Yeung Hubert K. High frequency coaxial connector for microcircuit packaging
US20050191869A1 (en) * 2004-03-01 2005-09-01 Anritsu Company Hermetic glass bead assembly having high frequency compensation

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544538B1 (fr) * 1991-11-27 1997-03-12 Shinko Electric Industries Co. Ltd. Assemblage pour une ligne coaxiale
FR2888670B1 (fr) * 2005-07-18 2009-11-20 Centre Nat Rech Scient Adapteur d'impedance automatique coaxial

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170142A (en) 1991-09-09 1992-12-08 Watkins-Johnson Company Radio frequency feedthrough seal and method
JPH06338709A (ja) * 1993-05-31 1994-12-06 Toshiba Corp 同軸ビーズ
EP0954045A2 (fr) * 1998-04-28 1999-11-03 TRW Inc. Traversées céramique-métal pour ondes millimétriques
WO2003084001A1 (fr) * 2002-04-01 2003-10-09 Gigalane Co., Ltd. Connecteur coaxial et structure de connexion l'incluant
US20040038587A1 (en) 2002-08-23 2004-02-26 Yeung Hubert K. High frequency coaxial connector for microcircuit packaging
US20050191869A1 (en) * 2004-03-01 2005-09-01 Anritsu Company Hermetic glass bead assembly having high frequency compensation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2151007A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7782156B2 (en) 2007-09-11 2010-08-24 Viasat, Inc. Low-loss interface
JPWO2014174983A1 (ja) * 2013-04-22 2017-02-23 ソニーセミコンダクタソリューションズ株式会社 コネクタ装置及び無線伝送システム

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