WO2009035059A1 - Electroconductive film, electroconductive member, and process for producing electroconductive film - Google Patents

Electroconductive film, electroconductive member, and process for producing electroconductive film Download PDF

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Publication number
WO2009035059A1
WO2009035059A1 PCT/JP2008/066467 JP2008066467W WO2009035059A1 WO 2009035059 A1 WO2009035059 A1 WO 2009035059A1 JP 2008066467 W JP2008066467 W JP 2008066467W WO 2009035059 A1 WO2009035059 A1 WO 2009035059A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroconductive
electroconductive film
metallic nanowires
film
producing
Prior art date
Application number
PCT/JP2008/066467
Other languages
French (fr)
Japanese (ja)
Inventor
Takahiro Kitano
Original Assignee
Kuraray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co., Ltd. filed Critical Kuraray Co., Ltd.
Priority to JP2009532227A priority Critical patent/JPWO2009035059A1/en
Publication of WO2009035059A1 publication Critical patent/WO2009035059A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires

Abstract

This invention provides an electroconductive film having a high level of transparency and a low surface resistivity value, and a process for producing the electroconductive film which can produce the electroconductive film under coating conditions of atmospheric pressure and low temperature. The electroconductive film comprises an electroconductive layer comprising linear metallic nanowires which are joined to each other at intersection points to form a network. The joining is preferably carried out by contact bonding or plating. The electroconductive film is produced by coating metallic nanowires onto a base material, and contact bonding intersection points of the coated metallic nanowires or plating the coated metallic nanowires to form an electroconductive layer having lowered contact resistance.
PCT/JP2008/066467 2007-09-12 2008-09-11 Electroconductive film, electroconductive member, and process for producing electroconductive film WO2009035059A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009532227A JPWO2009035059A1 (en) 2007-09-12 2008-09-11 Conductive film, conductive member, and method of manufacturing conductive film

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007236948 2007-09-12
JP2007-236948 2007-09-12
JP2008-076427 2008-03-24
JP2008076427 2008-03-24

Publications (1)

Publication Number Publication Date
WO2009035059A1 true WO2009035059A1 (en) 2009-03-19

Family

ID=40452066

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066467 WO2009035059A1 (en) 2007-09-12 2008-09-11 Electroconductive film, electroconductive member, and process for producing electroconductive film

Country Status (3)

Country Link
JP (1) JPWO2009035059A1 (en)
TW (1) TW200923971A (en)
WO (1) WO2009035059A1 (en)

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WO2013133420A1 (en) 2012-03-09 2013-09-12 昭和電工株式会社 Method for manufacturing transparent conductive pattern
WO2013137018A1 (en) * 2012-03-15 2013-09-19 古河電気工業株式会社 Metal nanonetwork and method for producing same, and conductive film and conductive substrate using metal nanonetwork
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WO2014129504A1 (en) * 2013-02-20 2014-08-28 国立大学法人東京工業大学 Electroconductive nanowire network, and electroconductive substrate and transparent electrode using same, and method for manufacturing electroconductive nanowire network, electroconductive substrate, and transparent electrode
WO2014133890A2 (en) 2013-02-26 2014-09-04 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US20150206623A1 (en) * 2014-01-22 2015-07-23 Nuovo Film, Inc. Method of making merged junction in metal nanowires
JP2016018724A (en) * 2014-07-09 2016-02-01 株式会社クラレ Film, and film formation method
JPWO2015025792A1 (en) * 2013-08-22 2017-03-02 昭和電工株式会社 Transparent electrode and manufacturing method thereof
WO2017155024A1 (en) * 2016-03-11 2017-09-14 昭和電工株式会社 Metal nanowire ink, transparent electroconductive substrate, and transparent antistatic substrate
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
WO2018101334A1 (en) * 2016-12-01 2018-06-07 昭和電工株式会社 Transparent conductive substrate and method for producing same
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
KR20180098372A (en) 2016-03-18 2018-09-03 오사카 유니버시티 Substrate having metal nanowire layer formed thereon and method for manufacturing the same
US10100213B2 (en) 2014-07-31 2018-10-16 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
JP2018166033A (en) * 2017-03-28 2018-10-25 Ｄｏｗａホールディングス株式会社 Silver nanowire ink and method for producing transparent conductive film
CN108983513A (en) * 2018-09-04 2018-12-11 深圳市云记科技有限公司 A kind of conductive film and liquid crystal handwriting pad
JP2019067998A (en) * 2017-10-04 2019-04-25 ユニチカ株式会社 Electric field shield sheet or laminate
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WO2020171022A1 (en) * 2019-02-18 2020-08-27 昭和電工株式会社 Transparent electroconductive substrate, and touch panel including same
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US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
JPWO2022138882A1 (en) * 2020-12-24 2022-06-30
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EP4047622A4 (en) * 2019-10-18 2023-11-15 Resonac Corporation Transparent electroconductive film laminate and method for processing same
US11968787B2 (en) 2018-06-26 2024-04-23 C3 Nano, Inc. Metal nanowire networks and transparent conductive material

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JP2010244747A (en) * 2009-04-02 2010-10-28 Konica Minolta Holdings Inc Transparent electrode, method for manufacturing transparent electrode and organic electroluminescent element
JP2010253813A (en) * 2009-04-24 2010-11-11 Nissha Printing Co Ltd Mat electrically conductive nano-fiber sheet and method of manufacturing the same
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US8962131B2 (en) 2009-07-17 2015-02-24 Carestream Health Inc. Transparent conductive film comprising water soluble binders
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