WO2008133073A1 - Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci - Google Patents
Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci Download PDFInfo
- Publication number
- WO2008133073A1 WO2008133073A1 PCT/JP2008/057246 JP2008057246W WO2008133073A1 WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1 JP 2008057246 W JP2008057246 W JP 2008057246W WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive paste
- circuit board
- printed circuit
- heat generating
- generating body
- Prior art date
Links
- 229920001225 polyester resin Polymers 0.000 abstract 2
- 239000004645 polyester resin Substances 0.000 abstract 2
- 229920005749 polyurethane resin Polymers 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 238000005452 bending Methods 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008523466A JPWO2008133073A1 (ja) | 2007-04-18 | 2008-04-14 | 導電性ペースト及びこれを用いた印刷回路、面状発熱体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007109189 | 2007-04-18 | ||
JP2007-109189 | 2007-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133073A1 true WO2008133073A1 (fr) | 2008-11-06 |
Family
ID=39925531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057246 WO2008133073A1 (fr) | 2007-04-18 | 2008-04-14 | Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2008133073A1 (fr) |
KR (1) | KR20100015580A (fr) |
WO (1) | WO2008133073A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012128028A1 (fr) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Composition de pâte métallique |
KR20160118263A (ko) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법 |
JP2018041692A (ja) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
WO2019039511A1 (fr) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Pâte conductrice, conducteur extensible et composant électronique l'utilisant, et dispositif électronique vestimentaire |
KR20210000486A (ko) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101316762B1 (ko) * | 2011-09-29 | 2013-10-10 | (주)오리엔탈드림 | 망사발열체 및 그 제조방법 |
KR101276726B1 (ko) * | 2013-01-07 | 2013-06-19 | 김윤정 | 유연성 발열체 원단의 제조방법 |
KR101947518B1 (ko) * | 2016-03-30 | 2019-05-10 | (재)울산테크노파크 | 셀프 스위치 기능을 부가한 고온용 ptc 페이스트 조성물 제조방법 |
KR101970911B1 (ko) * | 2018-02-02 | 2019-04-22 | 영남대학교 산학협력단 | 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법 |
KR102170762B1 (ko) * | 2018-11-22 | 2020-10-27 | 주식회사 렉스바 | 누설 전류를 제거할 수 있는 온열 필름모듈 |
KR102342365B1 (ko) * | 2020-07-13 | 2021-12-22 | 동국성신(주) | 면상발열체 히터의 발열부용 조성물, 상기 조성물을 이용한 발열부 및 상기 발열부를 가지는 면상발열체 히터 |
KR102584801B1 (ko) * | 2021-01-27 | 2023-10-06 | 주식회사 파루인쇄전자 | 면상발열체를 포함하는 발열 패드 및 이의 제조방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272702A (ja) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc抵抗体 |
JPH0696843A (ja) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター |
JP2001011354A (ja) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | 自己温度制御ヒーター用印刷インク |
JP2002260442A (ja) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | 導電性ペースト |
JP2005259546A (ja) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路 |
JP2006085978A (ja) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | 導電性樹脂組成物及びこれを用いた面状発熱体 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5033707B2 (fr) * | 1972-12-13 | 1975-11-01 | ||
JP3312600B2 (ja) * | 1998-09-17 | 2002-08-12 | 扇化学工業株式会社 | Ptc特性を有する樹脂組成物 |
-
2008
- 2008-04-14 JP JP2008523466A patent/JPWO2008133073A1/ja active Pending
- 2008-04-14 KR KR1020097021467A patent/KR20100015580A/ko not_active Application Discontinuation
- 2008-04-14 WO PCT/JP2008/057246 patent/WO2008133073A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272702A (ja) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc抵抗体 |
JPH0696843A (ja) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | 温度自己制御性導電性組成物、温度自己制御性面状発熱体および温度自己制御性パイプ状ヒーター |
JP2001011354A (ja) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | 自己温度制御ヒーター用印刷インク |
JP2002260442A (ja) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | 導電性ペースト |
JP2005259546A (ja) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路 |
JP2006085978A (ja) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | 導電性樹脂組成物及びこれを用いた面状発熱体 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140038391A (ko) * | 2011-03-18 | 2014-03-28 | 스미토모 세이카 가부시키가이샤 | 금속 페이스트 조성물 |
JPWO2012128028A1 (ja) * | 2011-03-18 | 2014-07-24 | 住友精化株式会社 | 金属ペースト組成物 |
US9414487B2 (en) | 2011-03-18 | 2016-08-09 | Sumitomo Seika Chemicals Co., Ltd. | Metal paste composition |
WO2012128028A1 (fr) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Composition de pâte métallique |
KR102011523B1 (ko) | 2011-03-18 | 2019-08-16 | 스미토모 세이카 가부시키가이샤 | 금속 페이스트 조성물 |
KR20160118263A (ko) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | 온도 센서용 수지 조성물, 온도 센서용 소자, 온도 센서 및 온도 센서용 소자의 제조 방법 |
US10302506B2 (en) | 2014-02-06 | 2019-05-28 | Japan Science And Technology Agency | Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor |
JP7118582B2 (ja) | 2016-09-09 | 2022-08-16 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
JP2018041692A (ja) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | 展延性導電性組成物および三次元プリント配線板の製造方法 |
WO2019039511A1 (fr) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Pâte conductrice, conducteur extensible et composant électronique l'utilisant, et dispositif électronique vestimentaire |
JPWO2019039511A1 (ja) * | 2017-08-24 | 2020-07-30 | 東洋紡株式会社 | 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器 |
JP7147767B2 (ja) | 2017-08-24 | 2022-10-05 | 東洋紡株式会社 | 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器 |
US11469010B2 (en) | 2017-08-24 | 2022-10-11 | Toyobo Co., Ltd. | Conductive paste, stretchable conductor and electronic component using same, and clothes-type electronic device |
KR20210000486A (ko) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
KR102199895B1 (ko) * | 2019-06-25 | 2021-01-08 | 주식회사 토우테크 | 면상발열체용 ptc 카본 잉크 조성물 및 이를 이용한 면상발열용 ptc 발열필름 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008133073A1 (ja) | 2010-07-22 |
KR20100015580A (ko) | 2010-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008133073A1 (fr) | Pâte conductrice, et carte de circuit imprimé et corps de génération de chaleur plan utilisant chacun celle-ci | |
TW200634066A (en) | Thermally stable thermoplastic resin compositions, methods of manufacture thereof and articles comprising the same | |
ATE279010T1 (de) | Elektrisch leitende härtbare harzzusammensetzung ,daraus hergestelltes gehärtetes produkt und unter verwendung der zusammensetzung hergestelltes produkt | |
DK1846293T3 (da) | Elektrotermisk varmer til isbeskyttelse af aerodynamiske overflader og fremgangsmåde til at producere den | |
WO2008104728A3 (fr) | Vitre transparente avec un revetement chauffant | |
NZ582100A (en) | Medical implant with a conductive polymer which is capable of warming up and softening in response to a current flow | |
EP3640957A3 (fr) | Résistance électrique à montage en surface comprenant une charge thermo-conductrice, non électro-conductrice et son procédé de production | |
WO2005066252A3 (fr) | Poudre inorganique, composition de resine chargee de poudre et utilisation correspondante | |
MY162169A (en) | An elongate heater for an electrically heated aerosol-generating system | |
RU2010107095A (ru) | Нагреваемый планарный элемент | |
WO2011022188A3 (fr) | Formation de composites polymères à conductivité électrique élevée avec de multiples charges | |
WO2009069284A1 (fr) | Composition de résine thermoconductrice | |
WO2011013927A3 (fr) | Pâte d'électrode thermodurcissable pouvant cuire à faible température | |
WO2009051043A1 (fr) | Film adhésif de connexion de circuit et structure de connexion de circuit | |
WO2009043649A3 (fr) | Structure de porte-circuit électronique tridimensionnelle, porte-circuit de base présentant la structure de porte-circuit en tant que composant fonctionnel, et circuiterie tridimensionnelle composée d'au moins deux structures de porte-circuit tridimensionnelles de ce type | |
EP1854845A4 (fr) | Composition de resine pour des composants electroniques et electriques destines a des applications haute frequence et ses produits moules | |
EP1736512A4 (fr) | Composition de resine conductrice | |
WO2010020242A3 (fr) | Élément d'actionnement et son utilisation | |
WO2008008689A3 (fr) | Article et procédé associé | |
TW200707468A (en) | Conductive paste, circuit board, circuit article and method for manufacturing such circuit article | |
WO2009008326A1 (fr) | Composition de résine de polycarbonate retardatrice de flamme et article moulé à partir de cette composition | |
WO2006113918A3 (fr) | Circuits conducteurs d'electricite flexibles | |
CA2677311A1 (fr) | Assemblage d'avion et procede de fabrication de celui-ci | |
WO2012036538A3 (fr) | Composition de polymère conductrice pour élément ptc avec caractéristiques ntc réduites, utilisant un nanotube de carbone | |
WO2009009731A3 (fr) | Mélanges d'éther de polyarylène/polyester thermoplastiques et articles de ceux-ci |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2008523466 Country of ref document: JP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08740334 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20097021467 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08740334 Country of ref document: EP Kind code of ref document: A1 |