WO2008123321A1 - 強磁性体の形成方法並びにトランジスタ及びその製造方法 - Google Patents
強磁性体の形成方法並びにトランジスタ及びその製造方法 Download PDFInfo
- Publication number
- WO2008123321A1 WO2008123321A1 PCT/JP2008/055769 JP2008055769W WO2008123321A1 WO 2008123321 A1 WO2008123321 A1 WO 2008123321A1 JP 2008055769 W JP2008055769 W JP 2008055769W WO 2008123321 A1 WO2008123321 A1 WO 2008123321A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- transistor
- magnetic element
- semiconductor
- ferromagnetic body
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 230000005294 ferromagnetic effect Effects 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000005291 magnetic effect Effects 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 5
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910001291 heusler alloy Inorganic materials 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/18—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
- H01F10/193—Magnetic semiconductor compounds
- H01F10/1936—Half-metallic, e.g. epitaxial CrO2 or NiMnSb films
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66984—Devices using spin polarized carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/22—Heat treatment; Thermal decomposition; Chemical vapour deposition
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Hall/Mr Elements (AREA)
- Thin Magnetic Films (AREA)
- Thin Film Transistor (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本発明は、反応抑制層14上に形成された半導体層16上に磁性元素層20を形成する工程と、半導体層16と磁性元素層20とを熱処理し反応させることにより、反応抑制層14上にホイスラー合金層26である強磁性体層を形成する工程と、を有することを特徴とする強磁性体の形成方法並びにトランジスタ及びその製造方法である。本発明によれば、半導体層と磁性元素層との反応を抑制する反応抑制層により、半導体と磁性元素との反応に供給される半導体が制限され、磁性元素の組成比の大きな強磁性体を形成することができる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/450,355 US7960186B2 (en) | 2007-03-26 | 2008-03-26 | Method of forming ferromagnetic material, transistor and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-078925 | 2007-03-26 | ||
JP2007078925A JP4742276B2 (ja) | 2007-03-26 | 2007-03-26 | 強磁性体の形成方法並びにトランジスタ及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123321A1 true WO2008123321A1 (ja) | 2008-10-16 |
Family
ID=39830809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055769 WO2008123321A1 (ja) | 2007-03-26 | 2008-03-26 | 強磁性体の形成方法並びにトランジスタ及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7960186B2 (ja) |
JP (1) | JP4742276B2 (ja) |
WO (1) | WO2008123321A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011033665A1 (ja) * | 2009-09-18 | 2011-03-24 | 株式会社 東芝 | 半導体装置およびその製造方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4738499B2 (ja) * | 2009-02-10 | 2011-08-03 | 株式会社東芝 | スピントランジスタの製造方法 |
JP5413646B2 (ja) * | 2009-03-26 | 2014-02-12 | 国立大学法人東北大学 | ホイスラー合金材料、磁気抵抗素子および磁気デバイス |
US8889537B2 (en) * | 2010-07-09 | 2014-11-18 | International Business Machines Corporation | Implantless dopant segregation for silicide contacts |
KR20140134068A (ko) * | 2013-05-13 | 2014-11-21 | 에스케이하이닉스 주식회사 | 스핀 트랜지스터 및 이 스핀 트랜지스터를 포함하는 반도체 장치, 메모리 장치, 마이크로프로세서, 프로세서, 시스템, 데이터 저장 시스템 및 메모리 시스템 |
US11107908B2 (en) | 2016-07-01 | 2021-08-31 | Intel Corporation | Transistors with metal source and drain contacts including a Heusler alloy |
Citations (3)
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JPH10183349A (ja) * | 1996-08-31 | 1998-07-14 | Skm Ltd | アンチモン化インジウム(InSb)層形成方法 |
JP2005228998A (ja) * | 2004-02-13 | 2005-08-25 | Japan Science & Technology Agency | 磁性薄膜及びそれを用いた磁気抵抗効果素子並びに磁気デバイス |
JP2006286726A (ja) * | 2005-03-31 | 2006-10-19 | Toshiba Corp | スピン注入fet |
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US6741494B2 (en) * | 1995-04-21 | 2004-05-25 | Mark B. Johnson | Magnetoelectronic memory element with inductively coupled write wires |
WO2002099906A1 (fr) * | 2001-06-04 | 2002-12-12 | Matsushita Electric Industrial Co., Ltd. | Element magnetoresistant, element de memorisation par magnetoresistance et memoire magnetique |
US7528428B2 (en) * | 2003-03-07 | 2009-05-05 | Japan Science And Technology Agency | Field-effect transistor with spin-dependent transmission characteristics and non-volatile memory using the same |
EP1610386A4 (en) * | 2003-03-31 | 2009-04-01 | Japan Science & Tech Agency | TUNNEL TRANSISTOR WITH SPIN-DEPENDENT TRANSFER CHARACTERISTICS AND NON-VOLATILE MEMORY THEREOF |
JP4128938B2 (ja) * | 2003-10-28 | 2008-07-30 | 株式会社日立製作所 | 磁気ヘッド及び磁気記録再生装置 |
JP2007207919A (ja) * | 2006-01-31 | 2007-08-16 | Toshiba Corp | 磁気抵抗効果素子および磁気メモリ |
JP2008047706A (ja) * | 2006-08-16 | 2008-02-28 | Nec Lcd Technologies Ltd | 半導体回路及びそれを用いた半導体装置 |
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2007
- 2007-03-26 JP JP2007078925A patent/JP4742276B2/ja active Active
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2008
- 2008-03-26 WO PCT/JP2008/055769 patent/WO2008123321A1/ja active Application Filing
- 2008-03-26 US US12/450,355 patent/US7960186B2/en active Active
Patent Citations (3)
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JPH10183349A (ja) * | 1996-08-31 | 1998-07-14 | Skm Ltd | アンチモン化インジウム(InSb)層形成方法 |
JP2005228998A (ja) * | 2004-02-13 | 2005-08-25 | Japan Science & Technology Agency | 磁性薄膜及びそれを用いた磁気抵抗効果素子並びに磁気デバイス |
JP2006286726A (ja) * | 2005-03-31 | 2006-10-19 | Toshiba Corp | スピン注入fet |
Non-Patent Citations (4)
Title |
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AMBROSE T., KREBS J.J., PRINZ G.A.: "Magnetic properties of single crystal Co2MnGe Heusler alloy films", JOURNAL OF APPLIED PHYSICS, vol. 87, no. 9, 1 May 2000 (2000-05-01), pages 5463 - 5465, XP000947827 * |
INOMATA K.: "Chapter 12 Half Metal Usumaku to TMR", vol. 1ST ED., 30 July 2004, CMC PUBLISHING CO., LTD., article "Spinelectronics -Basic and Forefront-", pages: 142 - 145 * |
RAPHAEL M.P. ET AL.: "Magnetic structural, and transport properties of thin film and single crystal Co2MnSi", APPLIED PHYSICS LETTERS, vol. 79, no. 26, 24 December 2001 (2001-12-24), pages 4396 - 4398, XP001087077 * |
SUGAHARA S.: "Spin metal-oxide-semiconductor field-effect transistors (spin MOSFETSs) for integrated spin electronics", IEE PROCEEDINGS-CIRCUITS, DEVICES AND SYSTEMS, vol. 152, no. 4, 5 August 2005 (2005-08-05), pages 355 - 365, XP006024923 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011033665A1 (ja) * | 2009-09-18 | 2011-03-24 | 株式会社 東芝 | 半導体装置およびその製造方法 |
US8330196B2 (en) | 2009-09-18 | 2012-12-11 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
JP5443502B2 (ja) * | 2009-09-18 | 2014-03-19 | 株式会社東芝 | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4742276B2 (ja) | 2011-08-10 |
US7960186B2 (en) | 2011-06-14 |
JP2008243922A (ja) | 2008-10-09 |
US20100171158A1 (en) | 2010-07-08 |
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