WO2008129755A1 - 半導体デバイスの検査方法および半導体デバイスの検査装置 - Google Patents

半導体デバイスの検査方法および半導体デバイスの検査装置 Download PDF

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Publication number
WO2008129755A1
WO2008129755A1 PCT/JP2008/000336 JP2008000336W WO2008129755A1 WO 2008129755 A1 WO2008129755 A1 WO 2008129755A1 JP 2008000336 W JP2008000336 W JP 2008000336W WO 2008129755 A1 WO2008129755 A1 WO 2008129755A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
electromagnetic wave
device inspecting
inspected
laser beam
Prior art date
Application number
PCT/JP2008/000336
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English (en)
French (fr)
Inventor
Hiroki Kitagawa
Hiroaki Katsura
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2008533304A priority Critical patent/JP4744604B2/ja
Priority to US12/294,127 priority patent/US7852102B2/en
Priority to CN2008800000593A priority patent/CN101542707B/zh
Publication of WO2008129755A1 publication Critical patent/WO2008129755A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

　検査する半導体デバイス構造に備えられた拡散領域からなる構造Ａに対し、パルスレーザ光を照射した場合に発生する電磁波振幅波形の強度と、予め測定しておいた基準品の構造Ａにパルスレーザ光を照射したときに放出される電磁波振幅波形の強度を比較し、電磁波検出感度を校正（Ｓ１４）した後、検査対象の半導体デバイスを検査することで、検査装置の電磁波検出感度ズレが原因となる測定誤差をなくし、精度よく良否判定（Ｓ１６）を行う。
PCT/JP2008/000336 2007-04-10 2008-02-26 半導体デバイスの検査方法および半導体デバイスの検査装置 WO2008129755A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008533304A JP4744604B2 (ja) 2007-04-10 2008-02-26 半導体デバイスの検査方法および半導体デバイスの検査装置
US12/294,127 US7852102B2 (en) 2007-04-10 2008-02-26 Method and apparatus for inspecting semiconductor device
CN2008800000593A CN101542707B (zh) 2007-04-10 2008-02-26 半导体器件的检查方法与半导体器件的检查装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-102598 2007-04-10
JP2007102598 2007-04-10

Publications (1)

Publication Number Publication Date
WO2008129755A1 true WO2008129755A1 (ja) 2008-10-30

Family

ID=39875294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000336 WO2008129755A1 (ja) 2007-04-10 2008-02-26 半導体デバイスの検査方法および半導体デバイスの検査装置

Country Status (6)

Country Link
US (1) US7852102B2 (ja)
JP (1) JP4744604B2 (ja)
KR (1) KR101021506B1 (ja)
CN (1) CN101542707B (ja)
TW (1) TWI378523B (ja)
WO (1) WO2008129755A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009990A (ja) * 2012-06-28 2014-01-20 Dainippon Screen Mfg Co Ltd 検査装置および検査方法
JP2014009988A (ja) * 2012-06-28 2014-01-20 Dainippon Screen Mfg Co Ltd 検査装置および検査方法
JP2016151536A (ja) * 2015-02-19 2016-08-22 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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US9581642B2 (en) * 2010-05-12 2017-02-28 International Business Machines Corporation Method and system for quickly identifying circuit components in an emission image
US9201096B2 (en) * 2010-09-08 2015-12-01 Dcg Systems, Inc. Laser-assisted device alteration using synchronized laser pulses
EP2546634B1 (en) * 2011-07-14 2019-04-17 SCREEN Holdings Co., Ltd. Inspection apparatus and inspection method
JP5835795B2 (ja) * 2011-09-13 2015-12-24 株式会社Ｓｃｒｅｅｎホールディングス 検査方法および検査装置
JP2013076618A (ja) 2011-09-30 2013-04-25 Sony Corp 光伝導素子、レンズ、テラヘルツ放射顕微鏡及びデバイスの製造方法
US9721854B2 (en) 2012-12-05 2017-08-01 International Business Machines Corporation Structure and method for in-line defect non-contact tests
WO2014160618A1 (en) 2013-03-24 2014-10-02 Dcg Systems, Inc. Pulsed lada for acquisition of timing diagrams
JP6406656B2 (ja) * 2013-08-23 2018-10-17 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
CN103823135B (zh) * 2014-02-24 2016-02-03 北京航空航天大学 一种用于多频快速敏感度测试中频点幅度调整方法
WO2017027505A1 (en) * 2015-08-10 2017-02-16 Delta Design, Inc. Ic device-in-pocket detection with angular mounted lasers and a camera
US10521897B2 (en) 2016-07-22 2019-12-31 International Business Machines Corporation Using photonic emission to develop electromagnetic emission models
US11579184B2 (en) * 2017-11-27 2023-02-14 Hamamatsu Photonics K.K. Analysis method, analysis device, analysis program, and recording medium for recording analysis program

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005022180A1 (ja) * 2003-08-29 2005-03-10 Aisin Seiki Kabushiki Kaisha 半導体デバイスの電界分布測定方法と装置
JP2006024774A (ja) * 2004-07-08 2006-01-26 Institute Of Physical & Chemical Research 半導体デバイスの故障診断方法と装置
JP2006270063A (ja) * 2005-02-28 2006-10-05 Seiko Instruments Inc 半導体ウェハおよびそれを用いた半導体検査装置の校正方法
JP2007073925A (ja) * 2005-08-11 2007-03-22 Fujitsu Ltd 欠陥検査装置及びその感度校正方法、欠陥検出感度校正用基板及びその製造方法

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US5708371A (en) * 1995-03-16 1998-01-13 Mitsubishi Denki Kabushiki Kaisha Scanning photoinduced current analyzer capable of detecting photoinduced current in nonbiased specimen
JP3749107B2 (ja) * 1999-11-05 2006-02-22 ファブソリューション株式会社 半導体デバイス検査装置
JP2006029997A (ja) * 2004-07-16 2006-02-02 Nidec-Read Corp 基板検査装置及び基板検査方法
KR100524213B1 (ko) * 2003-02-28 2005-10-27 삼성전자주식회사 기판 검사 방법 및 장치
KR20060035159A (ko) * 2004-10-21 2006-04-26 삼성전자주식회사 반도체 기판 검사 장치
JP5050394B2 (ja) * 2006-04-20 2012-10-17 日本電産リード株式会社 基板検査装置及び基板検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005022180A1 (ja) * 2003-08-29 2005-03-10 Aisin Seiki Kabushiki Kaisha 半導体デバイスの電界分布測定方法と装置
JP2006024774A (ja) * 2004-07-08 2006-01-26 Institute Of Physical & Chemical Research 半導体デバイスの故障診断方法と装置
JP2006270063A (ja) * 2005-02-28 2006-10-05 Seiko Instruments Inc 半導体ウェハおよびそれを用いた半導体検査装置の校正方法
JP2007073925A (ja) * 2005-08-11 2007-03-22 Fujitsu Ltd 欠陥検査装置及びその感度校正方法、欠陥検出感度校正用基板及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009990A (ja) * 2012-06-28 2014-01-20 Dainippon Screen Mfg Co Ltd 検査装置および検査方法
JP2014009988A (ja) * 2012-06-28 2014-01-20 Dainippon Screen Mfg Co Ltd 検査装置および検査方法
JP2016151536A (ja) * 2015-02-19 2016-08-22 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法

Also Published As

Publication number Publication date
CN101542707A (zh) 2009-09-23
US20100231253A1 (en) 2010-09-16
KR101021506B1 (ko) 2011-03-16
US7852102B2 (en) 2010-12-14
JPWO2008129755A1 (ja) 2010-07-22
JP4744604B2 (ja) 2011-08-10
CN101542707B (zh) 2010-10-27
TWI378523B (en) 2012-12-01
TW200843014A (en) 2008-11-01
KR20090086303A (ko) 2009-08-12

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