WO2008129831A1 - 配線基板 - Google Patents

配線基板 Download PDF

Info

Publication number
WO2008129831A1
WO2008129831A1 PCT/JP2008/000727 JP2008000727W WO2008129831A1 WO 2008129831 A1 WO2008129831 A1 WO 2008129831A1 JP 2008000727 W JP2008000727 W JP 2008000727W WO 2008129831 A1 WO2008129831 A1 WO 2008129831A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
heat radiating
base material
electronic component
conductor pattern
Prior art date
Application number
PCT/JP2008/000727
Other languages
English (en)
French (fr)
Inventor
Toshiyuki Asahi
Yukihiro Shimasaki
Fumio Echigo
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007093238A external-priority patent/JP2008251950A/ja
Priority claimed from JP2007102425A external-priority patent/JP2008262947A/ja
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/278,344 priority Critical patent/US20100230138A1/en
Priority to CN2008800001806A priority patent/CN101543143B/zh
Priority to EP08720606A priority patent/EP2009968A4/en
Publication of WO2008129831A1 publication Critical patent/WO2008129831A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)

Abstract

　配線基板（５）は、電子部品（９）が実装されるように構成された上面（６Ａ）を有する絶縁基材（６）と、絶縁基材（６）の上面（６Ａ）に形成された導体パターン（７）と、導体パターン（７）を覆う熱放射部材よりなる熱放射層（８）とを備える。熱放射部材の温度Ｔが２９３Ｋ以上かつ４７３Ｋ以下の場合の波長λ＝０．００２８９８／Ｔの電磁波の放射率は０．８以上である。この配線基板（５）は、電子部品（９）の温度上昇を抑制することができる。
PCT/JP2008/000727 2007-03-30 2008-03-26 配線基板 WO2008129831A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/278,344 US20100230138A1 (en) 2007-03-30 2008-03-26 Wiring board
CN2008800001806A CN101543143B (zh) 2007-03-30 2008-03-26 布线基板
EP08720606A EP2009968A4 (en) 2007-03-30 2008-03-26 CIRCUIT BOARD

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007093238A JP2008251950A (ja) 2007-03-30 2007-03-30 配線基板
JP2007-093238 2007-03-30
JP2007-102425 2007-04-10
JP2007102425A JP2008262947A (ja) 2007-04-10 2007-04-10 配線基板

Publications (1)

Publication Number Publication Date
WO2008129831A1 true WO2008129831A1 (ja) 2008-10-30

Family

ID=39875363

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000727 WO2008129831A1 (ja) 2007-03-30 2008-03-26 配線基板

Country Status (3)

Country Link
US (1) US20100230138A1 (ja)
EP (1) EP2009968A4 (ja)
WO (1) WO2008129831A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101895416B1 (ko) 2011-12-23 2018-09-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
US10390421B2 (en) 2015-10-01 2019-08-20 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic component carrier for carrying and cooling a heat generating electronic component
CN108293303B (zh) 2015-10-22 2021-01-29 奥特斯奥地利科技与系统技术有限公司 使用部分未固化的部件承载件本体来制造部件承载件
DE102017201263A1 (de) * 2017-01-26 2018-07-26 Vacuumschmelze Gmbh & Co. Kg Elektrisch isolierte baugruppe und verfahren zur elektrischen isolation einer baugruppe

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158706A (ja) * 2002-11-07 2004-06-03 Nippon Steel Corp 高吸熱塗装をした電子機器用基板及び電子部品
JP2004211060A (ja) * 2002-12-16 2004-07-29 Ceramission Kk エマルジョン性組成物およびそれにより形成した塗膜並びにその塗膜を用いた冷却構造
JP2004336020A (ja) * 2003-04-16 2004-11-25 Oki Electric Ind Co Ltd 半導体装置の放熱構造、及びその製造方法
JP2004356436A (ja) * 2003-05-29 2004-12-16 Fujitsu Hitachi Plasma Display Ltd 熱交換部品及びこれを用いた表示装置、放熱フィン及びこれを用いた表示装置
JP2005123317A (ja) * 2003-10-15 2005-05-12 Ceramission Kk 電子部品の冷却，放熱装置
JP2005228860A (ja) * 2004-02-12 2005-08-25 Oki Electric Ind Co Ltd 電子部品搭載用基板、電子部品、及び半導体装置
JP2005252144A (ja) 2004-03-08 2005-09-15 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2006283092A (ja) * 2005-03-31 2006-10-19 Jfe Steel Kk 伝熱促進装置及びこの装置を備えたウォーキングビーム式連続加熱炉
JP2007035716A (ja) 2005-07-22 2007-02-08 Fujikura Ltd プリント基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0834930B1 (en) * 1990-04-20 2001-10-17 Matsushita Electric Industrial Co., Ltd. Thermoelectric semiconductor deaerated into a vacuum and thermoelectric panel using p-type and n-type thermoelectric semiconductors
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
JP3775970B2 (ja) * 2000-03-27 2006-05-17 新光電気工業株式会社 電子部品実装用基板の製造方法
JP2004179313A (ja) * 2002-11-26 2004-06-24 Fujitsu Ten Ltd 回路配線基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158706A (ja) * 2002-11-07 2004-06-03 Nippon Steel Corp 高吸熱塗装をした電子機器用基板及び電子部品
JP2004211060A (ja) * 2002-12-16 2004-07-29 Ceramission Kk エマルジョン性組成物およびそれにより形成した塗膜並びにその塗膜を用いた冷却構造
JP2004336020A (ja) * 2003-04-16 2004-11-25 Oki Electric Ind Co Ltd 半導体装置の放熱構造、及びその製造方法
JP2004356436A (ja) * 2003-05-29 2004-12-16 Fujitsu Hitachi Plasma Display Ltd 熱交換部品及びこれを用いた表示装置、放熱フィン及びこれを用いた表示装置
JP2005123317A (ja) * 2003-10-15 2005-05-12 Ceramission Kk 電子部品の冷却，放熱装置
JP2005228860A (ja) * 2004-02-12 2005-08-25 Oki Electric Ind Co Ltd 電子部品搭載用基板、電子部品、及び半導体装置
JP2005252144A (ja) 2004-03-08 2005-09-15 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2006283092A (ja) * 2005-03-31 2006-10-19 Jfe Steel Kk 伝熱促進装置及びこの装置を備えたウォーキングビーム式連続加熱炉
JP2007035716A (ja) 2005-07-22 2007-02-08 Fujikura Ltd プリント基板の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2009968A4 *

Also Published As

Publication number Publication date
EP2009968A4 (en) 2012-12-05
EP2009968A8 (en) 2009-03-18
US20100230138A1 (en) 2010-09-16
EP2009968A1 (en) 2008-12-31

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