WO2008111184A1 - 半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハ - Google Patents
半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハ Download PDFInfo
- Publication number
- WO2008111184A1 WO2008111184A1 PCT/JP2007/055033 JP2007055033W WO2008111184A1 WO 2008111184 A1 WO2008111184 A1 WO 2008111184A1 JP 2007055033 W JP2007055033 W JP 2007055033W WO 2008111184 A1 WO2008111184 A1 WO 2008111184A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaning
- wafer
- semiconductor manufacturing
- manufacturing apparatus
- chamber
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
Abstract
【課題】効率よく半導体製造装置をクリーニングすることが可能な半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハを提供すること。 【解決手段】トランスファチャンバ2と、トランスファチャンバ2に接続された処理チャンバ5と、トランスファチャンバ2に接続され、クリーニング用ウエハCWを帯電又は除電する補助チャンバ4と、トランスファチャンバ2、処理チャンバ5、及び補助チャンバ4にクリーニング用ウエハCWを搬送する搬送ロボット6とを有する半導体製造装置1による。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/055033 WO2008111184A1 (ja) | 2007-03-14 | 2007-03-14 | 半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/055033 WO2008111184A1 (ja) | 2007-03-14 | 2007-03-14 | 半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハ |
Publications (1)
Publication Number | Publication Date |
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WO2008111184A1 true WO2008111184A1 (ja) | 2008-09-18 |
Family
ID=39759135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2007/055033 WO2008111184A1 (ja) | 2007-03-14 | 2007-03-14 | 半導体製造装置とそのクリーニング方法、及びクリーニング用ウエハ |
Country Status (1)
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WO (1) | WO2008111184A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0178021U (ja) * | 1987-11-16 | 1989-05-25 | ||
JPH06252066A (ja) * | 1993-02-23 | 1994-09-09 | Toshiba Corp | 半導体製造装置と半導体装置の製造方法 |
JPH08203851A (ja) * | 1995-01-27 | 1996-08-09 | Sony Corp | 清浄化装置 |
JP2000021947A (ja) * | 1998-06-30 | 2000-01-21 | Sony Corp | 乾式処理装置 |
JP2000138275A (ja) * | 1998-10-29 | 2000-05-16 | Seiko Epson Corp | 半導体製造装置 |
JP2000260671A (ja) * | 1999-03-12 | 2000-09-22 | Toshiba Corp | ダスト吸着用ウエハ及び半導体装置内のクリーニング方法 |
JP2003051523A (ja) * | 2001-08-07 | 2003-02-21 | Sharp Corp | パーティクル除去システム |
JP2004063669A (ja) * | 2002-07-26 | 2004-02-26 | Oki Electric Ind Co Ltd | 半導体製造装置クリーニングウエハとその製造方法、およびそれを用いたクリーニング方法 |
-
2007
- 2007-03-14 WO PCT/JP2007/055033 patent/WO2008111184A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0178021U (ja) * | 1987-11-16 | 1989-05-25 | ||
JPH06252066A (ja) * | 1993-02-23 | 1994-09-09 | Toshiba Corp | 半導体製造装置と半導体装置の製造方法 |
JPH08203851A (ja) * | 1995-01-27 | 1996-08-09 | Sony Corp | 清浄化装置 |
JP2000021947A (ja) * | 1998-06-30 | 2000-01-21 | Sony Corp | 乾式処理装置 |
JP2000138275A (ja) * | 1998-10-29 | 2000-05-16 | Seiko Epson Corp | 半導体製造装置 |
JP2000260671A (ja) * | 1999-03-12 | 2000-09-22 | Toshiba Corp | ダスト吸着用ウエハ及び半導体装置内のクリーニング方法 |
JP2003051523A (ja) * | 2001-08-07 | 2003-02-21 | Sharp Corp | パーティクル除去システム |
JP2004063669A (ja) * | 2002-07-26 | 2004-02-26 | Oki Electric Ind Co Ltd | 半導体製造装置クリーニングウエハとその製造方法、およびそれを用いたクリーニング方法 |
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