WO2008132983A1 - Composition d'agent de polissage et procédé de fabrication d'un dispositif à circuit intégré à semiconducteur - Google Patents
Composition d'agent de polissage et procédé de fabrication d'un dispositif à circuit intégré à semiconducteur Download PDFInfo
- Publication number
- WO2008132983A1 WO2008132983A1 PCT/JP2008/056893 JP2008056893W WO2008132983A1 WO 2008132983 A1 WO2008132983 A1 WO 2008132983A1 JP 2008056893 W JP2008056893 W JP 2008056893W WO 2008132983 A1 WO2008132983 A1 WO 2008132983A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- agent composition
- polishing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009511751A JPWO2008132983A1 (ja) | 2007-04-17 | 2008-04-07 | 研磨剤組成物および半導体集積回路装置の製造方法 |
EP08739996A EP2139029A4 (fr) | 2007-04-17 | 2008-04-07 | Composition d'agent de polissage et procede de fabrication d'un dispositif a circuit integre a semiconducteur |
US12/580,311 US20100035433A1 (en) | 2007-04-17 | 2009-10-16 | Polishing agent composition and method for manufacturing semiconductor integrated circuit device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-108556 | 2007-04-17 | ||
JP2007108556 | 2007-04-17 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/580,311 Continuation US20100035433A1 (en) | 2007-04-17 | 2009-10-16 | Polishing agent composition and method for manufacturing semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008132983A1 true WO2008132983A1 (fr) | 2008-11-06 |
Family
ID=39925442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056893 WO2008132983A1 (fr) | 2007-04-17 | 2008-04-07 | Composition d'agent de polissage et procédé de fabrication d'un dispositif à circuit intégré à semiconducteur |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100035433A1 (fr) |
EP (1) | EP2139029A4 (fr) |
JP (1) | JPWO2008132983A1 (fr) |
KR (1) | KR20100015627A (fr) |
CN (1) | CN101663738A (fr) |
TW (1) | TW200845177A (fr) |
WO (1) | WO2008132983A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010104085A1 (fr) * | 2009-03-13 | 2010-09-16 | 旭硝子株式会社 | Agent de polissage de semi-conducteur, procédé pour sa fabrication, et procédé de polissage |
TWI677904B (zh) * | 2017-09-29 | 2019-11-21 | 台灣積體電路製造股份有限公司 | 半導體裝置及其形成方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005294798A (ja) * | 2004-03-08 | 2005-10-20 | Asahi Glass Co Ltd | 研磨剤および研磨方法 |
CN102615584A (zh) * | 2011-01-31 | 2012-08-01 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨的方法 |
CN102952466A (zh) * | 2011-08-24 | 2013-03-06 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
WO2015030813A1 (fr) | 2013-08-30 | 2015-03-05 | Halliburton Energy Services, Inc. | Élimination de résines durcies de formations souterraines et complétions |
TWI528877B (zh) * | 2013-11-08 | 2016-04-01 | 長興材料工業股份有限公司 | 鈍化組合物及其應用 |
WO2015069288A1 (fr) * | 2013-11-11 | 2015-05-14 | Halliburton Energy Services, Inc. | Élimination de revêtements de résine à partir de surfaces |
KR102261638B1 (ko) | 2013-11-15 | 2021-06-08 | 삼성디스플레이 주식회사 | 세정제 조성물 및 이를 이용한 금속배선 제조방법 |
US10315285B2 (en) | 2015-04-06 | 2019-06-11 | Cabot Microelectronics Corporation | CMP composition and method for polishing rigid disks |
JP7010229B2 (ja) * | 2016-09-21 | 2022-01-26 | 昭和電工マテリアルズ株式会社 | スラリ及び研磨方法 |
TW202041627A (zh) * | 2019-03-25 | 2020-11-16 | 美商卡博特微電子公司 | 增進化學機械拋光(cmp)漿料中粒子分散之添加劑 |
CN112518571A (zh) * | 2020-11-27 | 2021-03-19 | 华虹半导体(无锡)有限公司 | 铜化学机械研磨方法和设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077062A (ja) | 1999-09-06 | 2001-03-23 | Jsr Corp | 半導体装置の製造に用いる化学機械研磨用水系分散体 |
JP2005294798A (ja) | 2004-03-08 | 2005-10-20 | Asahi Glass Co Ltd | 研磨剤および研磨方法 |
JP2005294661A (ja) * | 2004-04-02 | 2005-10-20 | Hitachi Chem Co Ltd | 研磨パッド及びそれを用いる研磨方法 |
JP2006049790A (ja) | 2004-07-01 | 2006-02-16 | Fuji Photo Film Co Ltd | 金属用研磨液及び研磨方法 |
JP2006100556A (ja) * | 2004-09-29 | 2006-04-13 | Hitachi Chem Co Ltd | 研磨パッドとそれを用いた研磨方法 |
JP2006190890A (ja) * | 2005-01-07 | 2006-07-20 | Fuji Photo Film Co Ltd | 研磨液及びそれを用いた研磨方法 |
JP2007108556A (ja) | 2005-10-17 | 2007-04-26 | Nikken Kogyo Kk | 表示物取付器具 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7842193B2 (en) * | 2005-09-29 | 2010-11-30 | Fujifilm Corporation | Polishing liquid |
-
2008
- 2008-04-07 WO PCT/JP2008/056893 patent/WO2008132983A1/fr active Application Filing
- 2008-04-07 CN CN200880012615A patent/CN101663738A/zh active Pending
- 2008-04-07 JP JP2009511751A patent/JPWO2008132983A1/ja not_active Withdrawn
- 2008-04-07 KR KR1020097021603A patent/KR20100015627A/ko not_active Application Discontinuation
- 2008-04-07 EP EP08739996A patent/EP2139029A4/fr not_active Withdrawn
- 2008-04-11 TW TW097113334A patent/TW200845177A/zh unknown
-
2009
- 2009-10-16 US US12/580,311 patent/US20100035433A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077062A (ja) | 1999-09-06 | 2001-03-23 | Jsr Corp | 半導体装置の製造に用いる化学機械研磨用水系分散体 |
JP2005294798A (ja) | 2004-03-08 | 2005-10-20 | Asahi Glass Co Ltd | 研磨剤および研磨方法 |
JP2005294661A (ja) * | 2004-04-02 | 2005-10-20 | Hitachi Chem Co Ltd | 研磨パッド及びそれを用いる研磨方法 |
JP2006049790A (ja) | 2004-07-01 | 2006-02-16 | Fuji Photo Film Co Ltd | 金属用研磨液及び研磨方法 |
JP2006100556A (ja) * | 2004-09-29 | 2006-04-13 | Hitachi Chem Co Ltd | 研磨パッドとそれを用いた研磨方法 |
JP2006190890A (ja) * | 2005-01-07 | 2006-07-20 | Fuji Photo Film Co Ltd | 研磨液及びそれを用いた研磨方法 |
JP2007108556A (ja) | 2005-10-17 | 2007-04-26 | Nikken Kogyo Kk | 表示物取付器具 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2139029A4 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010104085A1 (fr) * | 2009-03-13 | 2010-09-16 | 旭硝子株式会社 | Agent de polissage de semi-conducteur, procédé pour sa fabrication, et procédé de polissage |
TWI677904B (zh) * | 2017-09-29 | 2019-11-21 | 台灣積體電路製造股份有限公司 | 半導體裝置及其形成方法 |
US10636701B2 (en) | 2017-09-29 | 2020-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of forming semiconductor devices using multiple planarization processes |
US11121028B2 (en) | 2017-09-29 | 2021-09-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices formed using multiple planarization processes |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008132983A1 (ja) | 2010-07-22 |
EP2139029A4 (fr) | 2010-03-24 |
EP2139029A1 (fr) | 2009-12-30 |
KR20100015627A (ko) | 2010-02-12 |
CN101663738A (zh) | 2010-03-03 |
TW200845177A (en) | 2008-11-16 |
US20100035433A1 (en) | 2010-02-11 |
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