WO2008130173A1 - Plateau ventouse pour boîtier de semi-conducteur - Google Patents

Plateau ventouse pour boîtier de semi-conducteur Download PDF

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Publication number
WO2008130173A1
WO2008130173A1 PCT/KR2008/002248 KR2008002248W WO2008130173A1 WO 2008130173 A1 WO2008130173 A1 WO 2008130173A1 KR 2008002248 W KR2008002248 W KR 2008002248W WO 2008130173 A1 WO2008130173 A1 WO 2008130173A1
Authority
WO
WIPO (PCT)
Prior art keywords
flange
suction pad
suction
semiconductor package
pad
Prior art date
Application number
PCT/KR2008/002248
Other languages
English (en)
Inventor
Kwang Yeol Lee
Young Min Yoon
Yong Koo Lee
Original Assignee
Hanmisemiconductor Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmisemiconductor Co., Ltd filed Critical Hanmisemiconductor Co., Ltd
Publication of WO2008130173A1 publication Critical patent/WO2008130173A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Definitions

  • the present invention relates to a semiconductor package handling device, and more particularly, to a suction pad.
  • the present invention is suitable for a wide scope of applications, it is particularly suitable for sucking and holding a semiconductor package more efficiently.
  • a semiconductor package includes a semiconductor chip on which a highly integrated circuit having transistors and capacitors is formed on a substrate. And, a lead frame connected to the semiconductor chip is provided to the semiconductor package.
  • the above-configured semiconductor package is mounted and aligned on a chuck table and then transferred to a sawing device to undergo a singulating process for individual cutting and separation.
  • the semiconductor package handling device checks processed states of a plurality of semiconductor packages and then sorts the semiconductor packages.
  • the semiconductor package handling device transfers the semiconductor package to process, check or sort the corresponding semiconductor package.
  • a vacuum suction picker is mainly used as a device for transferring the semiconductor package.
  • a pad is attached to an end portion of the vacuum suction picker to facilitate suction & holding of the semiconductor package.
  • the pad needs to be replaced by a new pad matching a shape of a semiconductor package each time a semiconductor package size or type is changed. So, a working process for sucking and holding a semiconductor package gets complicated.
  • a related art suction pad is formed of hard rubber.
  • a thickness of a fringe part for sealing a suction space corresponds to 0.3 ⁇ 0.5mm and it length corresponds to 0.5-0.8mm.
  • the related art suction pad barely has flexibility and is relatively hard.
  • the present invention is directed to an suction pad for a semiconductor package that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
  • An object of the present invention is to provide a suction pad, by which a semiconductor package having a protruding surface can be efficiently sucked and held.
  • Another object of the present invention is to provide a suction pad, which is available regardless of a pattern of a contact terminal of a semiconductor package.
  • a suction pad in a semiconductor package handling device includes a body having an air suction hole and at least one soft sealing member configured to be flexibly deformed according to a surface contour of a suction target, the at least one soft sealing member sealing a suction space communicating with the air suction hole.
  • the sealing member includes a flange placed on a lower portion of the body.
  • the flange forms the suction space by being flexibly deformed and then performs sealing.
  • the flange is formed of a soft material to be flexibly deformed. Hence, it is able to secure the suction space sufficient for vacuum suction without being affected by the surface contour of the suction target.
  • the flange can be formed of silicon. And, the silicon can provide sufficient flexibility.
  • the flange and the body are formed in one body to configure a single piece.
  • the body and the flange can be formed of different materials, respectively or bonded together by an adhesive agent.
  • the flange may be configured to gradually decrease in thickness from a root of the flange toward an end portion of the flange. Hence, it is able to secure sufficient flexibility at the end portion. If the end portion is sufficiently flexible, the flange can be flexibly deformed according to a package surface contour and deformed to enclose the suction space well. Hence, it is able to raise suction efficiency.
  • At least one portion of an inner side of the flange is configured to incline in an external direction of the flange.
  • the inner side of the flange can be configured to incline in a manner that a cross-section area of the suction space gradually increases toward the end portion of the flange.
  • an outer side of the flange includes a vertical face and an incline face inclining in an external direction.
  • the incline face provides flexibility in sucking the suction target to secure the suction space sufficiently.
  • the vertical face provides a restoring force in unloading the suction target on a destination, thereby helping the suction target fall quickly.
  • the cross-sectional shape of the flange can be provided in one of various patterns.
  • the flange has a circular or polygonal cross-section.
  • the flange includes at least two flanges overlapped with each other by being evenly spaced from each other.
  • the at least two flanges can include an inner flange and an outer flange provided to an outer circumference of the inner flange.
  • the multiple flanges can raise suction efficiency by sealing the suction space more air-tightly.
  • the inner flange can be configured less flexible than the outer flange.
  • the inner flange can be configured thicker or shorter than the outer flange.
  • an outer side of the inner flange can be configured vertical.
  • the inner flange can be configured to secure sufficient flexibility at its end portion.
  • the end portion of the inner flange can be configured equal or similar to that of the outer flange in thickness.
  • a vacuum remaining pressure may remain between the inner flange and the outer flange. This remaining pressure may hinder a package from being freely separated from the suction pad. So, the remaining pressure prevents the quick separation of the package when the package is unloaded on a destination.
  • the package When the package is dropped on the destination by releasing the vacuum state, the package is preferably dropped in a horizontal direction. Otherwise, a position of the package is distorted or the package may be turned upside down. Yet, the remaining pressure hinders the package from falling horizontally. In this case, the inner flange applies the restoring force to the package to help the package fall horizontally by being quickly and evenly separated from the suction pad.
  • a stopper can be further included.
  • the stopper prevents a package from being excessively sucked and held by the suction pad. If the package excessively adheres closely to the suction pad, sticking may take place to interrupt a quick transfer work of package. Hence, the stopper prevents the sticking .
  • a suction pad in a semiconductor package handling device includes a body having a plurality of air suction holes, the body configured in a single piece and a plurality of soft sealing plates configured to be flexibly deformed according to a surface contour of a suction target, a plurality of the soft sealing plates configured to seal suction spaces communicating with a plurality of the air suction holes, respectively.
  • the suction pad can be assembled to the semiconductor package handling device in one body, thereby facilitating and a quick work.
  • the suction pad includes a sealing plate attached to the body as a sealing member.
  • the body can include a protruding part touched to a surface of the suction target to prevent the suction target from being distorted in performing suction.
  • the body can be provided with a recess to which the sealing plate is mounted and attached therein. And, a sidewall of the recess can be configured to lay a role as the protruding part.
  • a suction pad in a semiconductor package handling device includes a plurality of bodies having a plurality of air suction holes, respectively and a plurality of soft flanges provided to a plurality of the bodies, respectively, a plurality of the soft flanges configured to be flexibly deformed according to a surface contour of a suction target, a plurality of the soft flanges configured to seal a plurality of suction spaces communicating with a plurality of the air suction holes, respectively, wherein a plurality of the bodies and a plurality of the soft flanges are formed in one body.
  • a suction pad according to the present invention is applicable to various semiconductor package handling devices capable of sucking and holding a package such as off-loading pickers, unit pickers, turntable pickers, chuck tables, turntables (sawing process) and the like.
  • a suction pad according to the present invention which breaks a related art fixed idea that a suction pad sucks and holds a semiconductor package in a manner of being contacted with a fringe part of a semiconductor package by avoiding a contact terminal thereon, is attributed to the fresh and remarkable concept and can be named Lee pad in accordance with the last name of the inventor.
  • a suction pad according to the present invention is freely deformed according to a surface contour of a semiconductor package to suck and hold, thereby facilitating an uneven surface of the semiconductor package such as a ball grid array package, a board-on-chip and the like.
  • FIG. 1 is an exploded perspective diagram for major configuration of a semiconductor package handling device before being sucked and held using a suction pad according to one embodiment of the present invention
  • FIG. 2 is a perspective diagram for depicting a state right before a semiconductor package is sucked and held using a suction pad
  • FIG. 3 is a cross-sectional diagram corresponding to FIG. 2;
  • FIG. 4 is a perspective diagram of a suction pad pressed on a semiconductor package to suck and hold
  • FIG. 5 is a cross-sectional diagram corresponding to FIG. 4;
  • FIG. 6 is a cross-sectional diagram of a sucked and held semiconductor package before transfer
  • FIG. 7 is a perspective diagram of a suction pad according to another embodiment of the present invention.
  • FIG. 8 is a cross-sectional diagram corresponding to FIG. 7;
  • FIG. 9 is a perspective diagram of a suction pad according to another embodiment of the present invention.
  • FIG. 10 is a cross-sectional diagram corresponding to FIG. 9;
  • FIG. 11 is a perspective diagram of a suction pad according to another embodiment of the present invention.
  • FIG. 12 is a cross-sectional diagram corresponding to FIG. 11;
  • FIGs. 13 to 15 are perspective diagrams of suction pads according to other embodiments of the present invention.
  • FIG. 16 and FIG. 17 are perspective diagrams of suction pads according to other embodiments of the present invention.
  • FIG. 18 is a cross-sectional diagram corresponding to FIG. 17;
  • FIG. 19 and FIG. 20 are diagrams of a suction pad according to another embodiment of the present invention.
  • FIGs. 20 to 23 are diagrams of a suction pad according to another embodiment of the present invention.
  • FIGs. 23 to 26 are diagrams of a suction pad according to another embodiment of the present invention;
  • FIG. 27 is a diagram to depict a state in using a semiconductor package handling apparatus according to the present invention.
  • FIG. 28 is a perspective diagram to depict a state in sucking and holding a board- on-chip (BOC) package 5 using a suction pad;
  • FIG. 29 and FIG. 30 are diagrams of a suction pad according to another embodiment of the present invention; [63] FIG.
  • FIG. 31 is a cross-sectional diagram to depict a state before a semiconductor package sucking apparatus according to the present invention sucks a semiconductor package mounted on a chuck table;
  • FIG. 32 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention sucks and holds a semiconductor package;
  • FIG. 33 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention carries a semiconductor package sucked and held;
  • FIG. 34 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention places a semiconductor package in a drying block; [67] FIG.
  • FIG. 35 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention completes a transfer of a semiconductor package;
  • FIGs. 37 to 39 are cross-sectional diagrams to depict a state that a suction pad according to one embodiment of the present invention is being used;
  • FIG. 40 is a cross-sectional diagram of a semiconductor package sucking apparatus according to another embodiment of the present invention;
  • FIGs. 41 to 43 are cross-sectional diagrams of a suction pad and a semiconductor package handling apparatus according to another embodiment of the present invention;
  • FIG. 44 is a cross-sectional diagram of a suction pad and a semiconductor package handling apparatus according to a further embodiment of the present invention; and
  • FIG. 45 is a diagram of a semiconductor package handling apparatus according to another further embodiment of the present invention. Mode for the Invention
  • FIGs. 1 to 6 A suction pad according to one embodiment of the present invention and a semiconductor package handling apparatus for sucking and holding a semiconductor package using the same are explained with reference to FIGs. 1 to 6 as follows.
  • a semiconductor package handling apparatus includes a picker holder 10 connected to an external air suction device to suck and hold a semiconductor package 1 and a suction pad 100 provided to an end portion of the picker holder 10.
  • the semiconductor package 1 includes a semiconductor package provided with a plurality of contact terminals projected from one side of the semiconductor package.
  • the semiconductor package 1 includes a ball grid array (BGA) package belonging to a large-scale integrated circuit (LSI) package.
  • BGA ball grid array
  • LSI large-scale integrated circuit
  • a plurality of semi- spherical contact terminals are arranged in 2-dimensional array on a printed circuit board (PCB) having a bare chip loaded thereon to replace leads.
  • PCB printed circuit board
  • the suction pad 100 sucks and holds a surface of the ball grid array package on which ball-contact terminals formed.
  • the reason why the surface, on which the ball-contact terminals are formed, is sucked and held is mainly to reduce damage caused by interference between the contact terminals and a tray accommodating the semiconductor package therein in a manner that the ball-contact terminals of the sucked semiconductor package is accommodated to face upward.
  • the picker holder 10 is installed to be movable vertically or horizontally by a transfer device provided to the semiconductor package handling apparatus.
  • a head part 11 of the picker holder 10, at which the suction pad 100 is installed, has a shape corresponding to the suction pad 100.
  • the suction pad 100 includes a body 110 having a cavity formed therein and a flange
  • the body 110 as shown in FIG. 3, has a shape similar to that of a square pillar in which square cavity is formed. And, an interior of the body 110 corresponds to an exterior of the picker holder 10, i.e., an exterior of the picker head.
  • a separation preventing part 150 is provided to the interior of the body
  • the separation preventing part 150 holds the exterior of the picker holder 10 to prevent the separation.
  • the separation preventing part 150 can have a projection shape corresponding to a recess provided to the head par 11 of the picker holder 10.
  • the separation preventing part 150 can have nay shape, e.g., a recess shape, as long as corresponding to the exterior of the picker holder 10.
  • the flange 120 adheres closely to a surface of the semiconductor package by being freely deformed according to a surface contour of the sucked semiconductor package.
  • the body 110 can further include a partition part 130 having an air suction hole 131 formed therein.
  • the body 110 can further include an incline part 140 having a prescribed angle of inclination from its portion connected to the flange 120 in a direction of the flange 120.
  • a shock absorbing projection 133 is provided neighbor to the air suction hole 131 to absorb shock applied to the semiconductor package by the picker holder in sucking and holding a suction target object, i.e., the semiconductor package.
  • a perforated hole 132 which becomes a moving path of a pressurizing member (not shown in the drawings) for applying a specific force to the semiconductor package in removing the sucked and held object, i.e., in placing the sucked and held semiconductor package on an accommodating tray, is provided to the partition part 130.
  • the perforated hole 132 is provided to a center of the partition part 130.
  • the pressurizing member is able to evenly apply a force to the semiconductor package if possible in pressurizing the semiconductor package.
  • the air suction holes 131 can be arranged symmetric centering on the perforated hole 132.
  • the flange 120 forms a suction space (S) with the semiconductor package in-between and is freely deformed according to a surface contour of the sucked semiconductor package.
  • the flange 120 is attached to the surface of the semiconductor package with an irregular deformation rate.
  • the flange 120 may be irregularly deformed in a direction tangential to the surface as well as in a direction of a normal to the surface of the semiconductor package.
  • the flange 120 is able to adhere closely to the surface of the ball type contact terminal and the surface of the semiconductor package having the ball type contact terminal formed thereon in a manner of enclosing at least a portion of the ball type contact terminal projected from the semiconductor package surface.
  • the flange 120 as shown in FIG. 1 and FIG. 3, can be formed to have thickness tending to decrease top to bottom. As the thickness of the flange 120 is reduced toward bottom from top, a lower part of the flange 120 can be freely deformed along the surface of the semiconductor package and durability of an upper portion of the flange having the most severe bending deformation can be enhanced.
  • the flange extends thick in a straight line, durability may be raised. Yet, the flange relatively has difficulty in being deformed along the surface of the semiconductor package. If the flange extends thin in a straight line, it is able to be freely deformed along the surface of the semiconductor package. Yet, durability thereof may be degraded.
  • the thickness of the flange 120 and more particularly, a lower potion thickness of the flange 120 has a range between 0.1 ⁇ 0.5mm.
  • the lower potion thickness of the flange 120 may be about 0.2mm.
  • the upper and lower portion thickness of the flange 120 may have a predetermined ratio in-between. For instance, if the lower portion thickness of the flange 120 is 0.2mm, it is able to design the upper portion thickness of the flange 120 to have 0.3 ⁇ 0.8mm. And, a length of the flange 120 may be 0.7- 1.0mm.
  • the flange 120 can be flexibly deformed by preventing air from leaking from the suction space in sucking the semiconductor package.
  • the flange 120 is formed of the material containing silicon, carbon and hardening substance. And, configuration ratio between the silicon, carbon and hardening substance can be set to 7:5:1.
  • the flange 120 can contain silicon and carbon mixed together by about
  • the hardening substance may include hydroperoxide hardening substance.
  • the flange 120 has 50 ⁇ 40Hs rigidity with reference to shore hardness.
  • the shore hardness means the hardness resulting from a bounced height when a hammer is dropped at a predetermined height on a test material.
  • the suction pad 100 is formed of electrically non-conductive material. And, the body and flange provided to the suction pad 100 are formed in one body by injection molding.
  • the flange 120 includes a vertical flange 121 vertically projected from an outer side of the flange and an incline flange 13 extending from the vertical flange 121 in a manner that the outer side of the flange inclines in an external direction of the flange. And, at least a portion of an inner side of the incline flange 123 is formed to incline in the external direction of the flange.
  • an inner side of the vertical flange 121 is formed to incline toward an outside of the flange and an outer side of the vertical flange 121 is formed to extend vertically from the partition part 130.
  • both of the inner and outer sides of the incline flange 123 are formed to incline toward outside of the flange.
  • the flange has a shape widened outwardly and the vertical flange 121 is relatively thicker than the incline flange 123.
  • the incline flange 123 forming a tip of the flange 120 is freely deformed according to a shape of the contact terminal, i.e., a shape of ball.
  • the incline flange 123 of the flange 120 comes into contact with at least one ball contact terminal and then sucks and holds a surface where the contact terminal is formed.
  • FIG. 2 and FIG. 3 are diagrams for depicting a state right before a semiconductor package is sucked and held using a suction pad
  • FIG. 4 and FIG. 5 are diagrams of a suction pad pressed on a semiconductor package to suck and hold
  • FIG. 6 is a diagram of a sucked and held semiconductor package right before transfer.
  • FIGs. 2 to 6 A process for sucking and holding a semiconductor package in a semiconductor package handling apparatus according to the present invention is explained with reference to FIGs. 2 to 6 as follows.
  • a thickness of the shock absorbing projection 133 provided to the suction pad 100 is set to tl.
  • the flange 120 provided to a lower body of the suction pad 100 maintains an original shape in injection molding.
  • the picker holder 10 moves downward to suck and hold the semiconductor package, it temporarily presses the suction pad that is flexible. Simultaneously, the head part 11 of the picker holder 10 pressurizes the shock absorbing projection 133. The shock absorbing projection is then contracted by a pressing force applied by head part 11. When the picker holder 10 pressurizes the suction pad 100 to suck and hold the semiconductor package, a thickness of the shock absorbing projection 133 becomes t2.
  • the shock absorbing projection 133 is deformed by tl-t2 to instantly absorb the shock applied to the semiconductor package by the picker holder 10, thereby protecting the semiconductor package. [112] Thereafter, referring to FIG. 6, the thickness of the shock absorbing projection 133 returns to the original thickness tl and the incline flange 123 sucks and holds ball contact terminals or a surface of the semiconductor package having the ball contact terminals formed thereon.
  • an air suctioning device sucks air between the suction pad and the semiconductor package via an air passage provided within the picker holder.
  • FIG. 7 and FIG. 8 A suction pad according to another embodiment of the present invention is explained with reference to FIG. 7 and FIG. 8 as follows.
  • a suction pad according to another embodiment of the present invention includes a body 210 and a flange 220 connected to the body 210, like the former embodiments. And, the body 210 includes a partition part 230.
  • the partition part 230 is provided with an air suction hole 231, a perforated hole 232, and a shock absorbing projection 233.
  • Their details are substantially identical to those of the former embodiment and omitted in the following description.
  • the flange 220 is configured to vertically extend downward. In this case, the flange 220 extends to a lower portion of the partition part 230 with a predetermined thickness.
  • a thickness of a flange 320 projected from a lower side of a body tends to decrease downward.
  • an outer side of the flange 320 is configured to extend from a partition part 330 vertically and downwardly and an inner side of the flange 320 tends to incline downward in an external direction of the flange 320.
  • the flange 320 extends downward by gradually decreasing in thickness while a cross-section of a suction space S tends to gradually increase downward.
  • An upper end of the flange 320 i.e., the flange extending from the partition part 330 is formed relatively thick. This is to enhance durability of the flange for a predetermined period even if a lower end of the flange is damaged by abrasion.
  • thickness of a flange 420 is irregular and an outer side of the flange 420 inclines in a direction of a suction space S formed by the flange 420 overall.
  • the flange 420 is configured to shrink in the direction of the suction space S.
  • the flange 420 includes a vertical flange 421 extending from a rim of a partition part 430 vertically and downwardly and an incline flange 423 having a prescribed angle of inclination against the vertical flange 421.
  • an inner side of the vertical flange 421 is configured to vertically extend in a direction of a lower part of the partition part 430 while an inner side of the incline flange 423 is configured to incline in the direction of the suction space S.
  • a suction pad 500 shown in Fig. 13 includes a cylindrical body 510 having a cavity inside. And, the body 510 includes a partition part 530. Moreover, a flange 520 forms a suction space S with an object to suck and hold in-between and is configured to seal the suction space S.
  • the flange 520 is configured to be projected from the partition part 530 vertically and downwardly and freely deformed according to a surface contour of the object.
  • the flange 520 is able to adhere closely to a surface of a ball type contact terminal and a surface of a semiconductor package, on which the ball type contact terminal is formed, while enclosing at least one portion of the ball type contact terminal projected from the object, i.e., the surface of the semiconductor package.
  • the partition part 530 is provided with an air suction hole 531. And, the partition part 530 is provided with a perforated hole 532 that plays a role as a moving path of a pressurizing member to removing a semiconductor package sucked and held by the suction pad 500.
  • the partition part 530 is provided with a sock absorbing projection 533 neighboring to the air suction hole 531 to absorb shock applied to a semiconductor package by a picker holder in sucking and holding the semiconductor package. Its details are identical to those of the former embodiments and omitted in the following description.
  • a suction pad shown in FIG. 14/15 includes a cylindrical body 610/710 and a flange 620/720 configured to have a circular ring shape.
  • the flange 620 of the suction pad shown in FIG. 14 is configured to incline in an external direction of the flange.
  • the flange 720 shown in FIG. 15 is configured to incline a direction of a suction space S.
  • the flange 620 of the suction pad shown in FIG. 14 is configured to be widened in the external direction of the flange, while the flange 720 of the suction pad shown in FIG. 15 is configured to shrink in the direction of the suction space S.
  • the suction pad shown in FIG. 14 is configured to correspond to the former suction pad shown in FIG. 3 or FIG. 5, while the suction pad shown in FIG. 15 is configured to correspond to the former suction pad shown in FIG. 11 or FIG. 12.
  • the suction pad shown in FIG. 14/15 has the flange configured to have the circular ring type flange, while each of the suction pad shown in FIG. 3/5 and the suction pad shown in FIG. 11/12 has the flange configured to have the square ring type flange.
  • the present invention is not limited to the above-mentioned embodiments.
  • the flange can have one of various polygonal cross-sections including a square cross-section as well as a circular cross-section.
  • FIG. 16 and FIG. 17 are perspective diagrams of suction pads according to other embodiments of the present invention.
  • a suction pad according to an embodiment of the present invention includes a body 810/910 having a partition part 830/930 and a flange 820/920 forming a suction space S with an object to be sucked and held in-between.
  • the partition part 830 as shown in FIG. 16, is provided with an air suction hole 831, a perforated hole 832, and a shock absorbing projection 833. Their details are substantially identical to those of the former embodiments and omitted in the following description.
  • each of the suction pads according to the present embodiment has a plurality of flanges, which is different from the former embodiments.
  • a plurality of the flanges as shown in FIG. 16, are configured to be overlapped with each other by being evenly spaced apart from each other.
  • a plurality of the flanges 821 and 825 shown in FIG. 16 are configured to extend from the partition part 830 vertically and downwardly.
  • a pair of the overlapped flanges 921 and 925 shown in FIG. 17 are configured to incline in an external direction of the flanges by being projected from a rim of the partition part 930.
  • the first flange 821/921 and the second flange 825/925 form a first suction space Sl and a second suction space S2 with an object to be sucked and held, i.e., a semiconductor package in-between.
  • the second suction space S2 is provided to be prepared for a case that the first suction space Sl fails to be completely sealed. In case that air leaks from the space failing to be completely sealed by the first flange, the second flange forms an airtight suction space to facilitate the semiconductor package to be sucked and held.
  • a plurality of the flanges can have projected lengths differing from each other.
  • a length of the first flange 921 is designed to be set to 0.5 ⁇ 0.8mm and a length of the second flange 925 is designed to be set to 0.8- 1.0mm.
  • a length difference between the first and second flanges 921 and 925 can be 0.2 ⁇ 0.5mm.
  • a plurality of the flanges are installed by being evenly spaced apart from each other, whereby each individual and independent suction space can be formed between the flanges and an object to be sucked and held.
  • a first air suction hole 831 for sucking air of the first suction space Sl and a second air suction hole (not shown in the drawing) for sucking air of the second suction space S2 can be individually provided to the partition part.
  • FIG. 19 and FIG. 20 are diagrams of a suction pad for a semiconductor package handling apparatus according to another embodiment of the present invention.
  • a suction pad according to the present embodiment includes a plate type sealing member configured separate from a body 1010.
  • a suction pad 1000 according to the present embodiment includes a body 1010 having a cavity therein and a sealing plate 1020 attached to the body 1010.
  • the body 1010 includes a partition part 1130 having a plurality holes. And, the sealing plate 1020 is attached to the bottom of the partition part 1130.
  • the sealing plate 1020 is formed of a material different from that of the body 1010 and can be attached to the bottom of the partition part 1130.
  • the body 1010 is formed of a hard material
  • the sealing plate 1020 can be formed of one of ultra- fine cloth, cotton flannel, jelly type fabric, soft silicon, etc.
  • the sealing plate 102 can be formed of a material such as an adhesive tape formed of polyurethane by the company "SK utis".
  • the company sells the material in a form of roll type polyerethane foam and in a product name of "eSORBA SRP series”.
  • the sealing plate 102 is formed of polyurethane foam, its durability can be enhanced much better than that of other material. If the sealing plate 1020 is repeatedly used, it may be broken due to the damage caused by fatigue. Yet, since the polyurethane sealing plate is resistant against the fatigue damage attributed to the repetitive use, its durability can be considerably extended.
  • the sealing plate 1020 formed of one of the above materials is freely deformed according to a surface contour of a semiconductor package to be sucked and held.
  • the body can be formed of the same material of the suction pad according to one of the above-explained embodiments.
  • FIGs. 21 to 23 are diagrams of a suction pad according to another embodiment of the present invention, which is similar to the former suction pad shown in FIG. 19 and FIG. 20.
  • a suction pad 1100 includes a body 1110 and a sealing pate 1120 attached to the body 1110.
  • the sealing plate 1120 can be formed of such a material as polyurethame and the like.
  • FIG. 23 shows that a semiconductor package is picked using the suction pad 1100.
  • the sealing plate 1120 In picking up the semiconductor package, the sealing plate 1120, as shown in FIG. 23, achieves sealing for vacuum suction by covering contact terminals projected from a surface of a semiconductor package.
  • the sealing plate 1120 can be formed of any kind of material capable of being freely deformed enough to achieve the sealing by covering the contact terminals as well as polyurethame foam or the like.
  • FIGs. 24 to 26 are diagrams of a suction pad 1200 according to another embodiment of the present invention, which is similar to the embodiments shown in FIGs. 19 to 23. Yet, in the present embodiment, a protruding part 1211 is provided to a body 1210. The protruding part 1211 prevents a package 1 from being distorted by being touched to a surface of the package 1 in sucking and holding the package 1. In FIG. 26, the protruding part 1211 is formed to be touched to an edge potion of the semiconductor package 1. In this case, the protruding part 1211 can be configured higher than a contact terminal of ht e package 1.
  • the protruding part 1211 plays a role as a stopper to inhibit a package from excessively adhering closely to the suction pad. If the package 1 excessively adheres closely to the suction pad, the contact terminal of the package may be pressed and damaged. And, the package may have difficulty in being quickly unloaded.
  • FIG. 27 A semiconductor package handling apparatus having a suction pad according to one embodiment of the present invention is explained with reference to FIG. 27 as follows.
  • a semiconductor package handling apparatus includes a picker holder 10 connected to an external air sucking device to suck and hold a semiconductor package, a suction pad 100 provided to an end portion of the picker holder 10, and a test device 30 for testing a processed state of the semiconductor package.
  • the semiconductor package handling apparatus can include a reflective member 50 provided onto the suction pad 100 to enable the test device 30 to correctly recognize image information on the semiconductor package.
  • the test device 30 includes a photographing device capable of photo- graphing an image of a bottom of the semiconductor package 1.
  • the photographing device includes a general camera, a CCD camera or the like.
  • the reflective member 50 plays a role in configuring a background image of the semiconductor package 1 in photographing image information on the bottom of the semiconductor package 1. So, in viewing from the test device, a cross-section of the reflective member 50 should be greater than that of the suction pad 100. And, the reflective member 50 can be formed of any material such as metal, plastic and the like.
  • Color of the reflective member 50 is selected to be discriminated from that of the bottom of the semiconductor package. This is to discriminate the reflective member 50 from the semiconductor package on the image photographed by the test device.
  • the reflective member 50 can have the color different from the bottom color of the semiconductor package such a white, yellow and the like.
  • FIG. 28 is a perspective diagram to depict a state in sucking and holding a board- on-chip (BOC) package 5 using a suction pad.
  • BOC board- on-chip
  • FIG. 29 and FIG. 30 are diagrams of a suction pad according to another embodiment of the present invention, in which a plurality of flanges are provided to the suction pad like the former suction pad shown in FIG. 16.
  • a suction pad includes a body 1510 having a partition part 1530 and a plurality of flanges 1521 and 1525.
  • the flange has a dual flange structure.
  • This dual flange includes an outer flange 1525 and an inner flange 1521 overlapped with the outer flange 1525 by being evenly spaced apart from the outer flange 1525.
  • the inner flange 1521 differs from the outer flange 1525 in height. In the suction pad shown in FIG. 29, a height of the inner flange 1521 is smaller than that of the outer flange 1525.
  • An inner side of the outer flange 1525 can be configured to be gradually widened downward. Namely, it can be tapered.
  • an outer side of the outer flange 1525 is tapered as well.
  • the outer flange 1525 can have one of the same configurations of the flanges of the suction pads shown in FIGs. 1 to 15.
  • the inner flange 1521 is provided within the outer flange 1525 and formed smaller than the outer flange 1525 in height.
  • An inner side 1521a of the inner flange 1521 is configured to taper and an outer side 1521b thereof can be configured vertical. And, a root side of the outer flange 1525 can be formed thicker than the outer flange 1525 at least.
  • a remaining vacuum pressure may remain between the inner flange 1521 and the outer flange 1525 to hinder a package from being unloaded.
  • the inner flange 1521 is formed lower than the outer flange 1525, it is able to reduce the influence of the remaining vacuum pressure.
  • the inner flange 1521 is effective in achieving a quick package transfer work by pushing a package with its restoring force in unloading the package.
  • the outer side 1521b of the inner flange 1521 to be vertical and by forming the inner flange 1521 thicker than the outer flange 1525, it is able to secure the restoring force sufficiently.
  • the package may not be evenly separated from the suction pad due to the remaining of the remaining vacuum pressure between the inner flange 1521 and the outer flange 1525.
  • a package portion firstly separated from the suction pad is firstly dropped, whereby the package can incline to fall. So, the package may deviate from its position on the floor or unloaded upside down.
  • the restoring force of the inner flange 1521 enables the package to be evenly separated from the suction pad and fall. Hence, the package can be unloaded without deviating from its position on the floor or being turned upside down.
  • the inner flange 1521 enables the package to be quickly and evenly separated from the suction pad, thereby helping the package reach a destination without deviating from its position or being turned upside down.
  • the flange can be configured to taper in a manner that its width is gradually reduced downward, to the contrary of FIG. 30.
  • each of the inner and outer flanges 1521 and 1525 is formed to be gradually reduced toward its end portion. Since the end portions of the inner and outer flanges 1521 and 1525 should secure sealing for vacuum suction in a manner of being easily deformed according to a surface contour of a package, they are preferably formed thin.
  • the suction pad having the dual flanges is configured in a manner that the outer flange 1525 is deformed more flexible than the inner flange 1521.
  • the inner flange 1521 is formed thicker and shorter than the outer flange 1525.
  • the inner flange 1521 is formed to enable a package to be quickly separated by providing an appropriate restoring force to the package.
  • the outer flange 1525 is configured to secure sealing sufficient for vacuum suction in a manner of being sufficiently and flexibly deformed to correspond to a contour of a package surface.
  • a stopper 1540 is provided within the inner flange
  • the stopper 1540 prevents a package from being excessively sucked and held by the suction pad. If the package excessively adheres closely, sticking may take place. Hence, the stopper 1540 prevents the sticking .
  • Vertical distance between an end portion of the stopper 1540 and an end portion of the outer flange 1525 is preferably formed greater than a normal height of a contact terminal provided to a package surface. In picking up a package, the stopper 1540 is touched to a package surface and then prevents the package from further adhering closer to the suction pad.
  • FIGs. 31 to 35 show a unit picker for sucking and holding a plurality of semiconductor packages simultaneously. If a strip package is sawed into a plurality of individual semiconductor packages by a blade, the packages are simultaneously sucked and held by a single action and then transferred for a cleaning process. For this, the unit picker is available.
  • a semiconductor package is placed on a chuck table 9 and a semiconductor package suction device 101 is placed over the chuck table 9 to suck and hold the semiconductor package.
  • the semiconductor package handling apparatus includes a frame having at least one or more air passages 161 and 171 communicating with an external air suction device, at least one suction pad 100 communicating with the air passage to suck and hold a semiconductor package, and a pad holder 111 detachably assembled to the suction pad 100.
  • the suction pad 100 is substantially identical to that shown in FIG. 1 and its details are omitted in the following description.
  • the frame includes a first frame 141 and a second frame 129 under the first frame 141.
  • the air passage includes a main air passage 171 provided between the first and second frames 141 and 129 and an individual air passage 161 communicating with the main air passage 171 and the suction pad 100.
  • the pad holder 111 is provided in one body beneath the second frame 129.
  • the pad holder 111 and the second frame 129 can be formed in one body by injection molding.
  • the pad holder 111 and the second frame 129 can be individually manufactured and then combined together. This will be explained with reference to FIG. 40 later.
  • the suction pad can be directly attached to a bottom of the second frame 129 by bonding.
  • the suction pad is air-tightly bonded to the second frame 129.
  • the suction pad can be attached/detached to/ from the bottom of the second frame 129 by a user s force.
  • the suction pad is fitted into the pad holder 111 and attached to the bottom of the second frame 129.
  • a plurality of suction pads can be provided.
  • a plurality of the suction pads can be manufactured in one body.
  • the respective suction pads are provided to the bottom of the second frame in one body by being evenly spaced apart from each other.
  • the respective suction pads are combined with one another to be formed into one by injection molding.
  • suction pads are formed in one body by injection molding, management of the suction pads can be facilitated.
  • a user is facilitated to replace the suction pads by attaching or detaching the suction pads in one body.
  • the suction pad 100 can be projected from the bottom of the second frame 129 by a prescribed length. This enables the suction pad 100 to be elastically deformed in sucking and holding the semiconductor package. And, if the suction pad is projected, it is facilitated to come into contact with the semiconductor package.
  • FIG. 32 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention sucks and holds a semiconductor package mounted on a shuck table.
  • FIG. 33 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention carries the semiconductor package sucked and held. The semiconductor package undergoes a cleaning process while sucked and held by the sucking apparatus.
  • FIG. 34 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention places the semiconductor package in a drying block
  • FIG. 35 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention completes a transfer of the semiconductor package.
  • air passages 50 and 70 for sucking and holding the semiconductor package are formed.
  • the air passages 50 and 70 are configured to communicate with an external air sucking device.
  • the dry block as shown in Fig. 34 and FIG. 35, includes a first block 40 and a second block 20 provided under the first block 40. Unlike the chuck table, the dry block is not provided with a soft pad for accommodating the semiconductor package.
  • the semiconductor package is mounted on the first block 40, it is dried by a heating device provided to the dry block.
  • FIGs. 37 to 39 show a unit picker having such a suction pad as shown in FIG. 16 and FIG. 17.
  • a process for sucking and holding a semiconductor package using this unit picker is explained as follows.
  • the suction pad is temporarily and compressively pressed.
  • the partition part 830 is instantly deformed in thickness to absorb shock applied to the semiconductor package, thereby protecting the semiconductor package.
  • the partition part 830 returns to its original thickness and the flanges 821 and 825 suck and hold a ball contact terminal or a surface of the semiconductor package on which the ball contact terminal is formed.
  • each of the flanges encloses at least a portion of the ball type contact terminal to adhere closely to the surface of the semiconductor package.
  • the air sucking device sucks air between the suction pad and the semiconductor package via the air passage provided to the upper frame.
  • the flange is configured in a square ring shape to be projected from a pad body.
  • the flange can be configured in a circular or polygonal ring shape.
  • FIG. 40 shows a unit picker in a different type, in which a suction pad is substantially identical to that shown in FIG. 1. So, details of the suction pad are omitted in the following description.
  • a pad holder 1800 is detachably assembled to the frame, and more particularly, to a second frame 1300.
  • a first locking part 1310 in a prescribed shape is provided to a lower end portion of the second frame 1330 and a second locking part 1810 is provided to the pad holder 1800 to correspond to the first locking part 1310.
  • the first locking part 1310 includes a first recess recessed into the second frame 1330 and a first screw thread provided to the recess.
  • the second locking part 1810 is provided to an upper rim of the pad holder 1800 and includes a second screw thread corresponding to the first screw thread.
  • the pad holder 1800 can be locked to the second frame 1300.
  • a sealing member can be provided between the pad holder 1800 and the second frame 1300 to prevent air leakage.
  • the pad holder 1800 and the second frame 1300 can be implemented in various ways, aside from the above embodiment.
  • the pad holder 1800 and the second frame 1300 can be locked together by snap-fitting or hook locking.
  • FIGs. 41 to 43 show a unit picker according to another embodiment of the present invention.
  • a suction pad 1150 is configured similar to a plurality of the suction pads formed in one body in FIGs. 23 to 26.
  • a plurality of perforated holes are formed in the suction pad 1150 to correspond to a plurality of individual air passages 161, respectively.
  • the suction pad 1150 is provided with a plurality of recesses 1131 to enable a plurality of flanges 1140 to be inserted and attached thereto by corresponding to a plurality of the perforated holes, respectively.
  • a recess 1401 is provided to a second frame 1400 of the unit picker to enable the suction pad 1150 to be inserted and attached thereto.
  • the former unit picker a plurality of the picker holders are provided.
  • the former type picker holder is absent.
  • the suction pad 1150 is assembled to the second frame 1400 by inserting and attaching the suction pad 1150 in one body to the second frame 1400. This assembly method facilitates the assembly work and also facilitates maintenance and repair of the suction pad 1150 and the second frame 1400.
  • FIG. 44 shows a unit picker according to a further embodiment of the present invention.
  • a unit picker differs from that of FIGs. 41 to 43 in its suction pad only but the rest are identical to those of FIGs. 41 to 43.
  • a suction pad 1180 used for a unit picker is not provided with a recess for inserting and attaching a flange 1170 thereto. And, the flange 1170 of the suction pad 1180 is built in one body.
  • the suction pad 1180 shown in FIG. 44 has the flange 1170 in one body. Hence, its assembly work is much simpler and the management of the flange 1170 is facilitated.
  • FIG. 45 is a bottom diagram of the unit picker shown in FIG. 41 and FIG. 42.
  • the present invention relates to a semiconductor package handling device, and more particularly, to a suction pad suitable for sucking and holding a semiconductor package more efficiently. Accordingly, a suction pad according to the present invention is freely deformed according to a surface contour of a semiconductor package to suck and hold, thereby facilitating an uneven surface of the semiconductor package such as a ball grid array package, a board-on-chip and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention porte sur un dispositif de manipulation de boîtier de semi-conducteur et, plus particulièrement, sur un plateau ventouse (100) approprié pour aspirer et maintenir un boîtier de semi-conducteur (1) de façon plus efficace. La présente invention comprend un corps (110) ayant un trou d'aspiration d'air (131) et au moins un élément d'étanchéité souple configuré pour être déformé de façon flexible selon un contour de surface d'une cible d'aspiration, le ou les éléments d'étanchéité souples scellant hermétiquement un espace d'aspiration (5) communiquant avec le trou d'aspiration d'air (131).
PCT/KR2008/002248 2007-04-23 2008-04-21 Plateau ventouse pour boîtier de semi-conducteur WO2008130173A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2007-0039585 2007-04-23
KR20070039585 2007-04-23
KR20070057956 2007-06-13
KR10-2007-0057956 2007-06-13
KR10-2007-0071293 2007-07-16
KR20070071293 2007-07-16

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WO2009132849A1 (fr) * 2008-04-29 2009-11-05 Multitest Elektronische Systeme Gmbh Dispositif d'aspiration comportant une lèvre d'étanchéité cunéiforme
WO2010121701A1 (fr) * 2009-04-22 2010-10-28 Ev Group Gmbh Dispositif de logement pour le logement de substrats semi-conducteurs
EP2296168A1 (fr) * 2009-09-09 2011-03-16 Kulicke & Soffa Die Bonding GmbH Outil de préhension pour un objet plat d'une station d'approvisionnement
CN102765601A (zh) * 2012-07-30 2012-11-07 中国人民解放军国防科学技术大学 用于kdp晶体搬运和位置调整的真空吸附装置
US20160109512A1 (en) * 2014-10-16 2016-04-21 Samsung Electronics Co., Ltd. Semiconductor package test blade and semiconductor package test apparatus including the same
CN106672619A (zh) * 2017-02-15 2017-05-17 苏州迈瑞微电子有限公司 塑封料转运设备及方法
WO2019180256A1 (fr) * 2018-03-22 2019-09-26 Elior Group Appareil de manipulation de vaisselle

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TWI426854B (zh) * 2009-06-09 2014-02-11 Hon Hai Prec Ind Co Ltd 導光板吸附裝置
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
KR200474850Y1 (ko) * 2012-07-30 2014-10-23 세메스 주식회사 패드 교체 유닛 및 이를 포함하는 소자 픽업 장치
JP6186940B2 (ja) * 2013-06-26 2017-08-30 三星ダイヤモンド工業株式会社 脆性材料基板の搬送方法
KR102202068B1 (ko) 2014-05-29 2021-01-12 세메스 주식회사 반도체 패키지 고정용 흡착 패드
KR101601210B1 (ko) * 2014-07-15 2016-03-08 주식회사 티에프이 반도체 패키지를 흡착 및 가압하기 위한 디바이스
KR101721658B1 (ko) * 2015-04-03 2017-03-30 기호알엔디주식회사 진공 리프트 장치용 흡착패드
TWI630675B (zh) * 2017-01-17 2018-07-21 金欣實業有限公司 Wafer suction placement device
CN111981025B (zh) * 2020-08-07 2022-04-08 中国石油大学(华东) 磁控吸盘装置及其使用方法
CN112850150B (zh) * 2021-02-26 2022-09-09 河南农业职业学院 一种多工位电子零件加工用拾取装置

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WO2009132849A1 (fr) * 2008-04-29 2009-11-05 Multitest Elektronische Systeme Gmbh Dispositif d'aspiration comportant une lèvre d'étanchéité cunéiforme
CN102427916A (zh) * 2009-04-22 2012-04-25 Ev集团有限责任公司 用于保持半导体衬底的保持设备
WO2010121701A1 (fr) * 2009-04-22 2010-10-28 Ev Group Gmbh Dispositif de logement pour le logement de substrats semi-conducteurs
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WO2011029890A1 (fr) * 2009-09-09 2011-03-17 Kulicke And Soffa Die Bonding Gmbh Outil de prélèvement d'un objet plan depuis un poste d'alimentation
EP2296168A1 (fr) * 2009-09-09 2011-03-16 Kulicke & Soffa Die Bonding GmbH Outil de préhension pour un objet plat d'une station d'approvisionnement
US9373530B2 (en) 2009-09-09 2016-06-21 Kulicke And Soffa Die Bonding Gmbh Tool for picking a planar object from a supply station
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CN102765601A (zh) * 2012-07-30 2012-11-07 中国人民解放军国防科学技术大学 用于kdp晶体搬运和位置调整的真空吸附装置
US20160109512A1 (en) * 2014-10-16 2016-04-21 Samsung Electronics Co., Ltd. Semiconductor package test blade and semiconductor package test apparatus including the same
CN106672619A (zh) * 2017-02-15 2017-05-17 苏州迈瑞微电子有限公司 塑封料转运设备及方法
WO2019180256A1 (fr) * 2018-03-22 2019-09-26 Elior Group Appareil de manipulation de vaisselle

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KR101446724B1 (ko) 2014-10-07
KR20080095189A (ko) 2008-10-28
TWI449125B (zh) 2014-08-11
TW200901366A (en) 2009-01-01

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