WO2008132832A1 - Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board - Google Patents

Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board Download PDF

Info

Publication number
WO2008132832A1
WO2008132832A1 PCT/JP2008/001043 JP2008001043W WO2008132832A1 WO 2008132832 A1 WO2008132832 A1 WO 2008132832A1 JP 2008001043 W JP2008001043 W JP 2008001043W WO 2008132832 A1 WO2008132832 A1 WO 2008132832A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed board
via hole
conductive paste
paste composition
hole filling
Prior art date
Application number
PCT/JP2008/001043
Other languages
French (fr)
Japanese (ja)
Inventor
Masaaki Katsumata
Katsunori Hashiguchi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009511681A priority Critical patent/JP5310545B2/en
Priority to CN2008800133735A priority patent/CN101669410B/en
Publication of WO2008132832A1 publication Critical patent/WO2008132832A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Disclosed is a conductive paste composition for via hole filling, which contains 30-70% by volume of a conductive particle having an average particle diameter of 0.5-20 μm and a specific surface area of 0.05-1.5 m2/g, and 70-30% by volume of a resin which contains not less than 10% by weight of an epoxy compound having one or more epoxy groups in a molecule, wherein the total amount of hydroxy groups, amino groups and carboxyl groups is not more than 5% by mole of the epoxy groups and the epoxy equivalent is 100-350 g/eq. This conductive paste composition for via hole filling contains chlorine in an amount of 20-2000 ppm.
PCT/JP2008/001043 2007-04-23 2008-04-22 Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board WO2008132832A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009511681A JP5310545B2 (en) 2007-04-23 2008-04-22 Conductor paste composition for via hole filling, printed circuit board using the same, and method for producing the same
CN2008800133735A CN101669410B (en) 2007-04-23 2008-04-22 Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-112546 2007-04-23
JP2007112546 2007-04-23
JP2007112545 2007-04-23
JP2007-112545 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008132832A1 true WO2008132832A1 (en) 2008-11-06

Family

ID=39925303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001043 WO2008132832A1 (en) 2007-04-23 2008-04-22 Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board

Country Status (4)

Country Link
JP (1) JP5310545B2 (en)
CN (1) CN101669410B (en)
TW (1) TWI405519B (en)
WO (1) WO2008132832A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042847A1 (en) * 2010-09-27 2012-04-05 太陽ホールディングス株式会社 Heat-curable resin filler

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465453B2 (en) 2009-03-26 2014-04-09 パナソニック株式会社 Epoxy resin composition for forming optical waveguide, curable film for forming optical waveguide, flexible printed wiring board for optical transmission, and electronic information device
JP6383183B2 (en) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 Conductive adhesive and electronic component using the same
CN105304160B (en) * 2014-06-03 2018-09-14 太阳油墨制造株式会社 Conductive adhesive and use its electronic unit
KR102507434B1 (en) * 2015-05-11 2023-03-07 에이지씨 가부시키가이샤 Material for printed circuit board, metal laminate, method for manufacturing same, and method for manufacturing printed circuit board
TWI620253B (en) * 2016-04-26 2018-04-01 Method for building conductive substrate
CN112018030A (en) * 2020-08-11 2020-12-01 安徽蓝讯通信技术有限公司 Filling method of substrate through hole

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030533A (en) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd Conductive paste composition for filling via hole, double face and multilayer printed circuit board and their manufacture
WO2005095486A1 (en) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Hardener for epoxy resin and epoxy resin composition
JP2006348225A (en) * 2005-06-17 2006-12-28 Hitachi Chem Co Ltd Composite, prepreg, metallic foil clad laminate and printed wiring substrate using the same, and method for manufacturing printed wiring substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
JP2000169821A (en) * 1998-09-30 2000-06-20 Three Bond Co Ltd Ultraviolet light-curable anisotropic conductive adhesive
JP2001002982A (en) * 1999-06-22 2001-01-09 Noriko Ito Coating agent
EP1151815B1 (en) * 1999-11-10 2005-01-26 Mitsui Mining and Smelting Co., Ltd Method for preparation of nickel powder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030533A (en) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd Conductive paste composition for filling via hole, double face and multilayer printed circuit board and their manufacture
WO2005095486A1 (en) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Hardener for epoxy resin and epoxy resin composition
JP2006348225A (en) * 2005-06-17 2006-12-28 Hitachi Chem Co Ltd Composite, prepreg, metallic foil clad laminate and printed wiring substrate using the same, and method for manufacturing printed wiring substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042847A1 (en) * 2010-09-27 2012-04-05 太陽ホールディングス株式会社 Heat-curable resin filler

Also Published As

Publication number Publication date
JP5310545B2 (en) 2013-10-09
CN101669410B (en) 2011-08-03
TWI405519B (en) 2013-08-11
JPWO2008132832A1 (en) 2010-07-22
CN101669410A (en) 2010-03-10
TW200908847A (en) 2009-02-16

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