JP2000169821A - Ultraviolet light-curable anisotropic conductive adhesive - Google Patents
Ultraviolet light-curable anisotropic conductive adhesiveInfo
- Publication number
- JP2000169821A JP2000169821A JP11138495A JP13849599A JP2000169821A JP 2000169821 A JP2000169821 A JP 2000169821A JP 11138495 A JP11138495 A JP 11138495A JP 13849599 A JP13849599 A JP 13849599A JP 2000169821 A JP2000169821 A JP 2000169821A
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive adhesive
- ultraviolet
- epoxy resin
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、僅かな紫外線照射
量で完全硬化する異方導電接着剤と、この異方導電接着
剤を用いて緩やかな硬化条件で対向する一対の接続端子
を物理的・電気的に接続する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive which is completely cured by a small amount of ultraviolet irradiation, and a pair of connection terminals which face each other under mild curing conditions using the anisotropic conductive adhesive. -It relates to a method of electrically connecting.
【０００２】[0002]
【従来の技術】導電性微粒子を熱硬化型エポキシ樹脂組
成物中に均一分散させたフィルム状の異方導電性接着剤
はよく知られている。この異方導電接着剤は接続対象の
基板上に仮貼りしＩＣベアチップまたはテープキャリア
パッケージ（ＴＣＰ）等の回路素子の接続端子を対象基
板上の接続端子と位置あわせした後、高温高圧で加熱圧
着し熱硬化型エポキシ樹脂組成物を硬化・架橋させると
同時に相対する接続端子間に導電性微粒子を挟み込んで
物理的・電気的に接続を行っている。この場合の加熱圧
着条件は、一般的に加熱温度が１５０〜２００℃、圧力
が２０００〜３０００ｋＰａ、加熱圧着時間が２０〜３
０秒で行なっている。2. Description of the Related Art A film-shaped anisotropic conductive adhesive in which conductive fine particles are uniformly dispersed in a thermosetting epoxy resin composition is well known. This anisotropic conductive adhesive is temporarily attached on a substrate to be connected, and the connection terminals of circuit elements such as an IC bare chip or a tape carrier package (TCP) are aligned with the connection terminals on the target substrate. At the same time, the thermosetting epoxy resin composition is cured and cross-linked, and at the same time, the conductive fine particles are sandwiched between the connecting terminals to physically and electrically connect. The heating and pressing conditions in this case are generally as follows: a heating temperature of 150 to 200 ° C., a pressure of 2000 to 3000 kPa, and a heating and pressing time of 20 to 3 kPa.
This is done in 0 seconds.
【０００３】さらに、短時間で接続できる紫外線硬化性
樹脂組成物を使った異方導電性接着剤については、特開
平０５−６３０３１号、特開平０８−３１５８８４号、
特開平０８−３１５８８５号、特開平０９−１４３４４
５号で開示されている。また、紫外線照射を利用した接
合方法については特開平１０−１１２４７６号、特開平
１１−７４３１３号で開示されている。Further, anisotropic conductive adhesives using an ultraviolet-curable resin composition which can be connected in a short time are disclosed in JP-A-05-63031 and JP-A-08-315884.
JP-A-08-315885, JP-A-09-14344
No. 5 discloses it. Further, a bonding method using ultraviolet irradiation is disclosed in JP-A-10-112476 and JP-A-11-74313.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、現状の
異方導電性接着剤には、次のような課題がある。 １）加熱圧着時において、基板と電子素子との熱膨張差
が生じて接続不良が起こる。そのため、設計段階で基板
と電子素子の熱膨張差を予め考慮に入れて接合を行って
いる。しかし、接続端子の電極間の間隔がより微細にな
る程、熱膨張差を起因とする接続不良が発生しやくな
る。例えば液晶表示装置では、液晶パネルのガラス基板
と表示駆動素子であるテープキャリアパッケージ（ＴＣ
Ｐ）の基材膜であるポリイミドとの熱膨張差を原因とす
る接続端子同士の位置ずれを原因とする接続不良が起き
てしまう。However, the current anisotropic conductive adhesive has the following problems. 1) At the time of thermocompression bonding, a difference in thermal expansion between the substrate and the electronic element occurs, resulting in poor connection. Therefore, bonding is performed in consideration of the difference in thermal expansion between the substrate and the electronic element in the design stage. However, as the distance between the electrodes of the connection terminals becomes smaller, connection failure due to a difference in thermal expansion is more likely to occur. For example, in a liquid crystal display device, a glass substrate of a liquid crystal panel and a tape carrier package (TC
Poor connection may occur due to misalignment of the connection terminals due to a difference in thermal expansion from the polyimide which is the substrate film of P).
【０００５】２）加熱圧着時において、基板の接続端子
に近接する他の電子素子が熱や圧力による損傷を受け
る。最近の電気機器の軽薄短小化により基板の接続端子
に近接して他の電子素子を設置しているので、加熱圧着
の治具または接続部からの伝導熱で近接する電子素子が
破損して誤動作をする。例えば上記の液晶表示装置の場
合では、ガラス基板の接続端子に近接して液晶メインシ
ール部、駆動ＩＣ、液晶パネル基板等が設置されてお
り、これら素子が熱や圧力によって損傷を受ける。2) At the time of thermocompression bonding, other electronic elements near the connection terminals of the substrate are damaged by heat or pressure. Recent electronic devices have become lighter, thinner and smaller, and other electronic elements have been installed close to the connection terminals on the board. do. For example, in the case of the above-described liquid crystal display device, a liquid crystal main seal portion, a driving IC, a liquid crystal panel substrate, and the like are provided near the connection terminals of the glass substrate, and these elements are damaged by heat and pressure.
【０００６】３）加熱圧着時において、加熱条件が高温
になるほど、対向し合う接続端子同士の間に介在する導
電性粒子が少なくなる。フィルム材料の樹脂が高温域で
液状化すると、導電性粒子がこの樹脂の流動と伴に接続
端子間から流失してしまう。電極間の間隔が狭い接続端
子ではこの作用が顕著にあらわれ、接続信頼性は低下す
る。[0006] 3) In the thermocompression bonding, as the heating condition becomes higher, the conductive particles interposed between the opposing connection terminals decrease. When the resin of the film material liquefies in a high temperature range, the conductive particles flow away from between the connection terminals along with the flow of the resin. This effect is remarkable in a connection terminal having a narrow interval between the electrodes, and the connection reliability is reduced.
【０００７】４）紫外線が非透過になっている陰影部で
は紫外線硬化性樹脂は完全に硬化しないので、接続の信
頼性が低くなる。そのため、異方導電性接着剤が完全に
硬化できるように、酸化スズ系の透明導電材料の接続端
子を透明基板上に形成した透明な基板同士の接続のみに
紫外線硬化型異方導電性接着剤の使用が限られていた。[0007] 4) Since the ultraviolet curable resin is not completely cured in the shaded portion where the ultraviolet light is not transmitted, the reliability of the connection is low. Therefore, in order to completely cure the anisotropic conductive adhesive, the connection terminal of the tin oxide transparent conductive material is formed on the transparent substrate. The use of was limited.
【０００８】[0008]
【発明が解決しようとする課題】本発明は、ａ）１分子
中にグリシジル基を少なくとも２つ以上含むエポキシ樹
脂化合物と、ｂ）光活性オニウム塩と、ｃ）導電性微粒
子と、ｄ）アルコキシシラン化合物を少なくとも必須成
分とするペースト状もしくはシート状の紫外線硬化性異
方導電接着剤にすることで、課題である加熱圧着条件に
ついての低温化・低圧化と、紫外線照射の陰影部につい
ても完全硬化を達成し、その接続信頼性を高めるに至っ
た。DISCLOSURE OF THE INVENTION The present invention comprises: a) an epoxy resin compound containing at least two glycidyl groups in one molecule; b) a photoactive onium salt; c) conductive fine particles; By using a paste- or sheet-shaped UV-curable anisotropic conductive adhesive containing at least a silane compound as an essential component, it is possible to lower the temperature and pressure for the heat and pressure bonding conditions, which are the issues, and to completely eliminate the shadowed areas of UV irradiation. Hardening was achieved and the connection reliability was improved.
【０００９】また、ａ）１分子中にグリシジル基を少な
くとも２つ以上含むエポキシ樹脂化合物と、ｂ）光活性
オニウム塩と、ｃ）導電性微粒子と、ｄ）アルコキシシ
ラン化合物、ｅ）１分子中にラジカル重合性の官能基を
少なくとも１つ以上含むラジカル重合性樹脂化合物と、
ｆ）ラジカル重合開始剤とを必須成分とするペースト状
もしくはシート状の紫外線硬化性異方導電接着剤も、同
様に前記課題を解決した。Further, a) an epoxy resin compound containing at least two glycidyl groups in one molecule, b) a photoactive onium salt, c) conductive fine particles, d) an alkoxysilane compound, and e) one molecule in one molecule. A radically polymerizable resin compound containing at least one or more radically polymerizable functional groups,
f) A paste-like or sheet-like UV-curable anisotropic conductive adhesive containing a radical polymerization initiator as an essential component also solved the above-mentioned problem.
【００１０】さらに本件出願は、前記の異方導電性接着
剤によって、透明基板の接続端子とこれに対向する基板
または電子素子の接続端子を緩い条件下でも高い信頼性
で接続する方法の発明も含む。つまり、この紫外線硬化
性異方導電接着剤を一方の接続端子に貼着する第１工程
と、この異方導電接着剤の成分中のエポキシ樹脂化合物
は未硬化状態を維持しているが同じく成分中の光活性オ
ニウム塩は活性化してカチオン種を生成するだけのエネ
ルギー量の紫外線をこの異方導電接着剤に照射する第２
工程と、この紫外線硬化性異方導電接着剤を完全硬化さ
せるために熱圧着する第３工程を経て、透明基板の接続
を行う。Further, the present application also discloses an invention of a method for connecting a connection terminal of a transparent substrate and a connection terminal of an opposing substrate or electronic element with high reliability even under a loose condition by using the anisotropic conductive adhesive. Including. That is, the first step of attaching the ultraviolet-curable anisotropic conductive adhesive to one of the connection terminals, and the epoxy resin compound in the component of the anisotropic conductive adhesive is maintained in an uncured state. The photoactive onium salt is activated by irradiating the anisotropic conductive adhesive with an ultraviolet ray having an energy amount sufficient to generate a cationic species.
The transparent substrate is connected through a process and a third process of thermocompression bonding in order to completely cure the ultraviolet-curable anisotropic conductive adhesive.
【００１１】以下に、本発明の紫外線硬化性異方導電接
着剤の各成分について説明する。Hereinafter, each component of the ultraviolet-curable anisotropic conductive adhesive of the present invention will be described.
【００１２】ａ）エポキシ樹脂化合物は、例えばビスフ
ェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキ
シ樹脂、ビスフェノールＳ型エポキシ樹脂、フェノール
ノボラック型エポキシ樹脂、クレゾールノボラック型エ
ポキシ樹脂、ビスフェノールＡ型ノボラックエポキシ樹
脂、２，６−キシレノールダイマーのグリシジルエーテ
ル化樹脂、ビスフェノールＦ型ノボラック型エポキシ樹
脂、イソシアヌレート型エポキシ樹脂、ヒダントイン型
エポキシ樹脂、３官能型エポキシ樹脂や４官能型エポキ
シ樹脂等の多官能型エポキシ樹脂やグリシジルエステル
型エポキシ樹脂、水添ビスフェノール型エポキシ樹脂、
脂環式エポキシ樹脂、グリシジル基を有するポリブタジ
エンなどのエラストマー、２個以上のオキシラン基を有
するエポキシ樹脂、あるいはこれらを臭素化した難燃性
エポキシ樹脂などを挙げることができる。またこれらを
２種以上混合してもよい。本発明はこれらに限定される
ものではなく、一分子中にグリシジル基を少なくとも一
つ以上有するエポキシ樹脂であればよい。これらは、単
独または２種以上混合して使用することができる。さら
に、電極の腐食を防止するためにはエポキシ樹脂化合物
中の不純物イオン濃度（Ｎａ、Ｋ、Ｃｌ、Ｂｒ等のイオ
ン）および加水分解性塩素等は５００ｐｐｍ以下である
ことが好ましい。A) Epoxy resin compounds include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A type novolak epoxy resin, Glycidyl etherified resin of 6-xylenol dimer, bisphenol F type novolak type epoxy resin, isocyanurate type epoxy resin, hydantoin type epoxy resin, polyfunctional type epoxy resin such as trifunctional type epoxy resin and tetrafunctional type epoxy resin and glycidyl ester Epoxy resin, hydrogenated bisphenol epoxy resin,
Examples thereof include an alicyclic epoxy resin, an elastomer such as polybutadiene having a glycidyl group, an epoxy resin having two or more oxirane groups, and a flame-retardant epoxy resin obtained by brominating these. Also, two or more of these may be mixed. The present invention is not limited to these, and any epoxy resin having at least one glycidyl group in one molecule may be used. These can be used alone or in combination of two or more. Furthermore, in order to prevent electrode corrosion, the impurity ion concentration (ions such as Na, K, Cl, and Br) and the hydrolyzable chlorine in the epoxy resin compound are preferably 500 ppm or less.
【００１３】ｂ）光活性オニウム塩としては、ジアゾニ
ウム塩、スルフォニウム塩、ヨードニウム塩等が使用で
き、好ましくは上記ａ）エポキシ樹脂化合物と後述の
ｅ）ラジカル重合性樹脂化合物組に溶解する化合物が望
ましい。また、深部硬化性を希望する場合はヨードニウ
ム塩を使用し、紫外線と熱を併用して硬化させる場合は
スルフォニウム塩というように、その特性に応じて使い
分けることができる。またケトクマリン系の色素を併用
すると光硬化活性を長波長側にシフトさせることも可能
である。B) As the photoactive onium salt, a diazonium salt, a sulfonium salt, an iodonium salt and the like can be used. Preferably, a compound soluble in the above a) epoxy resin compound and e) a radical polymerizable resin compound set described below is desirable. . In addition, when deep curing is desired, an iodonium salt is used, and when curing is performed using both ultraviolet light and heat, a sulfonium salt can be used depending on its characteristics. When a ketocoumarin dye is used in combination, the photocuring activity can be shifted to a longer wavelength side.
【００１４】ｃ）導電性微粒子としては、Ｎｉ、Ａｇ、
Ａｕ、Ｐｄ、Ｐｂ、Ｓｎ等の金属微粒子、この金属微粒
子にさらに金属メッキをしたメッキ金属微粒子、樹脂微
粒子に金属メッキしたメッキ樹脂微粒子が使用できる。
本件発明では、これら微粒子表面に絶縁層を設けた絶縁
／導電性微粒子が特に望ましい。その理由として、保存
・製造上での導電性微粒子の二次凝集を原因とする接続
端子内での隣接する電極間の絶縁性低下を防止するため
である。また、形状は球状または粒状が望ましく、その
粒径は接続端子の電極の形状・接続面積により種々選択
できる。導電性微粒子の添加量は、エポキシ樹脂組成物
１００容量部に対して２〜２５容量部の範囲で使用で
き、２容量部未満であると接続信頼性が低下し、２５容
量部より多いと電極間の絶縁信頼性が低下する。C) Ni, Ag,
Fine metal particles such as Au, Pd, Pb, Sn, etc., plated metal fine particles obtained by further plating the metal fine particles, and plated resin fine particles obtained by metal plating the resin fine particles can be used.
In the present invention, insulating / conductive fine particles having an insulating layer provided on the surface of these fine particles are particularly desirable. The reason is to prevent a decrease in insulation between adjacent electrodes in the connection terminal due to secondary aggregation of the conductive fine particles during storage and manufacture. The shape is desirably spherical or granular, and the particle size can be variously selected depending on the shape and connection area of the electrode of the connection terminal. The addition amount of the conductive fine particles can be used in the range of 2 to 25 parts by volume with respect to 100 parts by volume of the epoxy resin composition. If the amount is less than 2 parts by volume, the connection reliability is reduced. The insulation reliability between them is reduced.
【００１５】本発明では、前記ｃ）導電性微粒子が異方
導電性接着剤中の二次凝集を防止し分散性を改善するた
めに、さらに絶縁性充填材を添加してもよい。当該絶縁
性充填材の好ましい形状として鱗片状または樹枝状を挙
げることができる。このような絶縁性充填材の例とし
て、溶融シリカ、マイカ、タルク、ベントナイト、カオ
リナイト等が使用できる。これらは単独、または２種以
上の混合物でも使用できる。特に導電性微粒子の比重が
大きい場合、例えば金属微粒子・金属メッキ金属微粒子
等が用いられる際には、沈降または二次凝集等の問題も
解決できる。その添加量としては、電気的接続性が損な
われない範囲で、かつ塗布作業性の因子となる粘度、チ
クソ性を調整できる範囲内で使用する。さらに、イオン
スカベンジャーとしてハイドロタルサイトなども加えて
もよい。In the present invention, an insulating filler may be further added in order to prevent secondary aggregation of the conductive fine particles in the anisotropic conductive adhesive and improve dispersibility. Preferable shapes of the insulating filler include scaly or dendritic shapes. Examples of such an insulating filler include fused silica, mica, talc, bentonite, kaolinite and the like. These can be used alone or as a mixture of two or more. In particular, when the specific gravity of the conductive fine particles is large, for example, when metal fine particles or metal-plated metal fine particles are used, problems such as sedimentation or secondary aggregation can be solved. The amount added is within a range where the electrical connectivity is not impaired and within a range where viscosity and thixotropy, which are factors of coating workability, can be adjusted. Further, hydrotalcite or the like may be added as an ion scavenger.
【００１６】ｄ）のアルコキシシランとしては、特開昭
６１−２１１２６号に記載されている通常のトリメトキ
シシラン、トリエトキシシランなどのトリアルコキシシ
ラン化合物、ジエトキシシランなどのジアルコキシシラ
ン化合物を挙げることができる。このアルコキシシラン
の非加水分解基は重合性官能基であることが好ましく、
特に、γ−グリシドキシプロピルトリメトキシシラン、
γ−グリシドキシプロピルメチルジエトキシシラン、β
−（３，４−エポキシシクロヘキシル）エチルトリメト
キシシランなどのエポキシアルコキシシランが好まし
い。これらアルコキシシランの働きは、少ない紫外線照
射量でもエポキシ樹脂化合物が完全硬化できるようにそ
の重合性を活性化したり、または紫外線照射後に加熱重
合させる際の温度を低温化できるなどのエポキシ樹脂化
合物に潜在硬化性を付与したりする。Examples of the alkoxysilane d) include ordinary trialkoxysilane compounds such as trimethoxysilane and triethoxysilane and dialkoxysilane compounds such as diethoxysilane described in JP-A-61-21126. be able to. The non-hydrolyzable group of this alkoxysilane is preferably a polymerizable functional group,
In particular, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldiethoxysilane, β
Epoxyalkoxysilanes such as-(3,4-epoxycyclohexyl) ethyltrimethoxysilane are preferred. The function of these alkoxysilanes is to activate the polymerizability of the epoxy resin compound so that the epoxy resin compound can be completely cured even with a small amount of ultraviolet irradiation, or to reduce the temperature of heat polymerization after irradiation with ultraviolet light. And to give curability.
【００１７】本件出願における他の発明である紫外線硬
化性異方導電性接着剤は、ａ）１分子中にグリシジル基
を少なくとも２つ以上含むエポキシ樹脂化合物と、ｂ）
光活性オニウム塩と、ｃ）導電性微粒子と、ｄ）アルコ
キシシラン化合物、ｅ）１分子中にラジカル重合性の官
能基を少なくとも１つ以上含むラジカル重合性樹脂化合
物と、ｆ）ラジカル重合開始剤とを必須成分とするペー
スト状もしくはシート状の組成物である。The ultraviolet-curable anisotropic conductive adhesive according to another invention of the present application includes: a) an epoxy resin compound containing at least two glycidyl groups in one molecule; and b)
A photoactive onium salt, c) conductive fine particles, d) an alkoxysilane compound, e) a radically polymerizable resin compound containing at least one radically polymerizable functional group in one molecule, and f) a radical polymerization initiator And a paste-like or sheet-like composition containing the following as essential components.
【００１８】この紫外線硬化性異方導電性接着剤の各成
分について説明をする。ａ）エポキシ樹脂化合物と、
ｂ）光活性オニウム塩と、ｃ）導電性微粒子と、ｄ）ア
ルコキシシラン化合物は、前述と同じである。ｅ）ラジ
カル重合性樹脂化合物としては、アクリル樹脂、メタク
リル樹脂、アリル樹脂、ビニル樹脂等の不飽和の炭素２
重結合基を有する重合性モノマーを使用する。ａ）エポ
キシ樹脂化合物とｅ）ラジカル重合性樹脂化合物との混
合の配合割合は重量比で１０／９０〜９５／５であり、
前記ｃ）導電性微粒子が当該ａ）とｂ）を合計した樹脂
組成物の１００容量部に対して２〜２５容量部の範囲で
ある。エポキシ樹脂化合物の割合が少なすぎると、接続
後の信頼性が低下し、多すぎると硬化速度が遅くなると
いう問題が生じる。ｆ）ラジカル重合開始剤としては、
光活性の自己解裂型のラジカル重合開始剤または水素引
き抜き型のラジカル重合開始剤のいずれも使用できる。
また、過酸化物等の熱活性のラジカル重合開始剤も使用
できる。これらラジカル重合開始剤の単独でもよいが、
光の陰影部でも容易に硬化するようにするために、光活
性のラジカル重合開始剤と熱活性のラジカル重合開始剤
との混合物で使用することが本件発明では特に好まし
い。また、ｂ）光活性オニウム塩およびｆ）ラジカル重
合開始剤の添加量は、イオン性不純物の混入の可能性が
高くなると圧着後の信頼性が低下するので、本発明では
できるだけ少量添加が望ましい。Each component of the UV-curable anisotropic conductive adhesive will be described. a) an epoxy resin compound;
The b) photoactive onium salt, c) conductive fine particles, and d) the alkoxysilane compound are the same as described above. e) As the radical polymerizable resin compound, unsaturated carbon 2 such as acrylic resin, methacrylic resin, allyl resin, vinyl resin, etc.
A polymerizable monomer having a heavy bond group is used. The mixing ratio of the mixture of a) the epoxy resin compound and e) the radically polymerizable resin compound is 10/90 to 95/5 by weight,
The conductive fine particles (c) are in the range of 2 to 25 parts by volume with respect to 100 parts by volume of the resin composition obtained by adding the components (a) and (b). If the proportion of the epoxy resin compound is too small, the reliability after connection decreases, and if it is too large, the curing rate becomes slow. f) As the radical polymerization initiator,
Either a photoactive self-cleaving type radical polymerization initiator or a hydrogen abstraction type radical polymerization initiator can be used.
Further, a heat-active radical polymerization initiator such as a peroxide can also be used. These radical polymerization initiators may be used alone,
In the present invention, it is particularly preferable to use a mixture of a photo-active radical polymerization initiator and a heat-active radical polymerization initiator in order to easily cure even a shaded portion of light. In addition, the addition amount of b) the photoactive onium salt and f) the radical polymerization initiator is desirably as small as possible in the present invention, because the reliability after press bonding is reduced if the possibility of mixing ionic impurities increases.
【００１９】本発明の紫外線硬化性異方導電性接着剤
が、ペースト状の場合では粘度が常温で３０００００ｍ
Ｐａ・ｓ以下の粘度が好ましい。シート状の場合では、
前記組成に、ポリウレタン樹脂、ポリエステル樹脂、フ
ェノキシ樹脂等で代表される高分子量樹脂、ＳＢＲ、Ｎ
ＢＲ、ＳＥＢＳなどの共重合高分子エラストマーを添加
して、また必要に応じてシラン、チタネート、アルミニ
ウムカップリング剤等やアミン類の密着性向上剤を添加
してシートを形成する。When the ultraviolet-curable anisotropic conductive adhesive of the present invention is in the form of a paste, the viscosity at room temperature is 300,000 m.
A viscosity of Pa · s or less is preferred. In the case of a sheet,
In the above composition, a high molecular weight resin represented by polyurethane resin, polyester resin, phenoxy resin, etc., SBR, N
A sheet is formed by adding a copolymerized elastomer such as BR and SEBS, and, if necessary, by adding a silane, a titanate, an aluminum coupling agent or the like, or an adhesion improver for amines.
【００２０】本件出願における他の発明である透明基板
の接続方法とは、透明基板の接続端子とこれに対向する
基板または電子素子の接続端子との接続において、前記
の紫外線硬化性異方導電接着剤を一方の接続端子に貼着
する第１工程と、この異方導電接着剤の成分中のエポキ
シ樹脂化合物は未硬化状態を維持しているが、同じく成
分中の光活性オニウム塩は活性化してカチオン種を生成
するだけのエネルギー量の紫外線をこの異方導電接着剤
に照射する第２工程と、他方の接続端子を前記一方の接
続端子と対向するように所定の位置に配置して、この異
方導電接着剤を完全硬化させるために熱圧着する第３工
程をからなる方法である。さらに、この紫外線硬化性異
方導電接着剤を完全硬化させるために、前記の第３工程
が熱圧着と同時にさらに透明基板を透して紫外線照射も
併行して行ってもよい。The method for connecting a transparent substrate, which is another invention in the present application, is a method for connecting a connection terminal of a transparent substrate and a connection terminal of a substrate or an electronic element facing the transparent substrate with the ultraviolet curable anisotropic conductive adhesive. A first step of adhering the agent to one of the connection terminals, and the epoxy resin compound in the component of the anisotropic conductive adhesive maintains an uncured state, but the photoactive onium salt in the component is also activated. A second step of irradiating the anisotropic conductive adhesive with ultraviolet light having an energy amount sufficient to generate a cationic species, and disposing the other connection terminal at a predetermined position so as to face the one connection terminal, This is a method comprising a third step of thermocompression bonding to completely cure the anisotropic conductive adhesive. Further, in order to completely cure the ultraviolet-curable anisotropic conductive adhesive, the above-mentioned third step may be performed simultaneously with thermocompression bonding, and simultaneously with ultraviolet irradiation through a transparent substrate.
【００２１】前述の第２工程の紫外線照射量は、紫外線
硬化性異方導電接着剤を完全硬化させるのに必要な紫外
線照射照射量の１／５〜１／３のエネルギー量を照射す
る。例えば、２０００ｍＪで完全硬化する紫外線硬化性
異方導電接着剤では、１００〜６００ｍＪを紫外線照射
する。第２工程の紫外線照射で光活性オニウム塩は活性
化されてエポキシ樹脂化合物はリビング重合が可能な状
態となり、接続端子同士を対向するように位置合わせし
た後に硬化させる際に、加熱温度が低いまたは紫外線照
射の陰影部が生じるような条件下でも、完全硬化が可能
となる。エポキシ樹脂化合物のカチオンによるリビング
重合は前述のアルコキシシランの作用によって、さらに
改善される。The amount of UV irradiation in the second step is 1/5 to 1/3 of the amount of UV irradiation required to completely cure the UV-curable anisotropic conductive adhesive. For example, in the case of an ultraviolet-curable anisotropic conductive adhesive which is completely cured at 2000 mJ, 100 to 600 mJ is irradiated with ultraviolet light. The ultraviolet ray irradiation in the second step activates the photoactive onium salt, and the epoxy resin compound becomes a state in which living polymerization can be performed. When the connection terminals are cured so as to face each other, the heating temperature is low or Complete curing is possible even under the conditions where shadows due to ultraviolet irradiation occur. Living polymerization of the epoxy resin compound by cations is further improved by the action of the alkoxysilane described above.
【００２２】[0022]
【発明の実施の形態】実施例１：ビスフェノールＡ型エ
ポキシ樹脂（商品名；ＥＰ−８２８、油化シェル社製）
５０重量部、フェノールノボラック型エポキシ樹脂（商
品名；ＥＰ−１５２、油化シェル社製）５０重量部、ヨ
ードニウム系光活性オニウム塩（商品名；ＣＤ−１０１
２、サートマー社製）３重量部、γ−グリシドキシプロ
ピルトリメトキシシラン（商品名；ＫＢＭ−４０３、信
越化学工業社製）２重量部を混合撹拌し、ついでスチレ
ン樹脂粒子の表面を金属メッキした導電性微粒子（商品
名；ミクロパールＡＵ−２０４、積水ファインケミカル
社製）１０重量部、鱗片状の絶縁性充填材タルク（商品
名；スーパータルクＳＧ−２０００、日本タルク社製）
２０重量部を添加し脱泡しながら撹拌して、ペースト状
の紫外線硬化性異方導電性接着剤を調製した。DESCRIPTION OF THE PREFERRED EMBODIMENTS Example 1: Bisphenol A type epoxy resin (trade name; EP-828, manufactured by Yuka Shell Co., Ltd.)
50 parts by weight, 50 parts by weight of a phenol novolak type epoxy resin (trade name: EP-152, manufactured by Yuka Shell Co., Ltd.), iodonium-based photoactive onium salt (trade name: CD-101)
2, 3 parts by weight of Sartomer) and 2 parts by weight of γ-glycidoxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) are mixed and stirred, and then the surface of the styrene resin particles is metal-plated. 10 parts by weight of conductive fine particles (trade name: Micropearl AU-204, manufactured by Sekisui Fine Chemical Co., Ltd.), scale-like insulating filler talc (trade name: Super Talc SG-2000, manufactured by Nippon Talc)
20 parts by weight were added and stirred while defoaming to prepare a paste-like ultraviolet-curable anisotropic conductive adhesive.
【００２３】実施例２：ビスフェノールＡ型エポキシ樹
脂（商品名；ＥＰ−８２８、油化シェル社製）５０重量
部、ナフタレン型エポキシ樹脂（商品名；ＨＰ−４０３
２、大日本インキ社製）５０重量部、フェノキシ樹脂
（商品名；フェノキシＰＫＨＪ、フェノキシアソシエイ
ツ社製）４０重量部、ヨードニウム系光活性オニウム塩
（商品名；ＣＤ−１０１２、サートマー社製）３重量
部、γ−グリシドキシプロピルトリメトキシシラン（商
品名；ＫＢＭ−４０３、信越化学工業社製）２重量部を
トルエン中に溶解混合し、ついでスチレン樹脂粒子の表
面を金属メッキした導電性微粒子（商品名；ミクロパー
ルＡＵ−２０４、積水ファインケミカル社製）１０重量
部、鱗片状の絶縁性充填材タルク（商品名；スーパータ
ルクＳＧ−２０００、日本タルク社製）２０重量部添加
し脱泡しながら撹拌した。この組成物を剥離性フィルム
の上に塗工し乾燥して膜厚１８μｍのシート状の紫外線
硬化性異方導電接着剤を調製した。Example 2: Bisphenol A type epoxy resin (trade name; EP-828, manufactured by Yuka Shell Co., Ltd.) 50 parts by weight, naphthalene type epoxy resin (trade name: HP-403)
2, 50 parts by weight of Dainippon Ink Co., Ltd., 40 parts by weight of phenoxy resin (trade name; phenoxy PKHJ, manufactured by Phenoxy Associates), 3 parts by weight of iodonium-based photoactive onium salt (trade name: CD-1012, manufactured by Sartomer) And 2 parts by weight of γ-glycidoxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) were dissolved and mixed in toluene, and then the conductive fine particles obtained by metal-plating the surface of styrene resin particles ( Trade name: Micropearl AU-204, manufactured by Sekisui Fine Chemical Co., Ltd.), 10 parts by weight, scaly insulating filler talc (trade name: Super Talc SG-2000, manufactured by Nippon Talc) 20 parts by weight Stirred. This composition was applied on a release film and dried to prepare a sheet-shaped ultraviolet-curable anisotropic conductive adhesive having a thickness of 18 μm.
【００２４】実施例３：ビスフェノールＡ型エポキシ樹
脂（商品名；ＥＰ−８２８、油化シェル社製）７２重量
部、ビスフェノールＡ型エポキシ樹脂（商品名；ＥＰ−
１００１、油化シェル社製）１８重量部、スルホニウム
系光活性オニウム塩（商品名；ＵＶ１６９７０、ユニオ
ンカーバイド社製）２重量部、γ−グリシドキシプロピ
ルトリメトキシシラン（商品名；ＫＢＭ−４０３、信越
化学工業社製）２重量部、メタアクリル酸イソボロニル
（商品名；ＩＢＸＭＡ、三菱レーヨン社製）５重量部、
２−ヒドロキシエチルアクリレート（商品名；ＨＥＭ
Ａ、三菱レーヨン社製）５重量部を混合撹拌し、光ラジ
カル開始剤１−ヒドロキシシクロヘキシルフェニルケト
ン（商品名；イルガキュア１８４、チバスペシャルティ
ケミカルズ社製）２重量部、有機過酸化物ブチルパーオ
キシ２−エチルヘキサノェート（商品名；パーブチル−
Ｏ、日本油脂社製）０．３重量部、ベンゾグアナミン粒
子の表面をＮｉ／Ａｕメッキした導電性微粒子（商品
名；ブライト２０ＧＮＲ−４．６ＥＨ、日本化学社製）
８重量部、鱗片状の絶縁性充填材タルク（商品名；ミク
ロエースＫ−１、日本タルク社製）１０重量部、絶縁性
充填材シリカ（商品名；アエロジル２００、日本アエロ
ジル社製）１重量部を添加し脱泡しながら撹拌して、ペ
ースト状の紫外線硬化性異方導電性接着剤を調製した。Example 3: Bisphenol A type epoxy resin (trade name; EP-828, manufactured by Yuka Shell Co., Ltd.) 72 parts by weight, bisphenol A type epoxy resin (trade name: EP-
1001, 18 parts by weight, manufactured by Yuka Shell Co., Ltd.), 2 parts by weight of a sulfonium-based photoactive onium salt (trade name: UV16970, manufactured by Union Carbide), γ-glycidoxypropyltrimethoxysilane (trade name: KBM-403) 2 parts by weight of Shin-Etsu Chemical Co., Ltd., 5 parts by weight of isobornyl methacrylate (trade name: IBXMA, manufactured by Mitsubishi Rayon Co., Ltd.)
2-hydroxyethyl acrylate (trade name; HEM)
A, 5 parts by weight of Mitsubishi Rayon Co., Ltd.) were mixed and stirred, and 2 parts by weight of a photo-radical initiator 1-hydroxycyclohexyl phenyl ketone (trade name: Irgacure 184, manufactured by Ciba Specialty Chemicals) and organic peroxide butylperoxy 2 -Ethyl hexanoate (trade name; perbutyl-
O, manufactured by Nippon Oil & Fats Co., Ltd.) 0.3 parts by weight, conductive fine particles having Ni / Au plated benzoguanamine particles on the surface (trade name: Bright 20GNR-4.6EH, manufactured by Nippon Chemical Co., Ltd.)
8 parts by weight, 10 parts by weight of scaly insulating filler talc (trade name: Microace K-1, manufactured by Nippon Talc), 1 part by weight of insulating filler silica (trade name: Aerosil 200, manufactured by Nippon Aerosil Co., Ltd.) The mixture was stirred while defoaming to prepare a paste-like ultraviolet-curable anisotropic conductive adhesive.
【００２５】比較例１（アルコキシシランを含まない紫
外線硬化性異方導電接着剤）エポキシアクリレート（商
品名；ＵＥ８２００，大日本インキ社製）７０重量部、
２−ヒドロキシエチルアクリレート（商品名；ＨＥＭ
Ａ、三菱レーヨン社製）３０重量部を混合撹拌し、光ラ
ジカル開始剤１−ヒドロキシシクロヘキシルフェニルケ
トン（商品名；イルガキュア１８４、チバスペシャルテ
ィケミカルズ社製）２重量部、有機過酸化物ブチルパー
オキシ２−エチルヘキサノェート（商品名；パーブチル
−Ｏ、日本油脂社製）０．３重量部、スチレン樹脂粒子
の表面を金属メッキした導電性微粒子商品名；ミクロパ
ールＡＵ−２０４、積水ファインケミカル社製）１０重
量部、鱗片状の絶縁性充填材タルク（スーパータルクＳ
Ｇ−２０００、日本タルク社製）１０重量部を、脱泡し
ながら撹拌して、ペースト状の紫外線硬化性異方導電性
接着剤を調製した。Comparative Example 1 (UV curable anisotropic conductive adhesive containing no alkoxysilane) 70 parts by weight of epoxy acrylate (trade name: UE8200, manufactured by Dainippon Ink)
2-hydroxyethyl acrylate (trade name; HEM)
A, 30 parts by weight of Mitsubishi Rayon Co., Ltd.) were mixed and stirred, and 2 parts by weight of a photoradical initiator 1-hydroxycyclohexyl phenyl ketone (trade name: Irgacure 184, manufactured by Ciba Specialty Chemicals), organic peroxide butylperoxy 2 -0.3 parts by weight of ethyl hexanoate (trade name: Perbutyl-O, manufactured by NOF CORPORATION), conductive fine particles obtained by metal-plating the surface of styrene resin particles; trade name: Micropearl AU-204, manufactured by Sekisui Fine Chemical Co., Ltd. 10 parts by weight, scale-like insulating filler talc (Super Talc S
G-2000, manufactured by Nippon Talc Co., Ltd., 10 parts by weight was stirred while defoaming to prepare a paste-like ultraviolet-curable anisotropic conductive adhesive.
【００２６】テストピース：ガラス基板はガラス部が
１．１ｍｍ厚のソーダガラスをSiO2にディップして表面
研磨し、電極パターン部はアルミ蒸着（０．１Ω／ｃｍ
２ ）、７０μｍピッチ（電極部：ガラス部＝１：１）
で構成している。テープキャリアパッケージ（以下、Ｔ
ＣＰと略す）は７５μｍ厚のポリイミドフィルムに１／
２オンスCu箔と錫メッキ処理をほどこしてあり、７０μ
ｍピッチ（電極部：ガラス部＝１：１）で構成してい
る。Test piece: The glass substrate was dipped in soda glass having a glass part of 1.1 mm thickness in SiO 2 and polished, and the electrode pattern part was aluminum-deposited (0.1 Ω / cm).
2 ), 70 μm pitch (electrode part: glass part = 1: 1)
It consists of. Tape carrier package (hereinafter T
CP is abbreviated to 1/75 μm thick polyimide film.
70μ with 2oz Cu foil and tin plating
It has an m pitch (electrode portion: glass portion = 1: 1).
【００２７】圧着方法： 第１工程；実施例１，実施例３、比較例１のペースト状
の異方導電接着剤は内径０．５ｍｍのニードルをもつシ
リンジでガラス基板の電極パターン部にビード状に塗布
した。実施例２のシート状の異方導電性接着剤は、ガラ
ス基板の電極部パターン部に７０℃、３秒間の熱圧着で
剥離性フィルムから当該シートをガラス基板の電極パタ
ーン部に熱転写した。 第２工程；ガラス基板に貼着された実施例および比較例
の異方導電接着剤を２００ｍＷ／ｃｍ２ の照度で１秒
間、紫外線照射を行った。 第３工程；ＴＣＰの電極パターンと前記ガラス基板の電
極パターン同士が重なり合うようにＴＣＰを位置決めし
た後、１００℃、圧力１０００ｋＰａで２０秒間熱圧着
を行った。Crimping method: First step: The paste-like anisotropic conductive adhesive of Examples 1, 3 and Comparative Example 1 is formed in a bead shape on an electrode pattern portion of a glass substrate by a syringe having a needle having an inner diameter of 0.5 mm. Was applied. The sheet-shaped anisotropic conductive adhesive of Example 2 was thermally transferred from the peelable film to the electrode pattern portion of the glass substrate by thermocompression bonding at 70 ° C. for 3 seconds to the electrode portion pattern portion of the glass substrate. Second step: The anisotropic conductive adhesives of Examples and Comparative Examples adhered to a glass substrate were irradiated with ultraviolet rays at an illuminance of 200 mW / cm 2 for 1 second. Third step: After positioning the TCP so that the electrode pattern of the TCP and the electrode pattern of the glass substrate overlap each other, thermocompression bonding was performed at 100 ° C. and a pressure of 1000 kPa for 20 seconds.
【００２８】接続性および接続信頼性の評価：圧着後、
テストピースの隣り合う電極間の抵抗値を測定した。さ
らにテストピースを凍結吸湿サイクル（７０℃、９０％
ＲＨの条件を２時間、ついでマイナス２０℃を２時間の
計４時間を１サイクルとする）へ投入し１００サイクル
後、再度抵抗値を測定した。（単位；Ω）Evaluation of connectivity and connection reliability:
The resistance between adjacent electrodes of the test piece was measured. In addition, freeze the test piece in a freeze-drying cycle (70 ° C, 90%
RH conditions were set to 2 hours, and then minus 20 ° C. was set to 2 hours for a total of 4 hours as one cycle). After 100 cycles, the resistance was measured again. (Unit: Ω)
【００２９】剥離強度および剥離強度信頼性の評価：圧
着後、テストピースの剥離強度を（ガラス基板とＴＣＰ
間の角度が９０度）測定した。さらにテストピースを前
記とおなじ凍結吸湿サイクルへ投入し１００サイクル後
に、再度剥離強度を測定した。（単位；Ｎ／ｃｍ）Evaluation of Peeling Strength and Peeling Strength Reliability: After the pressure bonding, the peeling strength of the test piece was measured using a glass substrate and a TCP.
The angle between them was 90 degrees). Further, the test piece was put into the same freeze / moisture absorption cycle as described above, and after 100 cycles, the peel strength was measured again. (Unit: N / cm)
【００３０】上記の評価試験の結果を表１に示す。Table 1 shows the results of the above evaluation tests.
【００３１】[0031]
【表１】 [Table 1]
【００３２】硬化方法の評価試験： 実施方法１；前述の実施例３の圧着方法（第１工程、第
２工程、第３工程）と同じくする。 実施方法２；実施方法１の第１工程、第２工程は同様に
行い、第３工程を加熱圧着の９０℃、圧力１０００ｋＰ
ａで２０秒間と並行して、紫外線も２００ｍＷ／ｃｍ２
で２０秒間照射した。 比較方法１；前述の硬化実施方法１において、第２工程
を省いた。 比較方法２；前出の硬化実施方法２において、第２工程
を省いた。 これらの硬化方法によって作成されたテストピースの剥
離強度、剥離強度信頼性の結果を表２に示す。Evaluation Test of Curing Method: Implementation method 1: Same as the pressure bonding method (first step, second step, third step) of Example 3 described above. Working method 2: The first step and the second step of working method 1 are performed in the same manner, and the third step is performed by heating and pressing at 90 ° C. and pressure of 1000 kP
a for 20 seconds, the ultraviolet light is also 200 mW / cm 2
For 20 seconds. Comparative method 1: In the above-described curing method 1, the second step was omitted. Comparative method 2: In the curing method 2 described above, the second step was omitted. Table 2 shows the results of peel strength and peel strength reliability of the test pieces produced by these curing methods.
【００３３】[0033]
【表２】 [Table 2]
【００３４】[0034]
【発明の効果】異方導電接着剤で接続端子を接続する際
の近接する電子素子へのダメージおよび製造工程のライ
ンタクトを考慮すると、波長３６５ｎｍのＵＶ光で照
度：１００ｍＷ／ｃｍ２ 、接着剤層温度：１００゜Ｃ以
下、圧着圧力：１０００ｋＰａ以下、圧着時間：３０秒
以内の圧着条件で、本件発明の異方導電性接着剤は硬化
・架橋を完了する配合組成が非常に好ましい。According to the present invention, in consideration of damage to adjacent electronic elements when connecting terminals with an anisotropic conductive adhesive and line tact in a manufacturing process, the illuminance of UV light having a wavelength of 365 nm is 100 mW / cm 2 , and the adhesive is used. Under the conditions of the layer temperature: 100 ° C. or less, the compression pressure: 1000 kPa or less, and the compression time: 30 seconds or less, the anisotropic conductive adhesive of the present invention has a very preferable composition in which curing and crosslinking are completed.
【００３５】本発明の紫外線硬化性異方導電接着剤で
は、アルコキシシランを含有することによってエポキシ
樹脂化合物の硬化性が改善されて、従来の紫外線硬化型
の異方導電接着剤に比べて紫外線照射のエネルギーが少
なくても容易に硬化可能であり、後工程の加熱硬化の温
度が低くても完全硬化し、加熱と紫外線照射を併用する
ような後工程では紫外線照射の陰影部があっても全面が
硬化することが可能になる。その結果、前述の最適な硬
化条件で接続端子同士の接続が本発明の紫外線硬化型異
方導電接着剤で達成できるようになる。In the ultraviolet-curable anisotropic conductive adhesive of the present invention, the curability of the epoxy resin compound is improved by containing the alkoxysilane, so that the ultraviolet-ray-curable anisotropic conductive adhesive is irradiated with ultraviolet rays as compared with the conventional ultraviolet-curable anisotropic conductive adhesive. It can be easily cured even if the energy of the light is small, and is completely cured even if the temperature of the heat curing in the post-process is low. Can be cured. As a result, the connection between the connection terminals can be achieved with the ultraviolet-curable anisotropic conductive adhesive of the present invention under the above-mentioned optimum curing conditions.
【００３６】また、本発明の透明基板の接続方法は、他
方の接続端子を透明基板上の接続端子と対向するように
所定の位置に配置して紫外線硬化性異方導電接着剤を完
全硬化させる第３工程の前に、紫外線硬化性異方導電接
着剤の成分中のエポキシ樹脂化合物は未硬化状態を維持
しているが、同じく成分中の光活性オニウム塩は活性化
してカチオン種を生成するだけエネルギー量の紫外線を
この異方導電接着剤に照射する第２工程を設定する。こ
の第２工程により、光活性オニウム塩からカチオン種を
生成して本発明の紫外線硬化型異方導電性接着剤はリビ
ング重合するようになる。この結果、第３工程の硬化条
件を前述の最適条件にすることが可能となる。In the method for connecting a transparent substrate according to the present invention, the other connection terminal is disposed at a predetermined position so as to face the connection terminal on the transparent substrate, and the ultraviolet-curable anisotropic conductive adhesive is completely cured. Before the third step, the epoxy resin compound in the component of the UV-curable anisotropic conductive adhesive maintains an uncured state, but the photoactive onium salt in the component is also activated to generate a cationic species. A second step of irradiating this anisotropic conductive adhesive with ultraviolet rays having an energy amount only is set. By the second step, a cationic species is generated from the photoactive onium salt, and the ultraviolet-curable anisotropic conductive adhesive of the present invention undergoes living polymerization. As a result, it is possible to set the curing conditions in the third step to the above-described optimum conditions.
【００３７】この硬化条件では、透明基板またはＴＣＰ
を耐熱性の高いガラスやポリイミドを使用しなくても、
ポリエステル樹脂（ＰＥＴ樹脂を含む）、ポリサルファ
イト樹脂などの軽量で柔軟な樹脂に代えて使用すること
も可能となる。Under these curing conditions, a transparent substrate or TCP
Even without using heat-resistant glass or polyimide,
It can be used in place of lightweight and flexible resin such as polyester resin (including PET resin) and polysulfite resin.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｊ 11/04 Ｃ０９Ｊ 11/04 Ｈ０１Ｌ 21/60 ３１１ Ｈ０１Ｌ 21/60 ３１１Ｓ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C09J 11/04 C09J 11/04 H01L 21/60 311 H01L 21/60 311S
Claims (7)
も２つ以上含むエポキシ樹脂化合物と、ｂ）光活性オニ
ウム塩と、ｃ）導電性微粒子と、ｄ）アルコキシシラン
化合物を少なくとも必須成分とするペースト状もしくは
シート状の紫外線硬化性異方導電接着剤。1. At least essential components are a) an epoxy resin compound containing at least two glycidyl groups in one molecule, b) a photoactive onium salt, c) conductive fine particles, and d) an alkoxysilane compound. Paste or sheet UV curable anisotropic conductive adhesive.
キシシランであることを特徴とする請求項１に記載の紫
外線硬化性異方導電性接着剤。2. The ultraviolet-curable anisotropic conductive adhesive according to claim 1, wherein the alkoxysilane is an epoxyalkoxysilane.
板または電子素子の接続端子との接続において、請求項
１に記載の紫外線硬化性異方導電接着剤を一方の接続端
子に貼着する第１工程と、当該異方導電接着剤の成分中
のエポキシ樹脂化合物は未硬化状態を維持しているが同
じく成分中の光活性オニウム塩は活性化してカチオン種
を生成するだけのエネルギー量の紫外線をこの紫外線硬
化性異方導電性接着剤に照射する第２工程と、他方の接
続端子を前記一方の接続端子と対向するように所定の位
置に配置して、当該硬化性異方導電接着剤を完全硬化さ
せるために熱圧着する第３工程からなる透明基板の接続
方法。3. In connecting the connection terminal of the transparent substrate and the connection terminal of the substrate or the electronic element facing the connection terminal, the ultraviolet-curable anisotropic conductive adhesive according to claim 1 is attached to one of the connection terminals. In the first step, the epoxy resin compound in the component of the anisotropic conductive adhesive maintains an uncured state, but the photoactive onium salt in the component also has an energy amount sufficient to activate and generate a cationic species. A second step of irradiating ultraviolet rays to the ultraviolet-curable anisotropic conductive adhesive, and arranging the other connection terminal at a predetermined position so as to face the one connection terminal; A method for connecting a transparent substrate, comprising a third step of thermocompression bonding to completely cure the agent.
電接着剤を完全硬化させるための熱圧着と同時に、さら
に透明基板を透して紫外線照射も併行して行うことを特
徴とする請求項３の接続方法。4. The method according to claim 3, wherein the third step is performed simultaneously with thermocompression bonding for completely curing the ultraviolet-curable anisotropic conductive adhesive, and simultaneously with ultraviolet irradiation through a transparent substrate. The connection method according to claim 3.
も２つ以上含むエポキシ樹脂化合物と、ｂ）光活性オニ
ウム塩と、ｃ）導電性微粒子と、ｄ）アルコキシシラン
化合物、ｅ）１分子中にラジカル重合性の官能基を少な
くとも１つ以上含むラジカル重合性樹脂化合物と、ｆ）
ラジカル重合開始剤とを必須成分とするペースト状もし
くはシート状の紫外線硬化性異方導電接着剤。5. A) an epoxy resin compound containing at least two glycidyl groups in one molecule, b) a photoactive onium salt, c) conductive fine particles, d) an alkoxysilane compound, and e) a single molecule. A radical polymerizable resin compound containing at least one or more radical polymerizable functional groups, and f)
A paste- or sheet-shaped ultraviolet-curable anisotropic conductive adhesive containing a radical polymerization initiator as an essential component.
板または電子素子の接続端子との接続において、請求項
５に記載の紫外線硬化性異方導電接着剤を一方の接続端
子に貼着する第１工程と、当該異方導電接着剤の成分中
のエポキシ樹脂化合物は未硬化状態を維持しているが同
じく成分中の光活性オニウム塩は活性化してカチオン種
を生成するだけのエネルギー量の紫外線をこの紫外線硬
化性異方導電性接着剤に照射する第２工程と、他方の接
続端子を前記一方の接続端子と対向するように所定の位
置に配置して、前記紫外線硬化性異方導電接着剤を完全
硬化させるために熱圧着する第３工程からなる透明基板
の接続方法。6. The ultraviolet curable anisotropic conductive adhesive according to claim 5, which is attached to one of the connection terminals in connection between the connection terminal of the transparent substrate and the connection terminal of the substrate or the electronic element facing the connection terminal. In the first step, the epoxy resin compound in the component of the anisotropic conductive adhesive maintains an uncured state, but the photoactive onium salt in the component also has an energy amount sufficient to activate and generate a cationic species. A second step of irradiating ultraviolet rays to the ultraviolet-curable anisotropic conductive adhesive; and arranging the other connection terminal at a predetermined position so as to face the one connection terminal, A method for connecting a transparent substrate, comprising a third step of thermocompression bonding to completely cure the adhesive.
電接着剤を完全硬化させるための熱圧着と同時に、さら
に透明基板を透して紫外線照射も併行して行うことを特
徴とする請求項６の接続方法。7. The method according to claim 7, wherein the third step is performed simultaneously with thermocompression bonding for completely curing the ultraviolet-curable anisotropic conductive adhesive, and simultaneously with ultraviolet irradiation through a transparent substrate. The connection method according to claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11138495A JP2000169821A (en) | 1998-09-30 | 1999-05-19 | Ultraviolet light-curable anisotropic conductive adhesive |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-276297 | 1998-09-30 | ||
| JP27629798 | 1998-09-30 | ||
| JP11138495A JP2000169821A (en) | 1998-09-30 | 1999-05-19 | Ultraviolet light-curable anisotropic conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000169821A true JP2000169821A (en) | 2000-06-20 |
Family
ID=26471504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11138495A Pending JP2000169821A (en) | 1998-09-30 | 1999-05-19 | Ultraviolet light-curable anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000169821A (en) |
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