WO2008133073A1 - Conductive paste, and printed circuit board and planar heat generating body each using the same - Google Patents
Conductive paste, and printed circuit board and planar heat generating body each using the same Download PDFInfo
- Publication number
- WO2008133073A1 WO2008133073A1 PCT/JP2008/057246 JP2008057246W WO2008133073A1 WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1 JP 2008057246 W JP2008057246 W JP 2008057246W WO 2008133073 A1 WO2008133073 A1 WO 2008133073A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive paste
- circuit board
- printed circuit
- heat generating
- generating body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008523466A JPWO2008133073A1 (en) | 2007-04-18 | 2008-04-14 | Conductive paste, printed circuit using the same, and planar heating element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-109189 | 2007-04-18 | ||
JP2007109189 | 2007-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133073A1 true WO2008133073A1 (en) | 2008-11-06 |
Family
ID=39925531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057246 WO2008133073A1 (en) | 2007-04-18 | 2008-04-14 | Conductive paste, and printed circuit board and planar heat generating body each using the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2008133073A1 (en) |
KR (1) | KR20100015580A (en) |
WO (1) | WO2008133073A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012128028A1 (en) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Metal paste composition |
KR20160118263A (en) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor |
JP2018041692A (en) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | Ductile conductive composition and method for manufacturing three-dimensional printed wiring board |
WO2019039511A1 (en) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Conductive paste, stretchable conductor and electronic component using same, and wearable electronic device |
KR20210000486A (en) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | PTC Carbon Ink Composition And Planar Heating Film Using It |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101316762B1 (en) * | 2011-09-29 | 2013-10-10 | (주)오리엔탈드림 | Mesh heating element and method for manufacturing it |
KR101276726B1 (en) * | 2013-01-07 | 2013-06-19 | 김윤정 | Preparation of flexible carbon fiber |
KR101947518B1 (en) * | 2016-03-30 | 2019-05-10 | (재)울산테크노파크 | Paste compositions Fabrication method of High-temperature PTC having self-switch function |
KR101970911B1 (en) * | 2018-02-02 | 2019-04-22 | 영남대학교 산학협력단 | Method of manufacturing a flexible and elastic substrate having electric circuit |
KR102170762B1 (en) * | 2018-11-22 | 2020-10-27 | 주식회사 렉스바 | Heating film module |
KR102342365B1 (en) * | 2020-07-13 | 2021-12-22 | 동국성신(주) | The conposition for heating apparatus of heating plate's heater, and the heating apparatus using the conposition, and the heating plate's heater having the heating apparatus |
KR102584801B1 (en) * | 2021-01-27 | 2023-10-06 | 주식회사 파루인쇄전자 | Heating pad comprising plane heater, and manufacturing method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272702A (en) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc resistor |
JPH0696843A (en) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | Temperature self-control conductive composition, temperature self-control surface heating element and temperature self-control pipe heater |
JP2001011354A (en) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | Printing ink for self-temperature control heater |
JP2002260442A (en) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | Conductive paste |
JP2005259546A (en) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | Conductive paste for rotary screen printing apparatus and conductor circuit using the same |
JP2006085978A (en) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | Conductive resin composition and planar heating element using this |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5033707B2 (en) * | 1972-12-13 | 1975-11-01 | ||
JP3312600B2 (en) * | 1998-09-17 | 2002-08-12 | 扇化学工業株式会社 | Resin composition having PTC properties |
-
2008
- 2008-04-14 KR KR1020097021467A patent/KR20100015580A/en not_active Application Discontinuation
- 2008-04-14 JP JP2008523466A patent/JPWO2008133073A1/en active Pending
- 2008-04-14 WO PCT/JP2008/057246 patent/WO2008133073A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272702A (en) * | 1989-04-14 | 1990-11-07 | Tokyo Cosmos Electric Co Ltd | Ptc resistor |
JPH0696843A (en) * | 1992-06-22 | 1994-04-08 | Nippon Carbon Co Ltd | Temperature self-control conductive composition, temperature self-control surface heating element and temperature self-control pipe heater |
JP2001011354A (en) * | 1999-07-02 | 2001-01-16 | Honny Chem Ind Co Ltd | Printing ink for self-temperature control heater |
JP2002260442A (en) * | 2001-03-06 | 2002-09-13 | Toyobo Co Ltd | Conductive paste |
JP2005259546A (en) * | 2004-03-12 | 2005-09-22 | Toyobo Co Ltd | Conductive paste for rotary screen printing apparatus and conductor circuit using the same |
JP2006085978A (en) * | 2004-09-15 | 2006-03-30 | Toyobo Co Ltd | Conductive resin composition and planar heating element using this |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140038391A (en) * | 2011-03-18 | 2014-03-28 | 스미토모 세이카 가부시키가이샤 | Metal paste composition |
JPWO2012128028A1 (en) * | 2011-03-18 | 2014-07-24 | 住友精化株式会社 | Metal paste composition |
US9414487B2 (en) | 2011-03-18 | 2016-08-09 | Sumitomo Seika Chemicals Co., Ltd. | Metal paste composition |
WO2012128028A1 (en) * | 2011-03-18 | 2012-09-27 | 住友精化株式会社 | Metal paste composition |
KR102011523B1 (en) | 2011-03-18 | 2019-08-16 | 스미토모 세이카 가부시키가이샤 | Metal paste composition |
KR20160118263A (en) | 2014-02-06 | 2016-10-11 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor |
US10302506B2 (en) | 2014-02-06 | 2019-05-28 | Japan Science And Technology Agency | Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor |
JP7118582B2 (en) | 2016-09-09 | 2022-08-16 | 東洋紡株式会社 | Spreadable conductive composition and method for producing three-dimensional printed wiring board |
JP2018041692A (en) * | 2016-09-09 | 2018-03-15 | 東洋紡株式会社 | Ductile conductive composition and method for manufacturing three-dimensional printed wiring board |
WO2019039511A1 (en) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | Conductive paste, stretchable conductor and electronic component using same, and wearable electronic device |
JPWO2019039511A1 (en) * | 2017-08-24 | 2020-07-30 | 東洋紡株式会社 | Conductive paste, stretchable conductor and electronic parts using the same, clothes-type electronic equipment |
JP7147767B2 (en) | 2017-08-24 | 2022-10-05 | 東洋紡株式会社 | Conductive pastes, stretchable conductors and electronic components using them, clothing-type electronic devices |
US11469010B2 (en) | 2017-08-24 | 2022-10-11 | Toyobo Co., Ltd. | Conductive paste, stretchable conductor and electronic component using same, and clothes-type electronic device |
KR20210000486A (en) * | 2019-06-25 | 2021-01-05 | 주식회사 토우테크 | PTC Carbon Ink Composition And Planar Heating Film Using It |
KR102199895B1 (en) * | 2019-06-25 | 2021-01-08 | 주식회사 토우테크 | PTC Carbon Ink Composition And Planar Heating Film Using It |
Also Published As
Publication number | Publication date |
---|---|
KR20100015580A (en) | 2010-02-12 |
JPWO2008133073A1 (en) | 2010-07-22 |
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