WO2008114868A1 - プリント基板端子用Ｓｎめっき銅合金材 - Google Patents

プリント基板端子用Ｓｎめっき銅合金材 Download PDF

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Publication number
WO2008114868A1
WO2008114868A1 PCT/JP2008/055303 JP2008055303W WO2008114868A1 WO 2008114868 A1 WO2008114868 A1 WO 2008114868A1 JP 2008055303 W JP2008055303 W JP 2008055303W WO 2008114868 A1 WO2008114868 A1 WO 2008114868A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy material
copper alloy
plated copper
printed board
board terminal
Prior art date
Application number
PCT/JP2008/055303
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Takaaki Hatano
Kenji Koike
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to CN2008800086630A priority Critical patent/CN101636514B/zh
Priority to KR1020097018949A priority patent/KR101155360B1/ko
Priority to JP2009505261A priority patent/JP5373598B2/ja
Publication of WO2008114868A1 publication Critical patent/WO2008114868A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
PCT/JP2008/055303 2007-03-22 2008-03-21 プリント基板端子用Ｓｎめっき銅合金材 WO2008114868A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800086630A CN101636514B (zh) 2007-03-22 2008-03-21 印刷基板端子
KR1020097018949A KR101155360B1 (ko) 2007-03-22 2008-03-21 프린트 기판 단자
JP2009505261A JP5373598B2 (ja) 2007-03-22 2008-03-21 プリント基板端子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007075466 2007-03-22
JP2007-075466 2007-03-22

Publications (1)

Publication Number Publication Date
WO2008114868A1 true WO2008114868A1 (ja) 2008-09-25

Family

ID=39765968

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055303 WO2008114868A1 (ja) 2007-03-22 2008-03-21 プリント基板端子用Ｓｎめっき銅合金材

Country Status (5)

Country Link
JP (1) JP5373598B2 (zh)
KR (1) KR101155360B1 (zh)
CN (1) CN101636514B (zh)
TW (1) TW200844267A (zh)
WO (1) WO2008114868A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012128150A1 (ja) * 2011-03-18 2012-09-27 Jx日鉱日石金属株式会社 充電用電池タブ材に用いられる銅合金条
JP2015143387A (ja) * 2013-07-10 2015-08-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
US20160194735A1 (en) * 2012-12-28 2016-07-07 Mitsubishi Shindoh Co., Ltd. Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
CN107309522A (zh) * 2017-06-12 2017-11-03 湖北三江航天险峰电子信息有限公司 一种微波组件引脚搭焊印制板的焊接方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5490594B2 (ja) * 2010-03-31 2014-05-14 Ｊｘ日鉱日石金属株式会社 電池接続タブ材料用Ｃｕ−Ｚｎ系合金条
JP4888586B2 (ja) * 2010-06-18 2012-02-29 日立電線株式会社 圧延銅箔
CN102230107A (zh) * 2011-06-28 2011-11-02 安徽精诚铜业股份有限公司 抗磁性服辅类黄铜带及其生产工艺
CN108172614A (zh) * 2017-11-29 2018-06-15 苏州诺纳可电子科技有限公司 一种电子三极管
CN108155154A (zh) * 2017-11-29 2018-06-12 苏州诺纳可电子科技有限公司 一种三极管
CN112643162B (zh) * 2020-11-30 2022-06-28 浙江福达合金材料科技有限公司 一种工业用插头插座触头组件的焊接方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07258777A (ja) * 1994-03-18 1995-10-09 Dowa Mining Co Ltd コネクタ用銅基合金およびその製造法
JP2007046159A (ja) * 2005-07-15 2007-02-22 Nikko Kinzoku Kk 電気電子機器用Ｃｕ−Ｚｎ−Ｓｎ合金
JP2007051370A (ja) * 2005-07-22 2007-03-01 Nikko Kinzoku Kk Ｓｎめっきの耐熱剥離性に優れるＣｕ−Ｚｎ−Ｓｎ系合金条及びそのＳｎめっき条

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4247256B2 (ja) * 2005-08-24 2009-04-02 日鉱金属株式会社 Ｃｕ−Ｚｎ−Ｓｎ系合金すずめっき条
JP4538424B2 (ja) * 2006-03-29 2010-09-08 日鉱金属株式会社 Ｃｕ−Ｚｎ−Ｓｎ系合金すずめっき条

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07258777A (ja) * 1994-03-18 1995-10-09 Dowa Mining Co Ltd コネクタ用銅基合金およびその製造法
JP2007046159A (ja) * 2005-07-15 2007-02-22 Nikko Kinzoku Kk 電気電子機器用Ｃｕ−Ｚｎ−Ｓｎ合金
JP2007051370A (ja) * 2005-07-22 2007-03-01 Nikko Kinzoku Kk Ｓｎめっきの耐熱剥離性に優れるＣｕ−Ｚｎ−Ｓｎ系合金条及びそのＳｎめっき条

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012128150A1 (ja) * 2011-03-18 2012-09-27 Jx日鉱日石金属株式会社 充電用電池タブ材に用いられる銅合金条
US20160194735A1 (en) * 2012-12-28 2016-07-07 Mitsubishi Shindoh Co., Ltd. Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
JP2015143387A (ja) * 2013-07-10 2015-08-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
CN107309522A (zh) * 2017-06-12 2017-11-03 湖北三江航天险峰电子信息有限公司 一种微波组件引脚搭焊印制板的焊接方法

Also Published As

Publication number Publication date
KR20090109586A (ko) 2009-10-20
CN101636514B (zh) 2011-04-20
TWI374950B (zh) 2012-10-21
JPWO2008114868A1 (ja) 2010-07-08
TW200844267A (en) 2008-11-16
KR101155360B1 (ko) 2012-06-19
CN101636514A (zh) 2010-01-27
JP5373598B2 (ja) 2013-12-18

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