WO2008126559A1 - ポリイミドフィルム - Google Patents

ポリイミドフィルム Download PDF

Info

Publication number
WO2008126559A1
WO2008126559A1 PCT/JP2008/054363 JP2008054363W WO2008126559A1 WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1 JP 2008054363 W JP2008054363 W JP 2008054363W WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide film
polyimide
group
thickness
general formula
Prior art date
Application number
PCT/JP2008/054363
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yasuhiro Adachi
Hironori Nagaoka
Hongyuan Wang
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2009508988A priority Critical patent/JP5249203B2/ja
Publication of WO2008126559A1 publication Critical patent/WO2008126559A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
PCT/JP2008/054363 2007-03-30 2008-03-11 ポリイミドフィルム WO2008126559A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009508988A JP5249203B2 (ja) 2007-03-30 2008-03-11 ポリイミドフィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-092730 2007-03-30
JP2007092730 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126559A1 true WO2008126559A1 (ja) 2008-10-23

Family

ID=39863706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054363 WO2008126559A1 (ja) 2007-03-30 2008-03-11 ポリイミドフィルム

Country Status (3)

Country Link
JP (1) JP5249203B2 (zh)
TW (1) TWI422645B (zh)
WO (1) WO2008126559A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
JP2017025214A (ja) * 2015-07-23 2017-02-02 大日本印刷株式会社 ポリイミド樹脂および積層体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691996B2 (ja) * 2011-10-21 2015-04-01 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028767A1 (fr) * 1999-10-21 2001-04-26 Nippon Steel Chemical Co., Ltd. Lamelle et procede de production
JP2004322441A (ja) * 2003-04-24 2004-11-18 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2005066242A1 (ja) * 2003-12-26 2005-07-21 Nippon Steel Chemical Co., Ltd. 芳香族ポリアミド酸及びポリイミド
WO2005084088A1 (ja) * 2004-02-26 2005-09-09 Nippon Steel Chemical Co., Ltd. 配線基板用積層体
JP2005314630A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 芳香族ポリアミド酸及びポリイミド
JP2006117791A (ja) * 2004-10-21 2006-05-11 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2006090658A1 (ja) * 2005-02-23 2006-08-31 Nippon Steel Chemical Co., Ltd. 配線基板用積層体
JP2006269558A (ja) * 2005-03-22 2006-10-05 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法
JP2006272626A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028767A1 (fr) * 1999-10-21 2001-04-26 Nippon Steel Chemical Co., Ltd. Lamelle et procede de production
JP2004322441A (ja) * 2003-04-24 2004-11-18 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2005066242A1 (ja) * 2003-12-26 2005-07-21 Nippon Steel Chemical Co., Ltd. 芳香族ポリアミド酸及びポリイミド
WO2005084088A1 (ja) * 2004-02-26 2005-09-09 Nippon Steel Chemical Co., Ltd. 配線基板用積層体
JP2005314630A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 芳香族ポリアミド酸及びポリイミド
JP2006117791A (ja) * 2004-10-21 2006-05-11 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2006090658A1 (ja) * 2005-02-23 2006-08-31 Nippon Steel Chemical Co., Ltd. 配線基板用積層体
JP2006269558A (ja) * 2005-03-22 2006-10-05 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法
JP2006272626A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
JP2017025214A (ja) * 2015-07-23 2017-02-02 大日本印刷株式会社 ポリイミド樹脂および積層体

Also Published As

Publication number Publication date
TW200902627A (en) 2009-01-16
TWI422645B (zh) 2014-01-11
JP5249203B2 (ja) 2013-07-31
JPWO2008126559A1 (ja) 2010-07-22

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