WO2008108146A1 - Electrostatic chuck - Google Patents

Electrostatic chuck Download PDF

Info

Publication number
WO2008108146A1
WO2008108146A1 PCT/JP2008/052408 JP2008052408W WO2008108146A1 WO 2008108146 A1 WO2008108146 A1 WO 2008108146A1 JP 2008052408 W JP2008052408 W JP 2008052408W WO 2008108146 A1 WO2008108146 A1 WO 2008108146A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
electrostatic chuck
polyimide
attraction
dielectric layers
Prior art date
Application number
PCT/JP2008/052408
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshiaki Tatsumi
Kinya Miyashita
Original Assignee
Creative Technology Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Technology Corporation filed Critical Creative Technology Corporation
Priority to JP2009502492A priority Critical patent/JPWO2008108146A1/en
Publication of WO2008108146A1 publication Critical patent/WO2008108146A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An electrostatic chuck that allows replacement of its attraction plane and uses a replaceable resin sheet of flexible material to thereby attain an enhancement of adherence to a substrate, such as wafer, held by attraction. Attracting electrode (6) of copper, aluminum or the like is laid within first insulating dielectric layers (3,4) of a resin, such as polyimide, or a silicone rubber, such as ferrosilicone. Second dielectric layer (5) consisting of a sheet of resin, such as polyimide, is attached onto the superior layer (4) of the first insulating dielectric layers to thereby realize replaceability.
PCT/JP2008/052408 2007-03-01 2008-02-14 Electrostatic chuck WO2008108146A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009502492A JPWO2008108146A1 (en) 2007-03-01 2008-02-14 Electrostatic chuck

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-089383 2007-03-01
JP2007089383 2007-03-01

Publications (1)

Publication Number Publication Date
WO2008108146A1 true WO2008108146A1 (en) 2008-09-12

Family

ID=39738043

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052408 WO2008108146A1 (en) 2007-03-01 2008-02-14 Electrostatic chuck

Country Status (2)

Country Link
JP (1) JPWO2008108146A1 (en)
WO (1) WO2008108146A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010148177A (en) * 2008-12-16 2010-07-01 Advanced Display Process Engineering Co Ltd Electrostatic chuck and substrate bonding device equipped therewith
JP2012216691A (en) * 2011-03-31 2012-11-08 Shibaura Mechatronics Corp Stand and plasma processing apparatus
JP2015536568A (en) * 2012-11-02 2015-12-21 インテグリス・インコーポレーテッド Electrostatic chuck with photopatternable soft protrusion contact surface
WO2018017192A1 (en) 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
CN109285806A (en) * 2017-07-21 2019-01-29 株式会社迪思科 The manufacturing method of electrostatic chuck plate
CN109768008A (en) * 2017-11-10 2019-05-17 Ｓｊ股份有限公司 The manufacturing method and electrostatic chuck of electrostatic chuck
KR102632324B1 (en) * 2023-11-09 2024-02-01 주식회사 이에스티 Multi-layer electrostatic chuck with multi-layer stripping film structure
KR102668954B1 (en) 2023-11-09 2024-05-24 주식회사 이에스티 Multi-layer electrostatic chuck with efficient repair structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101964631B1 (en) * 2018-04-06 2019-04-02 (주)아폴로테크 A electrostatic chuck

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297805A (en) * 1998-04-13 1999-10-29 Tomoegawa Paper Co Ltd Electrostatic chucking device, laminated sheet and bonding agent therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297805A (en) * 1998-04-13 1999-10-29 Tomoegawa Paper Co Ltd Electrostatic chucking device, laminated sheet and bonding agent therefor

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010148177A (en) * 2008-12-16 2010-07-01 Advanced Display Process Engineering Co Ltd Electrostatic chuck and substrate bonding device equipped therewith
JP2012216691A (en) * 2011-03-31 2012-11-08 Shibaura Mechatronics Corp Stand and plasma processing apparatus
JP2015536568A (en) * 2012-11-02 2015-12-21 インテグリス・インコーポレーテッド Electrostatic chuck with photopatternable soft protrusion contact surface
WO2018017192A1 (en) 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
CN109478529A (en) * 2016-07-22 2019-03-15 应用材料公司 The processing chip of top plate as the Workpiece carrier in semiconductor and mechanical treatment
EP3488465A4 (en) * 2016-07-22 2020-03-18 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
CN109285806B (en) * 2017-07-21 2023-12-19 株式会社迪思科 Method for manufacturing electrostatic chuck plate
CN109285806A (en) * 2017-07-21 2019-01-29 株式会社迪思科 The manufacturing method of electrostatic chuck plate
CN109768008A (en) * 2017-11-10 2019-05-17 Ｓｊ股份有限公司 The manufacturing method and electrostatic chuck of electrostatic chuck
KR102632324B1 (en) * 2023-11-09 2024-02-01 주식회사 이에스티 Multi-layer electrostatic chuck with multi-layer stripping film structure
KR102668954B1 (en) 2023-11-09 2024-05-24 주식회사 이에스티 Multi-layer electrostatic chuck with efficient repair structure
KR102668953B1 (en) * 2023-11-09 2024-05-24 주식회사 이에스티 Electrostatic chuck jig repair method
KR102669549B1 (en) * 2023-11-09 2024-05-27 주식회사 이에스티 Electrostatic chuck jig repair method using stripping film

Also Published As

Publication number Publication date
JPWO2008108146A1 (en) 2010-06-10

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