WO2008108142A1 - 光接続装置 - Google Patents

光接続装置 Download PDF

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Publication number
WO2008108142A1
WO2008108142A1 PCT/JP2008/052298 JP2008052298W WO2008108142A1 WO 2008108142 A1 WO2008108142 A1 WO 2008108142A1 JP 2008052298 W JP2008052298 W JP 2008052298W WO 2008108142 A1 WO2008108142 A1 WO 2008108142A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
signal
modulated signal
unit
transmitting
Prior art date
Application number
PCT/JP2008/052298
Other languages
English (en)
French (fr)
Inventor
Ichiro Ogura
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to US12/528,927 priority Critical patent/US8401390B2/en
Priority to JP2009502488A priority patent/JP5445943B2/ja
Publication of WO2008108142A1 publication Critical patent/WO2008108142A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H04B10/503—Laser transmitters
    • H04B10/505—Laser transmitters using external modulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/516—Details of coding or modulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/67—Optical arrangements in the receiver
    • H04B10/671—Optical arrangements in the receiver for controlling the input optical signal
    • H04B10/675—Optical arrangements in the receiver for controlling the input optical signal for controlling the optical bandwidth of the input signal, e.g. spectral filtering
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04J—MULTIPLEX COMMUNICATION
    • H04J14/00—Optical multiplex systems
    • H04J14/02—Wavelength-division multiplex systems
    • H04J14/03—WDM arrangements
    • H04J14/0305—WDM arrangements in end terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2210/00—Indexing scheme relating to optical transmission systems
    • H04B2210/517—Optical NRZ to RZ conversion, or vice versa

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optical Communication System (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Semiconductor Lasers (AREA)

Abstract

　光接続装置は、複数の伝送チャンネルに対応した複数の波長の光信号を出力する光源と、集積回路が搭載され且つ相互間が単一系統の光線路により接続された光送信部および光受信部と、光線路に挿入され且つ位相変調信号を強度変調信号に変換する信号変換部とを備える。光送信部は、光源からの光信号を伝送チャンネル別に分離する分波器と、集積回路からの信号により動作タイミングが同期される複数の光変調器により分波器からの光信号を位相変調して位相変調信号を生成する光変調部と、光変調部からの位相変調信号を合波し該合波した位相変調信号を光線路を介して信号変換部へ出力する合波器とを有する。光受信部は、信号変換部からの強度変調信号を伝送チャンネル別に分離する分波器と、分波器からの強度変調信号を電気信号に変換する受光部とを有する。
PCT/JP2008/052298 2007-03-06 2008-02-13 光接続装置 WO2008108142A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/528,927 US8401390B2 (en) 2007-03-06 2008-02-13 Optical connecting apparatus
JP2009502488A JP5445943B2 (ja) 2007-03-06 2008-02-13 光接続装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007055831 2007-03-06
JP2007-055831 2007-03-06

Publications (1)

Publication Number Publication Date
WO2008108142A1 true WO2008108142A1 (ja) 2008-09-12

Family

ID=39738039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052298 WO2008108142A1 (ja) 2007-03-06 2008-02-13 光接続装置

Country Status (3)

Country Link
US (1) US8401390B2 (ja)
JP (1) JP5445943B2 (ja)
WO (1) WO2008108142A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018010325A (ja) * 2012-03-16 2018-01-18 ラクステラ・インコーポレイテッドＬｕｘｔｅｒａ，Ｉｎｃ． フォトニクスインターポーザのための方法及びシステム

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6631507B2 (ja) * 2014-03-19 2020-01-15 日本電気株式会社 光送信器、光通信装置、光通信システムおよび光送信方法
US20160204868A1 (en) * 2015-01-13 2016-07-14 Huawei Technologies Co., Ltd. Summation of Parallel Modulated Signals of Different Wavelengths
JP6830790B2 (ja) * 2016-10-26 2021-02-17 技術研究組合光電子融合基盤技術研究所 ネットワークシステム
CN106992817B (zh) * 2017-05-17 2023-08-18 华数传媒网络有限公司 光接收装置及装备
US10756839B1 (en) * 2019-05-09 2020-08-25 Hewlett Packard Enterprise Development Lp Hybrid coarse wavelength division multiplexing (CWDM) transceiver

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000201106A (ja) * 1999-01-05 2000-07-18 Oki Electric Ind Co Ltd 光伝送システム
JP2002031786A (ja) * 2000-07-19 2002-01-31 Nippon Telegr & Teleph Corp <Ntt> コヒーレント多波長信号発生装置
JP2003087201A (ja) * 2001-06-29 2003-03-20 Nippon Telegr & Teleph Corp <Ntt> 光送信器および光伝送システム
JP2004533163A (ja) * 2001-05-10 2004-10-28 富士通株式会社 光リンク上でクロック信号を通信する方法及びシステム
JP2005039493A (ja) * 2003-07-14 2005-02-10 Nec Corp 光受信方法、光受信装置及びこれを用いた光伝送システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3413839B2 (ja) 1991-09-06 2003-06-09 ソニー株式会社 光電子集積回路装置
JPH05333396A (ja) 1992-05-29 1993-12-17 Hitachi Ltd 高次元光素子アレイ及び超並列光インターコネクション
JPH0779212A (ja) 1993-09-06 1995-03-20 Nippon Telegr & Teleph Corp <Ntt> 光波長多重伝送装置
US6124960A (en) * 1997-09-08 2000-09-26 Northern Telecom Limited Transmission system with cross-phase modulation compensation
JP2000059300A (ja) 1998-08-06 2000-02-25 Nippon Telegr & Teleph Corp <Ntt> 光送受信装置
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US7206510B2 (en) * 2001-10-09 2007-04-17 Nippon Telegraph And Telephone Corporation Ring network using multi-wavelength generator
JP3860760B2 (ja) * 2002-02-13 2006-12-20 日本電信電話株式会社 光波長多重リングネットワーク
JP3837358B2 (ja) 2002-04-16 2006-10-25 株式会社東芝 光通信システム
JP3927913B2 (ja) 2003-03-05 2007-06-13 キヤノン株式会社 光電気混載装置、及びその駆動方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000201106A (ja) * 1999-01-05 2000-07-18 Oki Electric Ind Co Ltd 光伝送システム
JP2002031786A (ja) * 2000-07-19 2002-01-31 Nippon Telegr & Teleph Corp <Ntt> コヒーレント多波長信号発生装置
JP2004533163A (ja) * 2001-05-10 2004-10-28 富士通株式会社 光リンク上でクロック信号を通信する方法及びシステム
JP2003087201A (ja) * 2001-06-29 2003-03-20 Nippon Telegr & Teleph Corp <Ntt> 光送信器および光伝送システム
JP2005039493A (ja) * 2003-07-14 2005-02-10 Nec Corp 光受信方法、光受信装置及びこれを用いた光伝送システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018010325A (ja) * 2012-03-16 2018-01-18 ラクステラ・インコーポレイテッドＬｕｘｔｅｒａ，Ｉｎｃ． フォトニクスインターポーザのための方法及びシステム

Also Published As

Publication number Publication date
US8401390B2 (en) 2013-03-19
US20100104289A1 (en) 2010-04-29
JPWO2008108142A1 (ja) 2010-06-10
JP5445943B2 (ja) 2014-03-19

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